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To achieve this, Sony AI is working across six Flagship Projects that are aimed at the evolution and application of AI technology in the areas of AI for Creators, Gaming and Interactive Agents, Ethics, Scientific Discovery, Imaging and Sensing, and Robotics and Sensing. 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Its purpose is to operate for educational, scientific and technical purposes for the benefit of the international electronics design and design automation community. The Association, in the field of design and design automation of electronic circuits and systems, promotes a series of high quality technical international conferences and workshops across Europe and cooperates actively to maintain harmonious relationships with other national and international technical societies and groups promoting the purpose of the Association. EDAA is the main sponsor of DATE, the premier Design, Automation and Test Conference and Exhibition in Europe.\u003C/p>","2025-09-22T13:12:43.375Z","2025-09-22T13:12:45.344Z","2025-09-22T13:12:45.337Z","167",{"id":444,"name":1342,"alternativeText":13,"caption":13,"width":1343,"height":1344,"formats":1345,"hash":1364,"ext":954,"mime":957,"size":1365,"url":1366,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1367,"updatedAt":1367},"EDAA.jpg",992,742,{"small":1346,"medium":1352,"thumbnail":1358},{"ext":954,"url":1347,"hash":1348,"mime":957,"name":1349,"path":13,"size":1350,"width":35,"height":1351},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_EDAA_81b5e0d994.jpg","small_EDAA_81b5e0d994","small_EDAA.jpg",18.3,374,{"ext":954,"url":1353,"hash":1354,"mime":957,"name":1355,"path":13,"size":1356,"width":42,"height":1357},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_EDAA_81b5e0d994.jpg","medium_EDAA_81b5e0d994","medium_EDAA.jpg",30.46,561,{"ext":954,"url":1359,"hash":1360,"mime":957,"name":1361,"path":13,"size":1362,"width":1363,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_EDAA_81b5e0d994.jpg","thumbnail_EDAA_81b5e0d994","thumbnail_EDAA.jpg",6.19,209,"EDAA_81b5e0d994",42.3,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/EDAA_81b5e0d994.jpg","2025-09-22T13:12:27.165Z",{"id":1154,"variation":58,"button":1369},[1370],{"id":1371,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1372,"newWindow":8,"downloadable":13,"shape":13},75,"https://www.edaa.com","-121",{"id":181,"name":1045,"description":76,"createdAt":1375,"updatedAt":1376,"publishedAt":1377,"url_path_id":1378,"logo":1379,"website":1382,"url_path":1386},"2025-10-14T15:00:30.165Z","2025-10-14T15:00:49.087Z","2025-10-14T15:00:49.081Z","177",{"id":849,"name":1052,"alternativeText":13,"caption":13,"width":35,"height":1053,"formats":1380,"hash":1061,"ext":22,"mime":25,"size":1062,"url":1063,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1064,"updatedAt":1064},{"thumbnail":1381},{"ext":22,"url":1056,"hash":1057,"mime":25,"name":1058,"path":13,"size":1059,"width":105,"height":1060},{"id":1079,"variation":58,"button":1383},[1384],{"id":1385,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1069,"newWindow":8,"downloadable":13,"shape":13},76,"-129",{"id":397,"name":1243,"description":1388,"createdAt":1389,"updatedAt":1390,"publishedAt":1391,"url_path_id":1392,"logo":1393,"website":1399,"url_path":1403},"\u003Cp>Current Listing: https://ai.sony/joinus/job-roles/Research_Scientist%E2%80%93AI_for_Digital_Circuit_Design/\u003C/p>","2025-10-14T15:01:04.378Z","2025-10-27T14:05:40.570Z","2025-10-14T15:01:15.683Z","178",{"id":384,"name":1250,"alternativeText":13,"caption":13,"width":1251,"height":1252,"formats":1394,"hash":1277,"ext":22,"mime":25,"size":1278,"url":1279,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1280,"updatedAt":1280},{"large":1395,"small":1396,"medium":1397,"thumbnail":1398},{"ext":22,"url":1255,"hash":1256,"mime":25,"name":1257,"path":13,"size":1258,"width":28,"height":1259},{"ext":22,"url":1261,"hash":1262,"mime":25,"name":1263,"path":13,"size":1264,"width":35,"height":1265},{"ext":22,"url":1267,"hash":1268,"mime":25,"name":1269,"path":13,"size":1270,"width":42,"height":1271},{"ext":22,"url":1273,"hash":1274,"mime":25,"name":1275,"path":13,"size":1276,"width":105,"height":849},{"id":1239,"variation":58,"button":1400},[1401],{"id":1402,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1285,"newWindow":8,"downloadable":13,"shape":13},77,"-130",{"id":418,"name":1405,"description":76,"createdAt":1406,"updatedAt":1407,"publishedAt":1408,"url_path_id":1409,"logo":1410,"website":1441,"url_path":1445},"NVIDIA","2025-10-14T15:02:48.706Z","2025-10-14T15:03:03.820Z","2025-10-14T15:02:50.262Z","179",{"id":1265,"name":1411,"alternativeText":13,"caption":13,"width":1412,"height":1413,"formats":1414,"hash":1437,"ext":22,"mime":25,"size":1438,"url":1439,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1440,"updatedAt":1440},"NVIDIA_logo.svg.png",2560,469,{"large":1415,"small":1421,"medium":1426,"thumbnail":1432},{"ext":22,"url":1416,"hash":1417,"mime":25,"name":1418,"path":13,"size":1419,"width":28,"height":1420},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_NVIDIA_logo_svg_1ae5067cd9.png","large_NVIDIA_logo_svg_1ae5067cd9","large_NVIDIA_logo.svg.png",32.11,183,{"ext":22,"url":1422,"hash":1423,"mime":25,"name":1424,"path":13,"size":1425,"width":35,"height":346},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_NVIDIA_logo_svg_1ae5067cd9.png","small_NVIDIA_logo_svg_1ae5067cd9","small_NVIDIA_logo.svg.png",14.26,{"ext":22,"url":1427,"hash":1428,"mime":25,"name":1429,"path":13,"size":1430,"width":42,"height":1431},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_NVIDIA_logo_svg_1ae5067cd9.png","medium_NVIDIA_logo_svg_1ae5067cd9","medium_NVIDIA_logo.svg.png",21.56,137,{"ext":22,"url":1433,"hash":1434,"mime":25,"name":1435,"path":13,"size":1436,"width":105,"height":452},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_NVIDIA_logo_svg_1ae5067cd9.png","thumbnail_NVIDIA_logo_svg_1ae5067cd9","thumbnail_NVIDIA_logo.svg.png",6.37,"NVIDIA_logo_svg_1ae5067cd9",18.15,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/NVIDIA_logo_svg_1ae5067cd9.png","2025-10-14T15:02:18.862Z",{"id":1284,"variation":58,"button":1442},[1443],{"id":1117,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1444,"newWindow":8,"downloadable":13,"shape":13},"https://www.nvidia.com/en-us/","-131",{"id":288,"name":1447,"description":1448,"createdAt":1449,"updatedAt":1450,"publishedAt":1451,"url_path_id":1452,"logo":1453,"website":1486,"url_path":1490},"IBM","\u003Cp style=\"text-align:justify;\">Our dynamic global team is looking to enlist enthusiastic professionals to join world-class hardware design teams responsible for developing the most challenging and complex systems in the world. We are seeking energetic, highly-motivated individuals willing to go the extra mile with the aim of helping the overall IBM development team. Strong interpersonal skills are needed to coordinate deliverables and requirements from several areas within and outside of the organization.  There are many opportunities to gain and utilize a deep understanding of future issues and provide input towards decisions affecting system development, logical and physical design as well as sophisticated methodology directions.\u003C/p>\u003Cp style=\"text-align:justify;\"> \u003C/p>\u003Cp style=\"text-align:justify;\">Individuals who are chosen to become a part of our world class development teams will be helping advance IBM’s leadership in developing the highest performing computers and changing hardware solutions. Do you want to be an IBMer? \u003Cstrong>Come THINK with us! \u003C/strong>\u003C/p>\u003Cp style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:black;\">\u003Cstrong>All interested students can apply at:  \u003C/strong>\u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://www.ibm.com/careers__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuiv13ExN$\">\u003Cspan style=\"color:black;\">\u003Cstrong>https://www.ibm.com/careers\u003C/strong>\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 55016:       \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=55106__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYut81G66h$\">\u003Cspan style=\"color:black;\">Hardware Developer Intern: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 54841:       \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=54841__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYum4MKv3W$\">\u003Cspan style=\"color:black;\">Entry Level Hardware Developer: 2026  \u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 57950:       \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=57950__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuiwa32YB$\">\u003Cspan style=\"color:black;\">Software Engineer Intern: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 57952:       \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=57952__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYup28ftX9$\">\u003Cspan style=\"color:black;\">Entry Level Software Engineer: 2026   \u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\"> \u003C/span>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 49799:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=49799__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYupH2q6oL$\">\u003Cspan style=\"color:black;\">System and Board Design Engineer: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 64045:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=64045__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYupGbBg3j$\">\u003Cspan style=\"color:black;\">Chip & Hardware Test Technician: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 54047:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=54047__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuqt8MU7J$\">\u003Cspan style=\"color:black;\">Linux System Performance Architect: 2026\u003C/span>\u003C/a>\u003C/p>","2025-10-21T13:17:29.423Z","2025-10-25T08:26:00.917Z","2025-10-21T13:17:31.401Z","186",{"id":1454,"name":1455,"alternativeText":13,"caption":13,"width":1456,"height":1457,"formats":1458,"hash":1482,"ext":954,"mime":957,"size":1483,"url":1484,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1485,"updatedAt":1485},136,"IBM_logo_in.jpg",1783,1265,{"large":1459,"small":1465,"medium":1470,"thumbnail":1476},{"ext":954,"url":1460,"hash":1461,"mime":957,"name":1462,"path":13,"size":1463,"width":28,"height":1464},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_IBM_logo_in_e1412f8354.jpg","large_IBM_logo_in_e1412f8354","large_IBM_logo_in.jpg",32.82,709,{"ext":954,"url":1466,"hash":1467,"mime":957,"name":1468,"path":13,"size":986,"width":35,"height":1469},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_IBM_logo_in_e1412f8354.jpg","small_IBM_logo_in_e1412f8354","small_IBM_logo_in.jpg",355,{"ext":954,"url":1471,"hash":1472,"mime":957,"name":1473,"path":13,"size":1474,"width":42,"height":1475},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_IBM_logo_in_e1412f8354.jpg","medium_IBM_logo_in_e1412f8354","medium_IBM_logo_in.jpg",23.57,532,{"ext":954,"url":1477,"hash":1478,"mime":957,"name":1479,"path":13,"size":1480,"width":1481,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_IBM_logo_in_e1412f8354.jpg","thumbnail_IBM_logo_in_e1412f8354","thumbnail_IBM_logo_in.jpg",5.62,220,"IBM_logo_in_e1412f8354",56.55,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/IBM_logo_in_e1412f8354.jpg","2025-10-21T13:17:23.428Z",{"id":106,"variation":58,"button":1487},[1488],{"id":1165,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1489,"newWindow":8,"downloadable":13,"shape":13},"https://www.ibm.com/us-en","-138",{"id":578,"name":1492,"description":1493,"createdAt":1494,"updatedAt":1495,"publishedAt":1496,"url_path_id":1497,"logo":1498,"website":1529,"url_path":1534},"imec","\u003Cul>\u003Cli>Pathfinding Co-Optimization for Technology and Systems (PACTS):\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/physical-design-researcher\">Physical Design Researcher\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/team-lead-and-test-chip-architect\">ASIC Test Chip Physical Design Architect\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/power-and-thermal-integrity-researcher\">Power and Thermal Integrity Researcher\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/dtco-layout-rd-engineer\">DTCO Layout R&D Engineer\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/digital-systems-researcher-emerging-memory-technologies\">Digital Systems Researcher in Emerging Memory Technologies\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/researcher-3d-emerging-memories-dramferroigzo-2t0c\">Researcher in 3D Emerging Memories (DRAM/Ferro/IGZO 2T0C)\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/compact-modelling-engineer\">Compact Modelling Engineer\u003C/a>\u003C/li>\u003C/ul>\u003C/li>\u003Cli>Compute Systems Architectures (CSA):\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/soc-designer-architect\">SoC Designer/ Architect\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/principal-ai-high-performance-computing-architect\">AI + HPC hardware performance researcher\u003C/a>\u003C/li>\u003C/ul>\u003C/li>\u003C/ul>\u003Cp style=\"margin-left:15px;\">\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities?type=academic&filters%5B0%5D=%2Fjob_employment_type%2Fphd\">Interested in a PhD at imec? Please check out the PhD opportunities here!\u003C/a>\u003C/p>","2025-10-21T13:18:36.674Z","2025-10-21T15:25:14.744Z","2025-10-21T13:18:39.994Z","187",{"id":1431,"name":1499,"alternativeText":13,"caption":13,"width":1412,"height":1500,"formats":1501,"hash":1525,"ext":22,"mime":25,"size":1526,"url":1527,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1528,"updatedAt":1528},"LOGO-IMEC_black.svg.png",1281,{"large":1502,"small":1507,"medium":1513,"thumbnail":1519},{"ext":22,"url":1503,"hash":1504,"mime":25,"name":1505,"path":13,"size":1506,"width":28,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_LOGO_IMEC_black_svg_04c5c3f74a.png","large_LOGO_IMEC_black_svg_04c5c3f74a","large_LOGO-IMEC_black.svg.png",19.55,{"ext":22,"url":1508,"hash":1509,"mime":25,"name":1510,"path":13,"size":1511,"width":35,"height":1512},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_LOGO_IMEC_black_svg_04c5c3f74a.png","small_LOGO_IMEC_black_svg_04c5c3f74a","small_LOGO-IMEC_black.svg.png",8.83,250,{"ext":22,"url":1514,"hash":1515,"mime":25,"name":1516,"path":13,"size":1517,"width":42,"height":1518},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_LOGO_IMEC_black_svg_04c5c3f74a.png","medium_LOGO_IMEC_black_svg_04c5c3f74a","medium_LOGO-IMEC_black.svg.png",13.43,375,{"ext":22,"url":1520,"hash":1521,"mime":25,"name":1522,"path":13,"size":1523,"width":105,"height":1524},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_LOGO_IMEC_black_svg_04c5c3f74a.png","thumbnail_LOGO_IMEC_black_svg_04c5c3f74a","thumbnail_LOGO-IMEC_black.svg.png",4.32,123,"LOGO_IMEC_black_svg_04c5c3f74a",12.04,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/LOGO_IMEC_black_svg_04c5c3f74a.png","2025-10-21T13:18:30.374Z",{"id":1530,"variation":58,"button":1531},73,[1532],{"id":1203,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1533,"newWindow":8,"downloadable":13,"shape":13},"https://www.imec-int.com/en/work-at-imec/job-opportunities?type=career&filters%5B0%5D=%2Fjob_region%2Fbelgium&filters%5B1%5D=%2Fjob_region%2Fcambridge-uk&filters%5B2%5D=%2Fjob_region%2Fgermany&filters%5B3%5D=%2Fjob_employment_type%2Fpermanent-contract","-139",{"id":236,"name":1536,"description":76,"createdAt":1537,"updatedAt":1538,"publishedAt":1539,"url_path_id":1540,"logo":1541,"website":1556,"url_path":1561},"Peking University","2025-10-27T12:31:39.034Z","2025-10-27T12:31:40.885Z","2025-10-27T12:31:40.874Z","196",{"id":1542,"name":1543,"alternativeText":13,"caption":13,"width":1544,"height":1545,"formats":1546,"hash":1552,"ext":954,"mime":957,"size":1553,"url":1554,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1555,"updatedAt":1555},143,"images.jpg",300,168,{"thumbnail":1547},{"ext":954,"url":1548,"hash":1549,"mime":957,"name":1550,"path":13,"size":1551,"width":105,"height":1431},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_images_1d87fa6eb4.jpg","thumbnail_images_1d87fa6eb4","thumbnail_images.jpg",6.48,"images_1d87fa6eb4",8.42,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/images_1d87fa6eb4.jpg","2025-10-27T12:31:24.079Z",{"id":1331,"variation":58,"button":1557},[1558],{"id":1559,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1560,"newWindow":8,"downloadable":13,"shape":13},81,"https://english.pku.edu.cn/","-147",{"id":256,"name":1288,"description":1563,"createdAt":1564,"updatedAt":1565,"publishedAt":1566,"url_path_id":1567,"logo":1568,"website":1574,"url_path":1577},"\u003Cp>Current Listings: \u003C/p>\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://confcats-event-sessions.s3.us-east-1.amazonaws.com/iccad25/uploads/EDA-Router.pdf\">EDA-Router\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://confcats-event-sessions.s3.us-east-1.amazonaws.com/iccad25/uploads/EDA-Timing.pdf\">EDA-Timing\u003C/a>\u003C/li>\u003C/ul>","2025-10-27T12:37:12.998Z","2025-10-27T12:41:59.179Z","2025-10-27T12:41:59.171Z","197",{"id":565,"name":1295,"alternativeText":13,"caption":13,"width":1296,"height":1297,"formats":1569,"hash":1323,"ext":954,"mime":957,"size":1324,"url":1325,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1326,"updatedAt":1326},{"large":1570,"small":1571,"medium":1572,"thumbnail":1573},{"ext":954,"url":1300,"hash":1301,"mime":957,"name":1302,"path":13,"size":1303,"width":28,"height":1304},{"ext":954,"url":1306,"hash":1307,"mime":957,"name":1308,"path":13,"size":1309,"width":35,"height":1310},{"ext":954,"url":1312,"hash":1313,"mime":957,"name":1314,"path":13,"size":1315,"width":42,"height":1316},{"ext":954,"url":1318,"hash":1319,"mime":957,"name":1320,"path":13,"size":1321,"width":105,"height":1322},{"id":1371,"variation":58,"button":1575},[1576],{"id":384,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1332,"newWindow":8,"downloadable":13,"shape":13},"-148",{"id":373,"name":1158,"description":1579,"createdAt":1580,"updatedAt":1581,"publishedAt":1582,"url_path_id":1583,"logo":1584,"website":1589,"url_path":1592},"\u003Col>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/PhD-Candidate-in-Functional-Safety-for-AI-Accelerators---Contract-Duration-3-Years--f-m-d-_R50111__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbzvEYM8EA$\">Ph.D. Candidate in Functional Safety for AI Accelerators - Contract Duration 3 Years (f/m/d), Munich - Germany\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/Lead-Application-Engineer_R50649-1__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbyfv2PFvw$\">Lead Application Engineer, Munich - Germany\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/Sr-Application-Engineer--f-m-d-_R51515__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbwEgEx6AQ$\">Sr. Application Engineer (f/m/d), Munich - Germany\u003C/a>\u003C/li>\u003C/ol>","2025-10-28T09:19:43.567Z","2025-10-29T07:09:08.732Z","2025-10-28T09:19:58.006Z","198",{"id":1165,"name":1166,"alternativeText":13,"caption":13,"width":1167,"height":1168,"formats":1585,"hash":1186,"ext":22,"mime":25,"size":1187,"url":1188,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1189,"updatedAt":1189},{"small":1586,"medium":1587,"thumbnail":1588},{"ext":22,"url":1171,"hash":1172,"mime":25,"name":1173,"path":13,"size":1174,"width":35,"height":584},{"ext":22,"url":1176,"hash":1177,"mime":25,"name":1178,"path":13,"size":1179,"width":42,"height":1180},{"ext":22,"url":1182,"hash":1183,"mime":25,"name":1184,"path":13,"size":1185,"width":105,"height":143},{"id":1385,"variation":58,"button":1590},[1591],{"id":404,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1193,"newWindow":8,"downloadable":13,"shape":13},"-149",{"pagination":1594},{"page":5,"pageSize":373,"pageCount":69,"total":320},{"id":136,"heading":130,"pageHeader":1596,"sections":1598},{"id":136,"description":1597,"showPageHeader":8,"backgroundColor":81,"image":13},"Meet the IEEE/ACM ICCAD 2025 Executive Committee, advancing the field with expert leadership, event planning, and fostering professional connections.",[1599],{"id":5,"__component":1600,"componentVariation":1601,"styles":13,"header":13,"contactGroup":1602},"content.contacts","Contacts Flex Card Image Cover",[1603],{"id":57,"groupTitle":13,"contacts":1604},[1605,1649,1682,1707,1722,1758,1782,1798,1830,1846,1869],{"id":57,"contact":1606},{"id":5,"name":1607,"committee":1608,"position":13,"affiliation":1609,"email":13,"biography":1610,"createdAt":1611,"updatedAt":1612,"url_path_id":1613,"contactPhoto":1614,"socialLinks":1647,"url_path":1648},"Robert Wille","General Chair","Technical University of Munich & Software Competence Center Hagenberg GmbH","\u003Cp style=\"text-align:justify;\">Robert Wille is a Full and Distinguished Professor at the Technical University of Munich, Germany, and Chief Scientific Officer at the Software Competence Center Hagenberg GmbH, Austria.\u003C/p>\u003Cp style=\"text-align:justify;\">From 2002 to 2006, Robert Wille studied Computer Science (Diploma) at the University of Bremen. After successfully completing his doctorate in 2009 (summa cum laude), he worked as postdoc at the University of Bremen and, since 2013, as Senior Researcher in the Cyber-Physical Systems department of the German Research Center for Artificial Intelligence ( DFKI). Besides that, he served as lecturer at the University of Applied Science Bremen from 2010 to 2012 and was guest professor at the University of Potsdam in 2012 as well as the Technical University of Dresden in 2013/2014. From 2015 to 2022, he was Full Professor at the Johannes Kepler University Linz and head of the Institute for Integrated Circuits (at the age of 32 and as one of the youngest full professors in the field). In 2019, he founded the LIT Secure and Correct Systems Lab at JKU and, in 2020, he additionally became Chief Scientific Officer at the Software Competence Center Hagenberg GmbH. Since 2022, he works in Munich—appointed through a “Leuchtturm”-procedure (i.e., direct appointment) and, additionally, through the “Distinguished Professorship”-program.\u003C/p>\u003Cp style=\"text-align:justify;\">Robert Wille’s expertise covers a broad spectrum of topics with a particular focus on the development of automatic methods for the design, simulation, verification, and test of complex systems in hard- and software. He considers conventional technologies (from formal specifications to the realization) as well as future technologies (including quantum computing, microfluidic biochips, field-coupled nanotechnologies, optical circuits, memristors, reversible circuits, and adiabatic circuits). Besides that, he frequently applies his expertise to complementary fields in cooperation with groups from other areas of Computer Science (e.g., Machine Learning, Software Development, Theoretical Computer Science, Database Systems, Operation Systems, and more) as well as Mechatronics and Electrical Engineering. Furthermore, his work on future technologies frequently exposes him to topics from physics, biology, chemistry, and optics. Also projects with legal sciences are within his portfolio.\u003C/p>\u003Cp style=\"text-align:justify;\">Since 2007, Robert Wille published more than 400 journal and conference papers in this area and was repeatedly awarded ( e.g., with Best Paper Awards, e.g., at TCAD and ICCAD, an ERC Consolidator Grant, a Distinguished Professor appointment, a Google Research Award, and more). Besides that, he served as Associate Editor and Guest Editor for various renowned journals such as the IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems (TCAD), the ACM Journal on Emerging Technologies in Computing Systems (JETC), or Springer’s Lecture Notes in Computer Science (LNCS). Additionally, he was General Chair and PC Chair for several conferences, is Executive Committee Member for DATE and ICCAD, served in numerous Program Committees, and organized several tutorials, seminars, workshops, and special sessions.\u003C/p>","2025-01-03T07:42:15.820Z","2025-01-03T13:36:23.867Z","44",{"id":181,"name":1615,"alternativeText":13,"caption":13,"width":1616,"height":1617,"formats":1618,"hash":1643,"ext":954,"mime":957,"size":1644,"url":1645,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1646,"updatedAt":1646},"Robert_Wille.jpg",1064,1054,{"large":1619,"small":1625,"medium":1631,"thumbnail":1637},{"ext":954,"url":1620,"hash":1621,"mime":957,"name":1622,"path":13,"size":1623,"width":28,"height":1624},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_Robert_Wille_91febc32e7.jpg","large_Robert_Wille_91febc32e7","large_Robert_Wille.jpg",71.63,991,{"ext":954,"url":1626,"hash":1627,"mime":957,"name":1628,"path":13,"size":1629,"width":35,"height":1630},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Robert_Wille_91febc32e7.jpg","small_Robert_Wille_91febc32e7","small_Robert_Wille.jpg",21.51,495,{"ext":954,"url":1632,"hash":1633,"mime":957,"name":1634,"path":13,"size":1635,"width":42,"height":1636},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_Robert_Wille_91febc32e7.jpg","medium_Robert_Wille_91febc32e7","medium_Robert_Wille.jpg",44.01,743,{"ext":954,"url":1638,"hash":1639,"mime":957,"name":1640,"path":13,"size":1641,"width":1642,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Robert_Wille_91febc32e7.jpg","thumbnail_Robert_Wille_91febc32e7","thumbnail_Robert_Wille.jpg",3.42,158,"Robert_Wille_91febc32e7",79.92,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Robert_Wille_91febc32e7.jpg","2025-01-03T07:46:48.897Z",[],"-21",{"id":151,"contact":1650},{"id":57,"name":1651,"committee":1652,"position":13,"affiliation":1653,"email":13,"biography":1654,"createdAt":1655,"updatedAt":1656,"url_path_id":1657,"contactPhoto":1658,"socialLinks":1680,"url_path":1681},"Jinjun Xiong","Past Chair/ Treasurer","University at Buffalo","\u003Cp style=\"text-align:justify;\">Dr. Jinjun Xiong is currently Empire Innovation Professor with the Department of Computer Science and Engineering at University at Buffalo (UB). He also serves as the Scientific Director and Co-Director for the $20 M National AI Institute for Exceptional Education (http://ai4exceptionaled.org), and Director for the SUNY-UB Institute for Artificial Intelligence and Data Science (https://www.buffalo.edu/ai-data-science.html). Prior to that, he was a Senior Researcher and Program Director for AI and Hybrid Clouds Systems at the IBM Thomas J. Watson Research Center. He was the former co-founder and co-director for the IBM-Illinois Center for Cognitive Computing Systems Research (C3SR), the success of which in 5 years has led to the 10-year $200M expansion of the center to the IBM-Illinois Discovery Accelerator Institute. His research interests are on across-stack AI systems research, including AI applications, algorithms, tooling and computer architectures.  Many of his research results have been adopted in IBM’s products and tools. He published more than 160 peer-reviewed papers in top AI conferences and systems conferences. His publication won 8 Best Paper Awards and 9 Nominations for Best Paper Awards. He also won top awards from various international competitions, including the championship award for the IEEE GraphChallenge on accelerating sparse neural networks in 2020, and the First Place Awards for the 2019 DAC Systems Design Contest on designing an object detection neural network for edge FPGA and GPU devices, respectively.\u003C/p>","2025-01-03T13:30:12.584Z","2025-01-03T13:33:04.676Z","49",{"id":288,"name":1659,"alternativeText":13,"caption":13,"width":28,"height":28,"formats":1660,"hash":1676,"ext":22,"mime":25,"size":1677,"url":1678,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1679,"updatedAt":1679},"Jinjun Xiong.png",{"small":1661,"medium":1666,"thumbnail":1671},{"ext":22,"url":1662,"hash":1663,"mime":25,"name":1664,"path":13,"size":1665,"width":35,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Jinjun_Xiong_4937ae85ba.png","small_Jinjun_Xiong_4937ae85ba","small_Jinjun Xiong.png",544.84,{"ext":22,"url":1667,"hash":1668,"mime":25,"name":1669,"path":13,"size":1670,"width":42,"height":42},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_Jinjun_Xiong_4937ae85ba.png","medium_Jinjun_Xiong_4937ae85ba","medium_Jinjun Xiong.png",1184.79,{"ext":22,"url":1672,"hash":1673,"mime":25,"name":1674,"path":13,"size":1675,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Jinjun_Xiong_4937ae85ba.png","thumbnail_Jinjun_Xiong_4937ae85ba","thumbnail_Jinjun Xiong.png",66.1,"Jinjun_Xiong_4937ae85ba",410.91,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Jinjun_Xiong_4937ae85ba.png","2025-01-03T13:30:06.319Z",[],"-25",{"id":170,"contact":1683},{"id":69,"name":1684,"committee":1685,"position":13,"affiliation":1686,"email":13,"biography":1687,"createdAt":1688,"updatedAt":1689,"url_path_id":1690,"contactPhoto":1691,"socialLinks":1705,"url_path":1706},"Deming Chen","Program Chair","University of Illinois","\u003Cp style=\"text-align:justify;\">Dr. Deming Chen obtained his BS in computer science from University of Pittsburgh, Pennsylvania in 1995, and his MS and PhD in computer science from University of California at Los Angeles in 2001 and 2005 respectively. He worked as a software engineer between 1995-1999 and 2001-2002. He joined the ECE department of University of Illinois at Urbana-Champaign in 2005 and has been a full professor in the same department since 2015. He is a research professor in the Coordinated Science Laboratory and an affiliate professor in the CS department. His current research interests include reconfigurable computing, cloud computing, system-level and high-level synthesis, machine learning and IoT, and hardware security. He has given more than 150 invited talks sharing these research results worldwide.\u003C/p>\u003Cp style=\"text-align:justify;\">Dr. Chen has been a technical committee member for a series of top conferences and symposia on EDA, FPGA, low-power design, and embedded systems design. He has also served as General or TPC Chair, Track Chair, Session Chair, Panelist, Panel Organizer, or Moderator for many of these conferences. He has been an associated editor for IEEE TCAD, ACM TODAES, IEEE TVLSI, ACM TRETS, IEEE TCAS-I and TCAS-II, IEEE Design & Test, IET Cyber-Physical Systems, JCSC, and JOLPE. He obtained the Achievement Award for Excellent Teamwork from Aplus Design Technologies in 2001, the Arnold O. Beckman Research Award from UIUC in 2007, the NSF CAREER Award in 2008, ten Best Paper Awards, a TCFPGA Hall-of-Fame paper award, and a few Best Poster Awards. He also received the ACM SIGDA Outstanding New Faculty Award in 2010, IBM Faculty Award in 2014 and 2015, and Google Faculty Award in 2020. In 2017 and 2019 respectively, he led a team to win the First Place Winner Award of DAC International System Design Contest. He is the Donald Willett Faculty Scholar and the Abel Bliss Professor of the Grainger College of Engineering, an IEEE Fellow, an ACM Distinguished Speaker, and the Editor-in-Chief of ACM Transactions on Reconfigurable Technology and Systems (TRETS). He is the Director of the AMD-Xilinx Center of Excellence and the Hybrid Cloud Thrust Co-lead in the IBM-Illinois Discovery Accelerator Institute. He has given a series of Keynote or Plenary speeches at various conferences. He is also included in the List of Teachers Ranked as Excellent in 2008 and 2017 from UIUC.\u003C/p>\u003Cp style=\"text-align:justify;\">Dr. Chen was involved in several startup companies. He implemented his published algorithm on CPLD technology mapping when he was a software engineer in Aplus Design Technologies, Inc. in 2001, and the software was exclusively licensed by Altera (now part of Intel) and distributed to many customers of Altera worldwide. He is one of the inventors of the xPilot High Level Synthesis package developed at UCLA, which was licensed to AutoESL Design Technologies, Inc. Aplus was acquired by Magma in 2003, and AutoESL was acquired by Xilinx in 2011. In 2016, he co-founded a new startup, Inspirit IoT, Inc.\u003C/p>","2025-01-03T07:42:52.051Z","2025-01-03T13:36:17.908Z","45",{"id":603,"name":1692,"alternativeText":13,"caption":13,"width":1693,"height":1694,"formats":1695,"hash":1701,"ext":22,"mime":25,"size":1702,"url":1703,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1704,"updatedAt":1704},"DemingChen.png",256,251,{"thumbnail":1696},{"ext":22,"url":1697,"hash":1698,"mime":25,"name":1699,"path":13,"size":1700,"width":1168,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Deming_Chen_7b240cc0a0.png","thumbnail_Deming_Chen_7b240cc0a0","thumbnail_DemingChen.png",55.02,"Deming_Chen_7b240cc0a0",25.3,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Deming_Chen_7b240cc0a0.png","2025-01-03T07:46:48.798Z",[],"-22",{"id":112,"contact":1708},{"id":170,"name":1709,"committee":1710,"position":13,"affiliation":1288,"email":13,"biography":76,"createdAt":1711,"updatedAt":1711,"url_path_id":1712,"contactPhoto":1713,"socialLinks":1720,"url_path":1721},"Ismail S. K. Bustany","Vice Program Chair","2025-01-03T13:30:49.362Z","50",{"id":578,"name":1714,"alternativeText":13,"caption":13,"width":1715,"height":50,"formats":13,"hash":1716,"ext":954,"mime":957,"size":1717,"url":1718,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1719,"updatedAt":1719},"Ismail S. K. Bustany.jpg",115,"Ismail_S_K_Bustany_03c05c877c",3.07,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Ismail_S_K_Bustany_03c05c877c.jpg","2025-01-03T13:30:46.475Z",[],"-26",{"id":115,"contact":1723},{"id":151,"name":1724,"committee":1725,"position":13,"affiliation":1726,"email":13,"biography":1727,"createdAt":1728,"updatedAt":1728,"url_path_id":1729,"contactPhoto":1730,"socialLinks":1756,"url_path":1757},"Tsung-Yi Ho","Tutorial & Special Session Chair","The Chinese University of Hong Kong","\u003Cp style=\"text-align:justify;\">Tsung-Yi Ho is a Professor in the Department of Computer Science and Engineering, the Chinese University of Hong Kong (CUHK). He received his Ph.D. in Electrical Engineering from National Taiwan University in 2005. His research interests include several areas of computing and emerging technologies, especially in design automation of microfluidic biochips. He has been the recipient of the Invitational Fellowship of the Japan Society for the Promotion of Science (JSPS), the Humboldt Research Fellowship by the Alexander von Humboldt Foundation, the Hans Fischer Fellowship by the Institute of Advanced Study of the Technische Universität München, and the International Visiting Research Scholarship by the Peter Wall Institute of Advanced Study of the University of British Columbia. He was a recipient of the Best Paper Awards at the VLSI Test Symposium (VTS) in 2013 and IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems in 2015. He served as an ACM Distinguished Speaker for 2014-2020, a Distinguished Visitor of the IEEE Computer Society for 2013-2015, a Distinguished Lecturer of the IEEE Circuits and Systems Society for 2016-2017, the Chair of the IEEE Computer Society Tainan Chapter for 2013-2015, the Chair of the ACM SIGDA Taiwan Chapter for 2014-2015, the Secretary General of the IEEE Taipei Section for 2019-2020, and the VP Technical Activities of the IEEE CEDA for 2020-2023. Currently, he serves as the VP Conferences of IEEE CEDA, and the Executive Committee of ASP-DAC and ICCAD. He is a Distinguished Member of ACM and a Fellow of IEEE.\u003C/p>","2025-01-03T13:31:35.857Z","51",{"id":236,"name":1731,"alternativeText":13,"caption":13,"width":28,"height":1732,"formats":1733,"hash":1752,"ext":22,"mime":25,"size":1753,"url":1754,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1755,"updatedAt":1755},"Tsung-Yi Ho.png",994,{"small":1734,"medium":1740,"thumbnail":1746},{"ext":22,"url":1735,"hash":1736,"mime":25,"name":1737,"path":13,"size":1738,"width":35,"height":1739},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Tsung_Yi_Ho_040c077778.png","small_Tsung_Yi_Ho_040c077778","small_Tsung-Yi Ho.png",321.02,497,{"ext":22,"url":1741,"hash":1742,"mime":25,"name":1743,"path":13,"size":1744,"width":42,"height":1745},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_Tsung_Yi_Ho_040c077778.png","medium_Tsung_Yi_Ho_040c077778","medium_Tsung-Yi Ho.png",690.35,746,{"ext":22,"url":1747,"hash":1748,"mime":25,"name":1749,"path":13,"size":1750,"width":1751,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Tsung_Yi_Ho_040c077778.png","thumbnail_Tsung_Yi_Ho_040c077778","thumbnail_Tsung-Yi Ho.png",39.72,157,"Tsung_Yi_Ho_040c077778",280.07,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Tsung_Yi_Ho_040c077778.png","2025-01-03T13:31:30.088Z",[],"-27",{"id":193,"contact":1759},{"id":157,"name":1760,"committee":1761,"position":13,"affiliation":1045,"email":13,"biography":76,"createdAt":1762,"updatedAt":1763,"url_path_id":1764,"contactPhoto":1765,"socialLinks":1778,"url_path":1781},"Ron Duncan","Workshop Chair","2025-02-24T19:37:43.891Z","2025-02-24T19:38:42.343Z","62",{"id":300,"name":1766,"alternativeText":13,"caption":13,"width":1767,"height":1767,"formats":1768,"hash":1774,"ext":954,"mime":957,"size":1775,"url":1776,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1777,"updatedAt":1777},"1677699792781.jpg",200,{"thumbnail":1769},{"ext":954,"url":1770,"hash":1771,"mime":957,"name":1772,"path":13,"size":1773,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_1677699792781_a4dd961498.jpg","thumbnail_1677699792781_a4dd961498","thumbnail_1677699792781.jpg",5.45,"1677699792781_a4dd961498",8.07,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/1677699792781_a4dd961498.jpg","2025-02-24T19:37:22.456Z",[1779],{"id":5,"url":1780,"platform":71},"https://www.linkedin.com/in/ronduncan/","-35",{"id":79,"contact":1783},{"id":112,"name":1784,"committee":1785,"position":13,"affiliation":1786,"email":13,"biography":1787,"createdAt":1788,"updatedAt":1788,"url_path_id":1789,"contactPhoto":1790,"socialLinks":1796,"url_path":1797},"Jiang Hu","CEDA Representative","Texas A&M University","\u003Cp style=\"text-align:justify;\">Jiang Hu is a professor in the Department of Electrical and Computer Engineering at Texas A&M University. His research interests include EDA, machine learning applications, approximate computing and hardware security. He has co-authored more than 260 technical papers, co-invented 10 patents and co-edited a book. He received best paper awards at DAC 2001, ICCAD 2011, IEEE International Conference on Vehicular Electronics and Safety 2018, MICRO 2021 and ASPDAC 2023. He served as the technical program chair and general chair of the ACM International Symposium on Physical Design in 2011 and 2012, respectively. He was named an IEEE fellow in 2016. He was the technical program co-chair of the ACM/IEEE Workshop on Machine Learning for CAD 2023 and its general co-chair in 2024. Currently, he is the Editor-in-Chief of the ACM Transactions on Design Automation of Electronic Systems.\u003C/p>","2025-01-03T13:32:13.339Z","52",{"id":256,"name":1791,"alternativeText":13,"caption":13,"width":1792,"height":50,"formats":13,"hash":1793,"ext":954,"mime":957,"size":151,"url":1794,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1795,"updatedAt":1795},"Jiang Hu.jpg",104,"Jiang_Hu_70df2aab82","https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Jiang_Hu_70df2aab82.jpg","2025-01-03T13:32:11.149Z",[],"-28",{"id":206,"contact":1799},{"id":115,"name":1800,"committee":1801,"position":13,"affiliation":1802,"email":13,"biography":1803,"createdAt":1804,"updatedAt":1804,"url_path_id":1805,"contactPhoto":1806,"socialLinks":1828,"url_path":1829},"Wanli Chang","ACM SIGDA Representative","Hunan University, China","\u003Cp style=\"text-align:justify;\">Dr. Chang obtained his PhD from the Technical University of Munich with Summa Cum Laude (Highest Distinction) in 2017. The supervisor is Samarjit Chakraborty, Chair of Real-Time Computer Systems (now William R. Kenan, Jr. Distinguished Chair Professor with UNC Chapel Hill). The second supervisor is Anuradha Annaswamy, Director of Active Adaptive Control Lab, MIT, President-Elect of IEEE Control Systems Society. His bachelor degree is from Nanyang Technological University, Singapore, with First Class Honors.\u003C/p>","2025-01-03T13:32:55.233Z","53",{"id":373,"name":1807,"alternativeText":13,"caption":13,"width":28,"height":28,"formats":1808,"hash":1824,"ext":22,"mime":25,"size":1825,"url":1826,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1827,"updatedAt":1827},"Wanli Chang.png",{"small":1809,"medium":1814,"thumbnail":1819},{"ext":22,"url":1810,"hash":1811,"mime":25,"name":1812,"path":13,"size":1813,"width":35,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Wanli_Chang_533538c0ea.png","small_Wanli_Chang_533538c0ea","small_Wanli Chang.png",268.04,{"ext":22,"url":1815,"hash":1816,"mime":25,"name":1817,"path":13,"size":1818,"width":42,"height":42},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_Wanli_Chang_533538c0ea.png","medium_Wanli_Chang_533538c0ea","medium_Wanli Chang.png",557.47,{"ext":22,"url":1820,"hash":1821,"mime":25,"name":1822,"path":13,"size":1823,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Wanli_Chang_533538c0ea.png","thumbnail_Wanli_Chang_533538c0ea","thumbnail_Wanli Chang.png",32.9,"Wanli_Chang_533538c0ea",203.86,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Wanli_Chang_533538c0ea.png","2025-01-03T13:32:53.169Z",[],"-29",{"id":270,"contact":1831},{"id":79,"name":1832,"committee":1833,"position":13,"affiliation":1834,"email":13,"biography":1835,"createdAt":1836,"updatedAt":1836,"url_path_id":1837,"contactPhoto":1838,"socialLinks":1844,"url_path":1845},"Wei Zhang"," Asian Representative","The Hong Kong University of Science and Technology","\u003Cp style=\"text-align:justify;\">Prof Zhang received her PhD degree in Electrical Engineering from Princeton University with Wu Prize for research excellence. She joins Hong Kong University of Science and Technology in 2013 and establishes Reconfigurable System Lab, and she is currently a professor in the same department. She was an assistant professor in School of Computer Engineering at Nanyang Technological University, Singapore from 2010 to 2013. She has authored and co-authored more than 150 papers in peer-reviewed journals and international conferences, and won the best paper awards in ISVLSI 2009, ICCAD 2017 and ICCAD 2022. Her current research interests include reconfigurable system and FPGA-based design, electronic design automation, computer architecture, and embedded system security. Prof. Zhang currently serves in several editorial boards as Associate Editor including ACM TRETS, IEEE TVLSI, IEEE TCAD, ACM TECS, and ACM JETC. She served on the executive committee as TPC chair or General chair in FPT 2021, ISVLSI 2018 and FPT 2022. She also serves on many organization committees and technical program committees, such as DAC, ICCAD, DATE, FPGA, FCCM, etc.\u003C/p>","2025-01-03T13:33:51.863Z","54",{"id":320,"name":1839,"alternativeText":13,"caption":13,"width":306,"height":50,"formats":13,"hash":1840,"ext":954,"mime":957,"size":1841,"url":1842,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1843,"updatedAt":1843},"Wei Zhang.jpg","Wei_Zhang_7aa6868f48",5.73,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Wei_Zhang_7aa6868f48.jpg","2025-01-03T13:33:45.594Z",[],"-30",{"id":157,"contact":1847},{"id":206,"name":1848,"committee":1849,"position":13,"affiliation":1850,"email":13,"biography":1851,"createdAt":1852,"updatedAt":1852,"url_path_id":1853,"contactPhoto":1854,"socialLinks":1867,"url_path":1868},"Ulf Schlichtmann","European Representative","Technical University of Munich","\u003Cp style=\"text-align:justify;\">Professor Schlichtmann (b. 1964) explores design automation methodologies for complex (digital and analog) electronic circuits and systems. These often consist of billions of components and need to be designed using sophisticated optimization and analysis algorithms. In recent years, his research has increasingly addressed emerging technologies (photonics, microfluidic biochips, neuromorphic architectures).\u003C/p>\u003Cp style=\"text-align:justify;\">Professor Schlichtmann studied electrical engineering at TUM and obtained his doctorate for a thesis on computer-aided design, and also pursued a postgraduate business degree during this time. He then worked for Siemens AG and Infineon Technologies AG in a number of technical, managerial and executive positions for about 10 years. In 2003, Professor Schlichtmann was appointed to a professorship at TUM. In addition to his research and teaching activities, he coordinates international study programs in both Munich and Singapore (TUM Asia). He furthermore serves as program director of the TUMCREATE research project in Singapore and is is a member of various advisory boards and of the acatech National Academy of Science and Engineering.\u003C/p>","2025-01-03T13:34:29.308Z","55",{"id":412,"name":1855,"alternativeText":13,"caption":13,"width":35,"height":1856,"formats":1857,"hash":1863,"ext":954,"mime":957,"size":1864,"url":1865,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1866,"updatedAt":1866},"Ulf Schlichtmann.jpg",465,{"thumbnail":1858},{"ext":954,"url":1859,"hash":1860,"mime":957,"name":1861,"path":13,"size":1862,"width":1545,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Ulf_Schlichtmann_56fe4594d2.jpg","thumbnail_Ulf_Schlichtmann_56fe4594d2","thumbnail_Ulf Schlichtmann.jpg",5.16,"Ulf_Schlichtmann_56fe4594d2",26.92,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Ulf_Schlichtmann_56fe4594d2.jpg","2025-01-03T13:34:19.797Z",[],"-31",{"id":136,"contact":1870},{"id":270,"name":1871,"committee":1872,"position":13,"affiliation":1405,"email":13,"biography":1873,"createdAt":1874,"updatedAt":1874,"url_path_id":1875,"contactPhoto":1876,"socialLinks":1882,"url_path":1883},"Haoxing (Mark) Ren","Industry Liaison","\u003Cp style=\"text-align:justify;\">Haoxing (Mark) Ren serves as the Director of Design Automation Research at NVIDIA, where he focuses on leveraging machine learning and GPU-accelerated tools to enhance chip design quality and productivity. Prior to joining NVIDIA in 2016, he dedicated 15 years to EDA algorithm research and design methodology innovation at IBM Microelectronics and IBM Research. Mark is widely recognized for his contributions to physical design, AI, and GPU acceleration for EDA, achievements that have earned him several prestigious awards, including the IBM Corporate Award and best paper awards at ISPD, DAC, TCAD, and MLCAD. He holds Bachelor's and Master's degrees from Shanghai Jiao Tong University and Rensselaer Polytechnic Institute, respectively, and earned his PhD from the University of Texas at Austin.\u003C/p>","2025-01-03T13:35:00.217Z","56",{"id":335,"name":1877,"alternativeText":13,"caption":13,"width":50,"height":50,"formats":13,"hash":1878,"ext":22,"mime":25,"size":1879,"url":1880,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1881,"updatedAt":1881},"Haoxing (Mark) Ren.png","Haoxing_Mark_Ren_d7b7a76cac",9.19,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Haoxing_Mark_Ren_d7b7a76cac.png","2025-01-03T13:34:53.188Z",[],"-32",{"data":1885,"meta":1886},{"id":136,"heading":130,"createdAt":137,"updatedAt":138,"publishedAt":139,"url_path_id":140,"url_path":131,"contentType":141},{},1778852556749]