[{"data":1,"prerenderedAt":1754},["ShallowReactive",2],{"9JJStFeYqd":3,"P72sMQvZBU":778,"EFZjwo9bLa":1595,"8BIJgNZi1M":1751},{"siteConfiguration":4,"navigations":120},{"id":5,"siteName":6,"siteDescription":7,"ieee":8,"dateFormat":9,"createdAt":10,"updatedAt":11,"url_path_id":12,"favicon":13,"header":14,"socialLinks":67,"footer":75,"seoMeta":82,"url_path":76},1,"ICCAD 2025 | Munich, Germany","The 2025 International Conference on Computer-Aided Design - ICCAD 2025 held in Munich, Germany.",true,"DDD","2025-01-03T06:30:53.689Z","2025-06-30T13:39:07.258Z","21",null,{"id":5,"headerBackground":15,"siteLogo":16,"buttons":56,"affiliate":13},"base-100",{"id":5,"name":17,"alternativeText":13,"caption":13,"width":18,"height":19,"formats":20,"hash":51,"ext":22,"mime":25,"size":52,"url":53,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":55,"updatedAt":55},"iccad25-logo-hr_color.png",5143,3568,{"large":21,"small":30,"medium":37,"thumbnail":44},{"ext":22,"url":23,"hash":24,"mime":25,"name":26,"path":13,"size":27,"width":28,"height":29},".png","https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_iccad25_logo_hr_color_05db05f263.png","large_iccad25_logo_hr_color_05db05f263","image/png","large_iccad25-logo-hr_color.png",174.87,1000,694,{"ext":22,"url":31,"hash":32,"mime":25,"name":33,"path":13,"size":34,"width":35,"height":36},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_iccad25_logo_hr_color_05db05f263.png","small_iccad25_logo_hr_color_05db05f263","small_iccad25-logo-hr_color.png",78.06,500,347,{"ext":22,"url":38,"hash":39,"mime":25,"name":40,"path":13,"size":41,"width":42,"height":43},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_iccad25_logo_hr_color_05db05f263.png","medium_iccad25_logo_hr_color_05db05f263","medium_iccad25-logo-hr_color.png",125.14,750,520,{"ext":22,"url":45,"hash":46,"mime":25,"name":47,"path":13,"size":48,"width":49,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_iccad25_logo_hr_color_05db05f263.png","thumbnail_iccad25_logo_hr_color_05db05f263","thumbnail_iccad25-logo-hr_color.png",30.3,225,156,"iccad25_logo_hr_color_05db05f263",521.43,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/iccad25_logo_hr_color_05db05f263.png","strapi-provider-upload-aws-s3-advanced","2025-01-03T06:29:42.785Z",{"id":57,"variation":58,"button":59},3,"Buttons Left",[60],{"id":57,"label":61,"size":62,"color":63,"style":13,"icon":64,"iconPosition":65,"url":66,"newWindow":8,"downloadable":13,"shape":13},"Register Now","btn-sm","btn-primary","ArrowDownTrayIcon","End","https://cvent.me/eZBgGG",[68,72],{"id":69,"url":70,"platform":71},2,"https://www.linkedin.com/company/iccad","Linkedin",{"id":57,"url":73,"platform":74},"https://x.com/ICCAD","Twitter",{"id":5,"prose":76,"confcatsFooter":8,"affiliatesFooter":77,"styles":78},"",false,{"id":79,"edgeTop":80,"edgeBottom":80,"background":81,"containerWidth":13},8,"None","primary",{"id":5,"eventAttendanceMode":83,"startDate":84,"endDate":85,"eventStatus":86,"previousStartDate":13,"locationName":87,"locationStreetAddress":13,"addressLocality":13,"addressRegion":13,"addressCountry":13,"registrationUrl":13,"postalCode":13,"locationUrl":88,"isEvent":8,"affiliate":89},"OfflineEventAttendanceMode","2026-10-26T05:00:00.000Z","2025-10-30T05:00:00.000Z","EventScheduled","Munich, Germany","https://www.muenchen.de/en/home",{"id":5,"name":90,"description":76,"createdAt":91,"updatedAt":92,"publishedAt":93,"url_path_id":94,"logo":95,"website":111,"url_path":119},"IEEE","2025-01-03T07:09:05.498Z","2025-01-03T07:09:55.786Z","2025-01-03T07:09:55.769Z","22",{"id":79,"name":96,"alternativeText":13,"caption":13,"width":97,"height":98,"formats":99,"hash":107,"ext":22,"mime":25,"size":108,"url":109,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":110,"updatedAt":110},"ieee_logo_blue_OD.png",287,84,{"thumbnail":100},{"ext":22,"url":101,"hash":102,"mime":25,"name":103,"path":13,"size":104,"width":105,"height":106},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_ieee_logo_blue_OD_b6256c050a.png","thumbnail_ieee_logo_blue_OD_b6256c050a","thumbnail_ieee_logo_blue_OD.png",7.46,245,72,"ieee_logo_blue_OD_b6256c050a",1.37,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/ieee_logo_blue_OD_b6256c050a.png","2025-01-03T06:48:04.856Z",{"id":112,"variation":58,"button":113},6,[114],{"id":115,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":118,"newWindow":8,"downloadable":13,"shape":13},7,"More Info","ChevronRightIcon","https://www.ieee.org/","-0",{"mainNavigation":121,"footerNavigation":741},[122,223,287,489,591,677,719,735],{"id":5,"title":123,"menuAttached":8,"order":5,"path":124,"type":125,"uiRouterKey":126,"slug":127,"external":77,"items":128},"About","/about","WRAPPER","about","about-1",[129,150,169,187,205],{"id":112,"title":130,"menuAttached":8,"order":5,"path":131,"type":132,"uiRouterKey":133,"slug":134,"external":77,"related":135,"items":149},"Executive Committee","/about/executive-committee","INTERNAL","executive-committee","about-executive-committee",{"id":136,"heading":130,"createdAt":137,"updatedAt":138,"publishedAt":139,"url_path_id":140,"__contentType":141,"pathAlias":142,"navigationItemId":112,"createdBy":146,"updatedBy":147,"__templateName":148},12,"2025-01-03T07:46:02.860Z","2025-02-24T19:38:29.932Z","2025-01-03T13:36:42.228Z","46","api::page.page",{"id":143,"url_path":131,"generated":77,"contenttype":141,"createdAt":144,"updatedAt":145},46,"2025-01-03T07:46:02.875Z","2025-01-03T08:02:13.366Z",{},{},"Generic",[],{"id":151,"title":152,"menuAttached":8,"order":69,"path":153,"type":132,"uiRouterKey":154,"slug":155,"external":77,"related":156,"items":168},5,"Conference History","/about/conference-history","conference-history","about-conference-history",{"id":157,"heading":152,"createdAt":158,"updatedAt":159,"publishedAt":160,"url_path_id":161,"__contentType":141,"pathAlias":162,"navigationItemId":151,"createdBy":166,"updatedBy":167,"__templateName":148},11,"2025-01-03T07:37:43.081Z","2025-01-03T16:34:34.531Z","2025-01-03T16:26:17.226Z","43",{"id":163,"url_path":153,"generated":77,"contenttype":141,"createdAt":164,"updatedAt":165},43,"2025-01-03T07:37:43.094Z","2025-01-03T08:01:51.218Z",{},{},[],{"id":170,"title":171,"menuAttached":8,"order":57,"path":172,"type":132,"uiRouterKey":173,"slug":174,"external":77,"related":175,"items":186},4,"IEEE Policies","/about/ieee-policies","ieee-policies","about-ieee-policies",{"id":79,"heading":171,"createdAt":176,"updatedAt":177,"publishedAt":178,"url_path_id":179,"__contentType":141,"pathAlias":180,"navigationItemId":170,"createdBy":184,"updatedBy":185,"__templateName":148},"2024-03-27T21:21:52.331Z","2025-01-03T16:26:49.490Z","2025-01-03T16:26:49.477Z","18",{"id":181,"url_path":172,"generated":77,"contenttype":141,"createdAt":182,"updatedAt":183},18,"2024-12-18T21:15:54.682Z","2025-01-03T08:01:35.864Z",{},{},[],{"id":79,"title":188,"menuAttached":8,"order":170,"path":189,"type":132,"uiRouterKey":190,"slug":191,"external":77,"related":192,"items":204},"Bylaws","/about/bylaws","bylaws","about-bylaws",{"id":193,"heading":188,"createdAt":194,"updatedAt":195,"publishedAt":196,"url_path_id":197,"__contentType":141,"pathAlias":198,"navigationItemId":79,"createdBy":202,"updatedBy":203,"__templateName":148},13,"2025-01-03T13:39:57.146Z","2025-01-03T16:25:53.820Z","2025-01-03T13:39:59.638Z","57",{"id":199,"url_path":189,"generated":77,"contenttype":141,"createdAt":200,"updatedAt":201},57,"2025-01-03T13:39:57.160Z","2025-01-03T16:25:53.833Z",{},{},[],{"id":206,"title":207,"menuAttached":8,"order":151,"path":208,"type":132,"uiRouterKey":209,"slug":210,"external":77,"related":211,"items":222},9,"FAQs","/about/general-faq","fa-qs","about-general-faq",{"id":69,"heading":212,"createdAt":213,"updatedAt":214,"publishedAt":215,"url_path_id":216,"__contentType":141,"pathAlias":217,"navigationItemId":206,"createdBy":220,"updatedBy":221,"__templateName":148},"General FAQ","2024-02-03T00:34:18.506Z","2025-06-02T15:35:51.424Z","2025-01-03T13:42:14.148Z","12",{"id":136,"url_path":208,"generated":77,"contenttype":141,"createdAt":218,"updatedAt":219},"2024-12-18T21:15:54.155Z","2025-01-03T16:26:39.928Z",{},{},[],{"id":69,"title":224,"menuAttached":8,"order":69,"path":225,"type":125,"uiRouterKey":226,"slug":227,"external":77,"items":228},"Authors","/authors","authors","authors-1",[229,249,269],{"id":230,"title":231,"menuAttached":8,"order":5,"path":232,"type":132,"uiRouterKey":233,"slug":234,"external":77,"related":235,"items":248},32,"Author Presentation Information","/authors/author-presentation-information","author-presentation-information","authors-author-presentation-information",{"id":236,"heading":231,"createdAt":237,"updatedAt":238,"publishedAt":239,"url_path_id":240,"__contentType":141,"pathAlias":241,"navigationItemId":230,"createdBy":246,"updatedBy":247,"__templateName":148},23,"2025-07-03T15:29:01.726Z","2025-07-03T16:23:39.844Z","2025-07-03T15:29:03.569Z","99",{"id":242,"url_path":243,"generated":8,"contenttype":141,"createdAt":244,"updatedAt":245},99,"/author-presentation-information","2025-07-03T15:29:01.741Z","2025-07-03T16:23:39.866Z",{},{},[],{"id":250,"title":251,"menuAttached":8,"order":69,"path":252,"type":132,"uiRouterKey":253,"slug":254,"external":77,"related":255,"items":268},33,"Final Author Instructions","/authors/final-author-instructions","final-author-instructions","authors-final-author-instructions",{"id":256,"heading":251,"createdAt":257,"updatedAt":258,"publishedAt":259,"url_path_id":260,"__contentType":141,"pathAlias":261,"navigationItemId":250,"createdBy":266,"updatedBy":267,"__templateName":148},24,"2025-07-03T15:35:36.089Z","2025-08-29T23:02:42.510Z","2025-07-03T15:36:49.349Z","100",{"id":262,"url_path":263,"generated":8,"contenttype":141,"createdAt":264,"updatedAt":265},100,"/final-author-instructions","2025-07-03T15:35:36.102Z","2025-08-29T23:02:42.532Z",{},{},[],{"id":270,"title":271,"menuAttached":8,"order":57,"path":272,"type":132,"uiRouterKey":273,"slug":274,"external":77,"related":275,"items":286},10,"Initial Author Information","/authors/initial-author-information","initial-author-information","authors-initial-author-information",{"id":112,"heading":271,"createdAt":276,"updatedAt":277,"publishedAt":278,"url_path_id":279,"__contentType":141,"pathAlias":280,"navigationItemId":270,"createdBy":284,"updatedBy":285,"__templateName":148},"2024-03-13T14:22:50.042Z","2025-04-07T18:17:00.270Z","2025-01-03T16:28:24.143Z","16",{"id":281,"url_path":272,"generated":77,"contenttype":141,"createdAt":282,"updatedAt":283},16,"2024-12-18T21:15:54.543Z","2025-01-03T07:11:43.611Z",{},{},[],{"id":288,"title":289,"menuAttached":8,"order":57,"path":290,"type":125,"uiRouterKey":291,"slug":292,"external":77,"items":293},21,"Program","/program","program","program-2",[294,313,334,353,372,391,411,431,451,471],{"id":163,"title":295,"menuAttached":8,"order":5,"path":296,"type":132,"uiRouterKey":297,"slug":298,"external":77,"related":299,"items":312},"Full Program","/program/full-program","full-program","program-full-program",{"id":300,"heading":295,"createdAt":301,"updatedAt":302,"publishedAt":303,"url_path_id":304,"__contentType":141,"pathAlias":305,"navigationItemId":163,"createdBy":310,"updatedBy":311,"__templateName":148},34,"2025-09-11T16:12:52.347Z","2025-10-14T12:25:00.682Z","2025-09-11T16:12:54.318Z","165",{"id":306,"url_path":307,"generated":8,"contenttype":141,"createdAt":308,"updatedAt":309},165,"/full-program","2025-09-11T16:12:52.361Z","2025-10-14T12:25:00.697Z",{},{},[],{"id":314,"title":315,"menuAttached":8,"order":69,"path":316,"type":132,"uiRouterKey":317,"slug":318,"external":77,"related":319,"items":333},35,"Program at a Glance","/program/program-at-a-glance","program-at-a-glance","program-program-at-a-glance",{"id":320,"heading":321,"createdAt":322,"updatedAt":323,"publishedAt":324,"url_path_id":325,"__contentType":141,"pathAlias":326,"navigationItemId":314,"createdBy":331,"updatedBy":332,"__templateName":148},26,"Program at a Glance ","2025-07-28T11:53:28.809Z","2025-10-28T13:26:55.601Z","2025-07-28T11:53:30.142Z","106",{"id":327,"url_path":328,"generated":8,"contenttype":141,"createdAt":329,"updatedAt":330},106,"/program-at-a-glance","2025-07-28T11:53:28.820Z","2025-10-28T13:26:55.636Z",{},{},[],{"id":335,"title":336,"menuAttached":8,"order":57,"path":337,"type":132,"uiRouterKey":338,"slug":339,"external":77,"related":340,"items":352},28,"Plenary Speakers","/program/plenary-speakers","plenary-speakers","program-plenary-speakers",{"id":288,"heading":336,"createdAt":341,"updatedAt":342,"publishedAt":343,"url_path_id":344,"__contentType":141,"pathAlias":345,"navigationItemId":335,"createdBy":350,"updatedBy":351,"__templateName":148},"2025-06-13T15:16:34.154Z","2025-09-02T16:49:50.975Z","2025-06-23T16:30:24.474Z","92",{"id":346,"url_path":347,"generated":8,"contenttype":141,"createdAt":348,"updatedAt":349},92,"/plenary-speakers","2025-06-13T15:16:34.165Z","2025-09-02T16:49:50.992Z",{},{},[],{"id":354,"title":355,"menuAttached":8,"order":170,"path":356,"type":132,"uiRouterKey":357,"slug":358,"external":77,"related":359,"items":371},42,"Workshops","/program/workshops","workshops","program-workshops",{"id":250,"heading":355,"createdAt":360,"updatedAt":361,"publishedAt":362,"url_path_id":363,"__contentType":141,"pathAlias":364,"navigationItemId":354,"createdBy":369,"updatedBy":370,"__templateName":148},"2025-08-14T14:37:23.450Z","2025-10-02T14:00:58.718Z","2025-08-14T14:37:24.817Z","127",{"id":365,"url_path":366,"generated":8,"contenttype":141,"createdAt":367,"updatedAt":368},127,"/workshops","2025-08-14T14:37:23.461Z","2025-10-02T14:00:58.733Z",{},{},[],{"id":373,"title":374,"menuAttached":8,"order":151,"path":375,"type":132,"uiRouterKey":376,"slug":377,"external":77,"related":378,"items":390},25,"Tutorials","/program/tutorials","tutorials","program-tutorials",{"id":181,"heading":374,"createdAt":379,"updatedAt":380,"publishedAt":381,"url_path_id":382,"__contentType":141,"pathAlias":383,"navigationItemId":373,"createdBy":388,"updatedBy":389,"__templateName":148},"2025-06-10T19:01:07.221Z","2025-06-10T19:02:27.013Z","2025-06-10T19:02:26.993Z","82",{"id":384,"url_path":385,"generated":8,"contenttype":141,"createdAt":386,"updatedAt":387},82,"/tutorials","2025-06-10T19:01:07.229Z","2025-06-10T19:02:27.027Z",{},{},[],{"id":320,"title":392,"menuAttached":8,"order":112,"path":393,"type":132,"uiRouterKey":394,"slug":395,"external":77,"related":396,"items":410},"Panel Session","/program/panel-session","panel-session","program-panel-session",{"id":397,"heading":398,"createdAt":399,"updatedAt":400,"publishedAt":401,"url_path_id":402,"__contentType":141,"pathAlias":403,"navigationItemId":320,"createdBy":408,"updatedBy":409,"__templateName":148},19,"Revolution or Hype? Seeking the Limits of Large Models in Hardware Design","2025-06-10T19:04:07.883Z","2025-09-03T15:16:33.384Z","2025-06-10T19:12:59.562Z","83",{"id":404,"url_path":405,"generated":77,"contenttype":141,"createdAt":406,"updatedAt":407},83,"/panel-session","2025-06-10T19:04:07.893Z","2025-09-03T15:16:33.398Z",{},{},[],{"id":412,"title":413,"menuAttached":8,"order":115,"path":414,"type":132,"uiRouterKey":415,"slug":416,"external":77,"related":417,"items":430},27,"Special Sessions","/program/special-sessions","special-sessions","program-special-sessions",{"id":418,"heading":413,"createdAt":419,"updatedAt":420,"publishedAt":421,"url_path_id":422,"__contentType":141,"pathAlias":423,"navigationItemId":412,"createdBy":428,"updatedBy":429,"__templateName":148},20,"2025-06-10T19:14:50.433Z","2025-06-10T19:14:52.044Z","2025-06-10T19:14:52.032Z","89",{"id":424,"url_path":425,"generated":8,"contenttype":141,"createdAt":426,"updatedAt":427},89,"/special-sessions","2025-06-10T19:14:50.444Z","2025-06-10T19:14:52.058Z",{},{},[],{"id":432,"title":433,"menuAttached":8,"order":79,"path":434,"type":132,"uiRouterKey":435,"slug":436,"external":77,"related":437,"items":450},40,"CEDA Luncheon","/program/ceda-luncheon","ceda-luncheon","program-ceda-luncheon",{"id":438,"heading":433,"createdAt":439,"updatedAt":440,"publishedAt":441,"url_path_id":442,"__contentType":141,"pathAlias":443,"navigationItemId":432,"createdBy":448,"updatedBy":449,"__templateName":148},31,"2025-08-12T16:15:06.545Z","2025-10-17T14:09:42.461Z","2025-08-12T16:15:08.001Z","113",{"id":444,"url_path":445,"generated":8,"contenttype":141,"createdAt":446,"updatedAt":447},113,"/ceda-luncheon","2025-08-12T16:15:06.564Z","2025-10-17T14:09:42.475Z",{},{},[],{"id":452,"title":453,"menuAttached":8,"order":206,"path":454,"type":132,"uiRouterKey":455,"slug":456,"external":77,"related":457,"items":470},45,"Synopsys Sponsor Session","/program/synopsys-sponsor-session","synopsys-sponsor-session","program-synopsys-sponsor-session",{"id":458,"heading":453,"createdAt":459,"updatedAt":460,"publishedAt":461,"url_path_id":462,"__contentType":141,"pathAlias":463,"navigationItemId":452,"createdBy":468,"updatedBy":469,"__templateName":148},36,"2025-10-22T12:38:06.841Z","2025-10-26T14:07:21.544Z","2025-10-22T12:38:07.913Z","190",{"id":464,"url_path":465,"generated":8,"contenttype":141,"createdAt":466,"updatedAt":467},190,"/synopsys-sponsor-session","2025-10-22T12:38:06.853Z","2025-10-26T14:07:21.567Z",{},{},[],{"id":458,"title":472,"menuAttached":8,"order":270,"path":473,"type":132,"uiRouterKey":474,"slug":475,"external":77,"related":476,"items":488},"Social Functions","/program/social-functions","social-functions","program-social-functions",{"id":412,"heading":472,"createdAt":477,"updatedAt":478,"publishedAt":479,"url_path_id":480,"__contentType":141,"pathAlias":481,"navigationItemId":458,"createdBy":486,"updatedBy":487,"__templateName":148},"2025-07-31T13:11:16.284Z","2025-10-08T13:15:39.427Z","2025-07-31T13:11:17.483Z","107",{"id":482,"url_path":483,"generated":8,"contenttype":141,"createdAt":484,"updatedAt":485},107,"/social-functions","2025-07-31T13:11:16.294Z","2025-10-08T13:15:39.445Z",{},{},[],{"id":490,"title":491,"menuAttached":8,"order":170,"path":492,"type":125,"uiRouterKey":493,"slug":494,"external":77,"items":495},30,"Workforce Development Activities","/wda","workforce-development-activities","wda",[496,516,534,553,572],{"id":497,"title":498,"menuAttached":8,"order":5,"path":499,"type":132,"uiRouterKey":500,"slug":501,"external":77,"related":502,"items":515},38,"Student Scholar Program","/wda/student-scholar-program","student-scholar-program","wda-student-scholar-program",{"id":503,"heading":498,"createdAt":504,"updatedAt":505,"publishedAt":506,"url_path_id":507,"__contentType":141,"pathAlias":508,"navigationItemId":497,"createdBy":513,"updatedBy":514,"__templateName":148},29,"2025-08-12T14:05:09.862Z","2025-10-16T20:28:53.114Z","2025-08-12T14:05:11.617Z","111",{"id":509,"url_path":510,"generated":8,"contenttype":141,"createdAt":511,"updatedAt":512},111,"/student-scholar-program","2025-08-12T14:05:09.874Z","2025-10-16T20:28:53.153Z",{},{},[],{"id":300,"title":517,"menuAttached":8,"order":69,"path":518,"type":132,"uiRouterKey":519,"slug":520,"external":77,"related":521,"items":533},"Student Research Competition","/wda/student-research-competition","student-research-competition","wda-student-research-competition",{"id":373,"heading":517,"createdAt":522,"updatedAt":523,"publishedAt":524,"url_path_id":525,"__contentType":141,"pathAlias":526,"navigationItemId":300,"createdBy":531,"updatedBy":532,"__templateName":148},"2025-07-08T20:35:49.981Z","2025-07-10T14:54:57.674Z","2025-07-08T20:35:51.529Z","102",{"id":527,"url_path":528,"generated":8,"contenttype":141,"createdAt":529,"updatedAt":530},102,"/student-research-competition","2025-07-08T20:35:49.993Z","2025-07-10T14:54:57.690Z",{},{},[],{"id":535,"title":536,"menuAttached":8,"order":57,"path":537,"type":132,"uiRouterKey":538,"slug":539,"external":77,"related":540,"items":552},41,"Job Fair","/wda/job-fair","job-fair","wda-job-fair",{"id":230,"heading":536,"createdAt":541,"updatedAt":542,"publishedAt":543,"url_path_id":544,"__contentType":141,"pathAlias":545,"navigationItemId":535,"createdBy":550,"updatedBy":551,"__templateName":148},"2025-08-13T13:24:39.215Z","2025-10-28T14:54:37.358Z","2025-10-14T15:03:10.328Z","125",{"id":546,"url_path":547,"generated":8,"contenttype":141,"createdAt":548,"updatedAt":549},125,"/job-fair","2025-08-13T13:24:39.227Z","2025-10-28T14:54:37.377Z",{},{},[],{"id":554,"title":555,"menuAttached":8,"order":170,"path":556,"type":132,"uiRouterKey":557,"slug":558,"external":77,"related":559,"items":571},39,"CADathlon@ICCAD 2025","/wda/cadathlon-iccad-2025","ca-dathlon-iccad-2025","wda-cadathlon-iccad-2025",{"id":490,"heading":555,"createdAt":560,"updatedAt":561,"publishedAt":562,"url_path_id":563,"__contentType":141,"pathAlias":564,"navigationItemId":554,"createdBy":569,"updatedBy":570,"__templateName":148},"2025-08-12T14:09:42.005Z","2025-12-02T14:40:14.374Z","2025-08-12T14:09:44.119Z","112",{"id":565,"url_path":566,"generated":77,"contenttype":141,"createdAt":567,"updatedAt":568},112,"/cadathlon-iccad-2025","2025-08-12T14:09:42.020Z","2025-08-12T14:12:22.369Z",{},{},[],{"id":438,"title":573,"menuAttached":8,"order":151,"path":574,"type":132,"uiRouterKey":575,"slug":576,"external":77,"related":577,"items":590},"Activity Organizers","/wda/activity-organizers","activity-organizers","wda-activity-organizers",{"id":578,"heading":573,"createdAt":579,"updatedAt":580,"publishedAt":581,"url_path_id":582,"__contentType":141,"pathAlias":583,"navigationItemId":438,"createdBy":588,"updatedBy":589,"__templateName":148},22,"2025-07-01T13:20:51.555Z","2025-10-24T13:45:35.860Z","2025-07-01T13:20:52.689Z","95",{"id":584,"url_path":585,"generated":8,"contenttype":141,"createdAt":586,"updatedAt":587},95,"/activity-organizers","2025-07-01T13:20:51.566Z","2025-10-24T13:45:35.877Z",{},{},[],{"id":157,"title":592,"menuAttached":8,"order":151,"path":593,"type":125,"uiRouterKey":594,"slug":595,"external":77,"items":596},"Travel/Venue","/travel","travel-venue-1","travel-3",[597,616,635,654,671],{"id":256,"title":598,"menuAttached":8,"order":5,"path":599,"type":132,"uiRouterKey":600,"slug":601,"external":77,"related":602,"items":615},"Conference Hotel","/travel/conference-hotel","conference-hotel","travel-conference-hotel",{"id":603,"heading":598,"createdAt":604,"updatedAt":605,"publishedAt":606,"url_path_id":607,"__contentType":141,"pathAlias":608,"navigationItemId":256,"createdBy":613,"updatedBy":614,"__templateName":148},17,"2025-05-06T15:06:02.724Z","2025-09-12T14:34:03.187Z","2025-05-06T15:11:10.131Z","65",{"id":609,"url_path":610,"generated":8,"contenttype":141,"createdAt":611,"updatedAt":612},65,"/conference-hotel","2025-05-06T15:06:02.737Z","2025-09-12T14:34:03.207Z",{},{},[],{"id":617,"title":618,"menuAttached":8,"order":69,"path":619,"type":132,"uiRouterKey":620,"slug":621,"external":77,"related":622,"items":634},37,"CASS Student Travel Grants","/travel/cass-student-travel-grants","cass-student-travel-grants","travel-cass-student-travel-grants",{"id":335,"heading":618,"createdAt":623,"updatedAt":624,"publishedAt":625,"url_path_id":626,"__contentType":141,"pathAlias":627,"navigationItemId":617,"createdBy":632,"updatedBy":633,"__templateName":148},"2025-08-12T12:39:34.241Z","2025-08-29T22:51:54.762Z","2025-08-12T12:39:35.742Z","108",{"id":628,"url_path":629,"generated":8,"contenttype":141,"createdAt":630,"updatedAt":631},108,"/cass-student-travel-grants","2025-08-12T12:39:34.253Z","2025-08-29T22:51:54.781Z",{},{},[],{"id":193,"title":636,"menuAttached":8,"order":57,"path":637,"type":132,"uiRouterKey":638,"slug":639,"external":77,"related":640,"items":653},"Traveling to Munich","/travel/traveling-to-munich","traveling-to-munich","travel-traveling-to-munich",{"id":641,"heading":636,"createdAt":642,"updatedAt":643,"publishedAt":644,"url_path_id":645,"__contentType":141,"pathAlias":646,"navigationItemId":193,"createdBy":651,"updatedBy":652,"__templateName":148},14,"2025-01-03T14:00:29.932Z","2025-01-03T19:10:06.080Z","2025-01-03T14:00:32.845Z","58",{"id":647,"url_path":648,"generated":77,"contenttype":141,"createdAt":649,"updatedAt":650},58,"/travel-venue/traveling-to-munich","2025-01-03T14:00:29.949Z","2025-01-03T16:28:57.319Z",{},{},[],{"id":136,"title":655,"menuAttached":8,"order":170,"path":656,"type":132,"uiRouterKey":657,"slug":658,"external":77,"related":659,"items":670},"Avoid Hotel Fraud","/travel/avoid-hotel-fraud","avoid-hotel-fraud-1","travel-avoid-hotel-fraud",{"id":57,"heading":655,"createdAt":660,"updatedAt":661,"publishedAt":662,"url_path_id":663,"__contentType":141,"pathAlias":664,"navigationItemId":136,"createdBy":668,"updatedBy":669,"__templateName":148},"2024-02-03T00:09:23.078Z","2025-01-03T13:52:37.138Z","2025-01-03T13:52:37.112Z","13",{"id":193,"url_path":665,"generated":77,"contenttype":141,"createdAt":666,"updatedAt":667},"/travel-venue/avoid-hotel-fraud","2024-12-18T21:15:54.287Z","2025-01-03T07:11:58.952Z",{},{},[],{"id":236,"title":672,"menuAttached":8,"order":151,"path":673,"type":674,"uiRouterKey":675,"slug":676,"external":8},"Things to do in Munich","https://www.munich.travel/en/categories/plan/attractions","EXTERNAL","things-to-do-in-munich",{},{"id":641,"title":678,"menuAttached":8,"order":112,"path":679,"type":125,"uiRouterKey":680,"slug":681,"external":77,"items":682},"Sponsors & Exhibitors","/sponsors","sponsors","sponsors-1",[683,702],{"id":418,"title":684,"menuAttached":8,"order":5,"path":685,"type":132,"uiRouterKey":686,"slug":687,"external":77,"related":688,"items":701},"Sponsor Listing","/sponsors/sponsor-listing","sponsor-listing","sponsors-sponsor-listing",{"id":689,"heading":684,"createdAt":690,"updatedAt":691,"publishedAt":692,"url_path_id":693,"__contentType":141,"pathAlias":694,"navigationItemId":418,"createdBy":699,"updatedBy":700,"__templateName":148},15,"2025-01-28T21:16:15.605Z","2025-09-22T13:13:00.578Z","2025-01-28T21:16:20.744Z","59",{"id":695,"url_path":696,"generated":8,"contenttype":141,"createdAt":697,"updatedAt":698},59,"/sponsor-listing","2025-01-28T21:16:15.620Z","2025-09-22T13:13:00.597Z",{},{},[],{"id":689,"title":703,"menuAttached":8,"order":69,"path":704,"type":132,"uiRouterKey":705,"slug":706,"external":77,"related":707,"items":718},"Become a Sponsor","/sponsors/become-a-sponsor","become-a-sponsor","sponsors-become-a-sponsor",{"id":270,"heading":703,"createdAt":708,"updatedAt":709,"publishedAt":710,"url_path_id":711,"__contentType":141,"pathAlias":712,"navigationItemId":689,"createdBy":716,"updatedBy":717,"__templateName":148},"2024-09-11T06:01:15.716Z","2025-08-29T23:03:21.423Z","2025-01-03T14:04:15.584Z","20",{"id":418,"url_path":713,"generated":77,"contenttype":141,"createdAt":714,"updatedAt":715},"/affiliates/become-a-sponsor","2024-12-18T21:15:54.811Z","2025-01-03T22:43:07.554Z",{},{},[],{"id":503,"title":720,"menuAttached":8,"order":115,"path":721,"type":132,"uiRouterKey":722,"slug":723,"external":77,"related":724,"items":734},"Registration","/registration","registration","registration-1",{"id":151,"heading":720,"createdAt":725,"updatedAt":726,"publishedAt":727,"url_path_id":728,"__contentType":141,"pathAlias":729,"navigationItemId":503,"createdBy":732,"updatedBy":733,"__templateName":148},"2024-03-13T14:22:33.303Z","2025-08-12T16:57:25.246Z","2025-06-30T13:34:01.798Z","15",{"id":689,"url_path":721,"generated":8,"contenttype":141,"createdAt":730,"updatedAt":731},"2024-12-18T21:15:54.417Z","2025-08-12T16:57:25.272Z",{},{},[],{"id":736,"title":737,"menuAttached":8,"order":79,"path":738,"type":674,"uiRouterKey":739,"slug":740,"external":8},44,"Mobile App","https://client.conflux.events/dashboard","mobile-app",{},[742,751,760,769],{"id":603,"title":130,"menuAttached":77,"order":5,"path":743,"type":132,"uiRouterKey":744,"slug":745,"external":77,"related":746,"items":750},"/executive-committee","executive-committee-1","executive-committee-2",{"id":136,"heading":130,"createdAt":137,"updatedAt":138,"publishedAt":139,"url_path_id":140,"__contentType":141,"pathAlias":747,"navigationItemId":603,"createdBy":748,"updatedBy":749,"__templateName":148},{"id":143,"url_path":131,"generated":77,"contenttype":141,"createdAt":144,"updatedAt":145},{},{},[],{"id":281,"title":271,"menuAttached":8,"order":69,"path":752,"type":132,"uiRouterKey":753,"slug":754,"external":77,"related":755,"items":759},"/initial-author-information","initial-author-information-1","initial-author-information-2",{"id":112,"heading":271,"createdAt":276,"updatedAt":277,"publishedAt":278,"url_path_id":279,"__contentType":141,"pathAlias":756,"navigationItemId":281,"createdBy":757,"updatedBy":758,"__templateName":148},{"id":281,"url_path":272,"generated":77,"contenttype":141,"createdAt":282,"updatedAt":283},{},{},[],{"id":397,"title":636,"menuAttached":8,"order":57,"path":761,"type":132,"uiRouterKey":762,"slug":763,"external":77,"related":764,"items":768},"/traveling-to-munich","traveling-to-munich-1","traveling-to-munich-2",{"id":641,"heading":636,"createdAt":642,"updatedAt":643,"publishedAt":644,"url_path_id":645,"__contentType":141,"pathAlias":765,"navigationItemId":397,"createdBy":766,"updatedBy":767,"__templateName":148},{"id":647,"url_path":648,"generated":77,"contenttype":141,"createdAt":649,"updatedAt":650},{},{},[],{"id":181,"title":703,"menuAttached":8,"order":170,"path":770,"type":132,"uiRouterKey":771,"slug":772,"external":77,"related":773,"items":777},"/become-a-sponsor","become-a-sponsor-1","become-a-sponsor-2",{"id":270,"heading":703,"createdAt":708,"updatedAt":709,"publishedAt":710,"url_path_id":711,"__contentType":141,"pathAlias":774,"navigationItemId":181,"createdBy":775,"updatedBy":776,"__templateName":148},{"id":418,"url_path":713,"generated":77,"contenttype":141,"createdAt":714,"updatedAt":715},{},{},[],{"affiliates":779},{"affiliates":780},{"data":781,"meta":1593},[782,789,828,859,884,923,943,970,997,1044,1071,1109,1157,1195,1242,1287,1334,1374,1387,1404,1446,1491,1535,1562,1578],{"id":5,"name":90,"description":76,"createdAt":91,"updatedAt":92,"publishedAt":93,"url_path_id":94,"logo":783,"website":786,"url_path":119},{"id":79,"name":96,"alternativeText":13,"caption":13,"width":97,"height":98,"formats":784,"hash":107,"ext":22,"mime":25,"size":108,"url":109,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":110,"updatedAt":110},{"thumbnail":785},{"ext":22,"url":101,"hash":102,"mime":25,"name":103,"path":13,"size":104,"width":105,"height":106},{"id":112,"variation":58,"button":787},[788],{"id":115,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":118,"newWindow":8,"downloadable":13,"shape":13},{"id":69,"name":790,"description":76,"createdAt":791,"updatedAt":792,"publishedAt":793,"url_path_id":794,"logo":795,"website":823,"url_path":827},"ACM","2025-01-03T07:09:46.904Z","2025-01-03T07:09:52.287Z","2025-01-03T07:09:52.275Z","23",{"id":115,"name":796,"alternativeText":13,"caption":13,"width":28,"height":797,"formats":798,"hash":819,"ext":800,"mime":803,"size":820,"url":821,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":822,"updatedAt":822},"ACM_logo.gif",357,{"small":799,"medium":807,"thumbnail":813},{"ext":800,"url":801,"hash":802,"mime":803,"name":804,"path":13,"size":805,"width":35,"height":806},".gif","https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_ACM_logo_8eae63fe1b.gif","small_ACM_logo_8eae63fe1b","image/gif","small_ACM_logo.gif",13.59,179,{"ext":800,"url":808,"hash":809,"mime":803,"name":810,"path":13,"size":811,"width":42,"height":812},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_ACM_logo_8eae63fe1b.gif","medium_ACM_logo_8eae63fe1b","medium_ACM_logo.gif",29.05,268,{"ext":800,"url":814,"hash":815,"mime":803,"name":816,"path":13,"size":817,"width":105,"height":818},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_ACM_logo_8eae63fe1b.gif","thumbnail_ACM_logo_8eae63fe1b","thumbnail_ACM_logo.gif",4.9,87,"ACM_logo_8eae63fe1b",49.44,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/ACM_logo_8eae63fe1b.gif","2025-01-03T06:47:24.409Z",{"id":115,"variation":58,"button":824},[825],{"id":79,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":826,"newWindow":8,"downloadable":13,"shape":13},"https://www.acm.org/","-1",{"id":57,"name":829,"description":76,"createdAt":830,"updatedAt":831,"publishedAt":832,"url_path_id":833,"logo":834,"website":854,"url_path":858},"CEDA","2025-01-03T13:24:57.234Z","2025-01-03T13:24:58.718Z","2025-01-03T13:24:58.711Z","47",{"id":397,"name":835,"alternativeText":13,"caption":13,"width":42,"height":836,"formats":837,"hash":850,"ext":22,"mime":25,"size":851,"url":852,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":853,"updatedAt":853},"ICCAD_2024_Patron-Logos_CEDA.png",196,{"small":838,"thumbnail":844},{"ext":22,"url":839,"hash":840,"mime":25,"name":841,"path":13,"size":842,"width":35,"height":843},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_ICCAD_2024_Patron_Logos_CEDA_1163b00397.png","small_ICCAD_2024_Patron_Logos_CEDA_1163b00397","small_ICCAD_2024_Patron-Logos_CEDA.png",33.78,131,{"ext":22,"url":845,"hash":846,"mime":25,"name":847,"path":13,"size":848,"width":105,"height":849},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_ICCAD_2024_Patron_Logos_CEDA_1163b00397.png","thumbnail_ICCAD_2024_Patron_Logos_CEDA_1163b00397","thumbnail_ICCAD_2024_Patron-Logos_CEDA.png",13.99,64,"ICCAD_2024_Patron_Logos_CEDA_1163b00397",12.21,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/ICCAD_2024_Patron_Logos_CEDA_1163b00397.png","2025-01-03T13:24:24.215Z",{"id":335,"variation":58,"button":855},[856],{"id":438,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":857,"newWindow":8,"downloadable":13,"shape":13},"https://ieee-ceda.org/","-23",{"id":170,"name":860,"description":76,"createdAt":861,"updatedAt":862,"publishedAt":863,"url_path_id":864,"logo":865,"website":879,"url_path":883},"ACM SIGDA","2025-01-03T13:25:27.135Z","2025-01-03T13:25:28.258Z","2025-01-03T13:25:28.253Z","48",{"id":418,"name":866,"alternativeText":13,"caption":13,"width":35,"height":867,"formats":868,"hash":875,"ext":22,"mime":25,"size":876,"url":877,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":878,"updatedAt":878},"ICCAD_2024_Patron-Logos_SIGDA.png",358,{"thumbnail":869},{"ext":22,"url":870,"hash":871,"mime":25,"name":872,"path":13,"size":873,"width":874,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_ICCAD_2024_Patron_Logos_SIGDA_5fa343b3ac.png","thumbnail_ICCAD_2024_Patron_Logos_SIGDA_5fa343b3ac","thumbnail_ICCAD_2024_Patron-Logos_SIGDA.png",15.79,218,"ICCAD_2024_Patron_Logos_SIGDA_5fa343b3ac",11.44,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/ICCAD_2024_Patron_Logos_SIGDA_5fa343b3ac.png","2025-01-03T13:25:17.189Z",{"id":503,"variation":58,"button":880},[881],{"id":230,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":882,"newWindow":8,"downloadable":13,"shape":13},"https://www.sigda.org/","-24",{"id":151,"name":885,"description":886,"createdAt":887,"updatedAt":888,"publishedAt":889,"url_path_id":890,"logo":891,"website":918,"url_path":922},"DATE 2025","\u003Cp>31 March - 2 April 2025 | Lyon, France\u003C/p>\u003Cp style=\"text-align:justify;\">The DATE conference is the main European event bringing together designers and design automation users, researchers and vendors as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. DATE puts a strong emphasis on both technology and systems, covering ICs/SoCs, reconfigurable hardware and embedded systems as well as embedded software.\u003C/p>","2025-01-28T21:18:14.053Z","2025-01-30T16:30:45.605Z","2025-01-28T21:18:16.013Z","60",{"id":230,"name":892,"alternativeText":13,"caption":13,"width":893,"height":894,"formats":895,"hash":914,"ext":22,"mime":25,"size":915,"url":916,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":917,"updatedAt":917},"DATE 2025_logo_blue_flat.png",763,436,{"small":896,"medium":902,"thumbnail":908},{"ext":22,"url":897,"hash":898,"mime":25,"name":899,"path":13,"size":900,"width":35,"height":901},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_DATE_2025_logo_blue_flat_3e7d5cac20.png","small_DATE_2025_logo_blue_flat_3e7d5cac20","small_DATE 2025_logo_blue_flat.png",38.34,286,{"ext":22,"url":903,"hash":904,"mime":25,"name":905,"path":13,"size":906,"width":42,"height":907},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_DATE_2025_logo_blue_flat_3e7d5cac20.png","medium_DATE_2025_logo_blue_flat_3e7d5cac20","medium_DATE 2025_logo_blue_flat.png",62.63,429,{"ext":22,"url":909,"hash":910,"mime":25,"name":911,"path":13,"size":912,"width":105,"height":913},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_DATE_2025_logo_blue_flat_3e7d5cac20.png","thumbnail_DATE_2025_logo_blue_flat_3e7d5cac20","thumbnail_DATE 2025_logo_blue_flat.png",16.5,140,"DATE_2025_logo_blue_flat_3e7d5cac20",8.71,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/DATE_2025_logo_blue_flat_3e7d5cac20.png","2025-01-30T16:30:42.820Z",{"id":497,"variation":58,"button":919},[920],{"id":736,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":921,"newWindow":8,"downloadable":13,"shape":13},"https://www.date-conference.com/","-33",{"id":112,"name":924,"description":76,"createdAt":925,"updatedAt":926,"publishedAt":927,"url_path_id":928,"logo":929,"website":938,"url_path":942},"CAS","2025-02-05T18:38:22.616Z","2025-02-05T18:38:24.746Z","2025-02-05T18:38:24.730Z","61",{"id":250,"name":930,"alternativeText":13,"caption":13,"width":931,"height":932,"formats":13,"hash":933,"ext":934,"mime":935,"size":418,"url":936,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":937,"updatedAt":937},"cas-vector-logo-w-text-horizontal_web.svg",4321,1198,"cas_vector_logo_w_text_horizontal_web_ec8d34b7e3",".svg","image/svg+xml","https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/cas_vector_logo_w_text_horizontal_web_ec8d34b7e3.svg","2025-02-05T18:38:08.496Z",{"id":554,"variation":58,"button":939},[940],{"id":452,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":941,"newWindow":8,"downloadable":13,"shape":13},"https://ieee-cas.org/","-34",{"id":115,"name":944,"description":76,"createdAt":945,"updatedAt":946,"publishedAt":947,"url_path_id":948,"logo":949,"website":965,"url_path":969},"EDS","2025-03-03T17:52:55.200Z","2025-03-03T19:30:32.758Z","2025-03-03T17:52:56.650Z","63",{"id":617,"name":950,"alternativeText":13,"caption":13,"width":951,"height":327,"formats":952,"hash":961,"ext":954,"mime":957,"size":962,"url":963,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":964,"updatedAt":964},"a9a6ac39-672f-346f-d670-89d1f2936810.jpg",270,{"thumbnail":953},{"ext":954,"url":955,"hash":956,"mime":957,"name":958,"path":13,"size":959,"width":105,"height":960},".jpg","https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_a9a6ac39_672f_346f_d670_89d1f2936810_8186cc94a7.jpg","thumbnail_a9a6ac39_672f_346f_d670_89d1f2936810_8186cc94a7","image/jpeg","thumbnail_a9a6ac39-672f-346f-d670-89d1f2936810.jpg",8.22,96,"a9a6ac39_672f_346f_d670_89d1f2936810_8186cc94a7",9.91,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/a9a6ac39_672f_346f_d670_89d1f2936810_8186cc94a7.jpg","2025-03-03T19:30:30.401Z",{"id":432,"variation":58,"button":966},[967],{"id":143,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":968,"newWindow":8,"downloadable":13,"shape":13},"https://eds.ieee.org/","-36",{"id":79,"name":971,"description":972,"createdAt":973,"updatedAt":974,"publishedAt":975,"url_path_id":976,"logo":977,"website":991,"url_path":996},"Chipdesign Germany","\u003Cp style=\"text-align:justify;\">Chip design is the essential step in designing microelectronics for our own products and applications. Expertise in chip design can strengthen Germany's innovation and competitiveness and increase the technological sovereignty in Europe. In order to realise this potential, the German and European chip design ecosystem is to be expanded. To this end, the Microelectronics Design Initiative was launched, which is based on the following four key areas: a strong network as a central exchange platform, training and further education of talented and specialised staff, the implementation of collaborative research projects to strengthen design capabilities and the expansion and strengthening of research structures.\u003C/p>\u003Cp style=\"text-align:justify;\">The Chipdesign Germany network is a platform for pre-competitive, open dialogue between all players involved in chip design. The aim is to develop suitable cooperation structures, consulting services for start-ups and SMEs as well as new business models.\u003C/p>","2025-07-21T12:34:24.870Z","2025-07-21T13:56:07.503Z","2025-07-21T13:56:07.496Z","103",{"id":647,"name":978,"alternativeText":13,"caption":13,"width":979,"height":980,"formats":981,"hash":987,"ext":22,"mime":25,"size":988,"url":989,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":990,"updatedAt":990},"LogoCDGbluergb3.png",432,167,{"thumbnail":982},{"ext":22,"url":983,"hash":984,"mime":25,"name":985,"path":13,"size":986,"width":105,"height":584},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Logo_CD_Gbluergb3_9721bddba9.png","thumbnail_Logo_CD_Gbluergb3_9721bddba9","thumbnail_LogoCDGbluergb3.png",15.08,"Logo_CD_Gbluergb3_9721bddba9",4.23,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Logo_CD_Gbluergb3_9721bddba9.png","2025-07-21T12:34:03.562Z",{"id":992,"variation":58,"button":993},50,[994],{"id":199,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":995,"newWindow":8,"downloadable":13,"shape":13},"https://www.chipdesign-germany.de","-66",{"id":206,"name":998,"description":999,"createdAt":1000,"updatedAt":1001,"publishedAt":1002,"url_path_id":1003,"logo":1004,"website":1037,"url_path":1043},"Infineon","\u003Cp style=\"text-align:justify;\">Driving decarbonization and digitalization. Together. Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization. As a global semiconductor leader in power systems and IoT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.\u003C/p>","2025-08-12T12:58:52.330Z","2025-08-12T12:59:25.743Z","2025-08-12T12:59:25.738Z","109",{"id":1005,"name":1006,"alternativeText":13,"caption":13,"width":1007,"height":1008,"formats":1009,"hash":1033,"ext":954,"mime":957,"size":1034,"url":1035,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1036,"updatedAt":1036},63,"infineonlogocolor.jpg",1500,656,{"large":1010,"small":1016,"medium":1022,"thumbnail":1028},{"ext":954,"url":1011,"hash":1012,"mime":957,"name":1013,"path":13,"size":1014,"width":28,"height":1015},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_infineonlogocolor_d727f9668e.jpg","large_infineonlogocolor_d727f9668e","large_infineonlogocolor.jpg",33.95,437,{"ext":954,"url":1017,"hash":1018,"mime":957,"name":1019,"path":13,"size":1020,"width":35,"height":1021},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_infineonlogocolor_d727f9668e.jpg","small_infineonlogocolor_d727f9668e","small_infineonlogocolor.jpg",15.76,219,{"ext":954,"url":1023,"hash":1024,"mime":957,"name":1025,"path":13,"size":1026,"width":42,"height":1027},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_infineonlogocolor_d727f9668e.jpg","medium_infineonlogocolor_d727f9668e","medium_infineonlogocolor.jpg",24.22,328,{"ext":954,"url":1029,"hash":1030,"mime":957,"name":1031,"path":13,"size":1032,"width":105,"height":482},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_infineonlogocolor_d727f9668e.jpg","thumbnail_infineonlogocolor_d727f9668e","thumbnail_infineonlogocolor.jpg",6.54,"infineonlogocolor_d727f9668e",53.14,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/infineonlogocolor_d727f9668e.jpg","2025-08-12T12:58:21.590Z",{"id":1038,"variation":58,"button":1039},55,[1040],{"id":1041,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1042,"newWindow":8,"downloadable":13,"shape":13},62,"www.infineon.com","-69",{"id":270,"name":1045,"description":1046,"createdAt":1047,"updatedAt":1048,"publishedAt":1049,"url_path_id":1050,"logo":1051,"website":1065,"url_path":1070},"Synopsys","\u003Cp style=\"text-align:justify;\">Our Mission is to Empower Innovators to Drive Human Advancement\u003C/p>\u003Cp style=\"text-align:justify;\">We live in a world where intelligent technology is everywhere, shaping our daily lives. This pervasive intelligence is driven by three major trends: artificial intelligence, software-defined systems and silicon proliferation. For decades we’ve been a driving force of the technologies that make pervasive intelligence possible.\u003C/p>\u003Cp style=\"text-align:justify;\">Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP and simulation and analysis solutions. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Companies trust Synopsys to pioneer new technologies to help them get to market faster, without compromise.\u003C/p>\u003Cp style=\"text-align:justify;\">Our Technology, Your Innovation™\u003C/p>","2025-08-12T13:47:09.585Z","2025-08-12T13:47:11.385Z","2025-08-12T13:47:11.378Z","110",{"id":849,"name":1052,"alternativeText":13,"caption":13,"width":35,"height":1053,"formats":1054,"hash":1061,"ext":22,"mime":25,"size":1062,"url":1063,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1064,"updatedAt":1064},"small_medium_Synopsys_SARA_Lockup_rgb_stacked_4c6583d0c8_0ae0f6c6b9.png",239,{"thumbnail":1055},{"ext":22,"url":1056,"hash":1057,"mime":25,"name":1058,"path":13,"size":1059,"width":105,"height":1060},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_small_medium_Synopsys_SARA_Lockup_rgb_stacked_4c6583d0c8_0ae0f6c6b9_37a218760b.png","thumbnail_small_medium_Synopsys_SARA_Lockup_rgb_stacked_4c6583d0c8_0ae0f6c6b9_37a218760b","thumbnail_small_medium_Synopsys_SARA_Lockup_rgb_stacked_4c6583d0c8_0ae0f6c6b9.png",21.05,117,"small_medium_Synopsys_SARA_Lockup_rgb_stacked_4c6583d0c8_0ae0f6c6b9_37a218760b",10.78,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_medium_Synopsys_SARA_Lockup_rgb_stacked_4c6583d0c8_0ae0f6c6b9_37a218760b.png","2025-08-12T13:46:29.634Z",{"id":1066,"variation":58,"button":1067},56,[1068],{"id":1005,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1069,"newWindow":8,"downloadable":13,"shape":13},"https://www.synopsys.com/","-70",{"id":157,"name":1072,"description":1073,"createdAt":1074,"updatedAt":1075,"publishedAt":1076,"url_path_id":1077,"logo":1078,"website":1103,"url_path":1108},"University of California, San Diego","\u003Cp style=\"text-align:justify;\">The UCSD VLSI CAD Laboratory performs fundamental research in EDA. Areas of interest span all aspects of physical design, the design-manufacturing interface, AI and machine learning for IC design and EDA, open-source EDA , and semiconductor design technology roadmapping.\u003C/p>","2025-08-12T17:48:32.266Z","2025-08-12T17:48:33.743Z","2025-08-12T17:48:33.738Z","118",{"id":1079,"name":1080,"alternativeText":13,"caption":13,"width":1081,"height":1082,"formats":1083,"hash":1099,"ext":22,"mime":25,"size":1100,"url":1101,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1102,"updatedAt":1102},69,"UCSDVLSICADLaboratory.png",757,86,{"small":1084,"medium":1088,"thumbnail":1094},{"ext":22,"url":1085,"hash":1086,"mime":25,"name":1087,"path":13,"size":281,"width":35,"height":199},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_UCSDVLSICAD_Laboratory_b96b000624.png","small_UCSDVLSICAD_Laboratory_b96b000624","small_UCSDVLSICADLaboratory.png",{"ext":22,"url":1089,"hash":1090,"mime":25,"name":1091,"path":13,"size":1092,"width":42,"height":1093},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_UCSDVLSICAD_Laboratory_b96b000624.png","medium_UCSDVLSICAD_Laboratory_b96b000624","medium_UCSDVLSICADLaboratory.png",26.5,85,{"ext":22,"url":1095,"hash":1096,"mime":25,"name":1097,"path":13,"size":1098,"width":105,"height":335},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_UCSDVLSICAD_Laboratory_b96b000624.png","thumbnail_UCSDVLSICAD_Laboratory_b96b000624","thumbnail_UCSDVLSICADLaboratory.png",6.96,"UCSDVLSICAD_Laboratory_b96b000624",3.73,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/UCSDVLSICAD_Laboratory_b96b000624.png","2025-08-12T17:48:25.958Z",{"id":695,"variation":58,"button":1104},[1105],{"id":1106,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1107,"newWindow":8,"downloadable":13,"shape":13},66,"https://vlsicad.ucsd.edu/","-75",{"id":136,"name":1110,"description":1111,"createdAt":1112,"updatedAt":1113,"publishedAt":1114,"url_path_id":1115,"logo":1116,"website":1150,"url_path":1156},"Visionary Always Technologies","\u003Cp style=\"text-align:justify;\">Visionary Always, a startup founded in 2025, develops design automation toolchains for disaggregated chips. Leveraging a chiplet-based heterogeneous architecture and system-level software optimization, our technology streamlines design workflows and enhances performance for next-generation hardware, making us a trusted partner in advancing cutting-edge computing capabilities.\u003C/p>","2025-08-19T18:00:31.735Z","2025-08-27T12:16:14.656Z","2025-08-19T18:00:33.246Z","130",{"id":1117,"name":1118,"alternativeText":13,"caption":13,"width":1119,"height":1120,"formats":1121,"hash":1146,"ext":954,"mime":957,"size":1147,"url":1148,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1149,"updatedAt":1149},78,"VisionaryAlwaysLogo.jpg",11170,7267,{"large":1122,"small":1128,"medium":1134,"thumbnail":1140},{"ext":954,"url":1123,"hash":1124,"mime":957,"name":1125,"path":13,"size":1126,"width":28,"height":1127},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_Visionary_Always_Logo_e9339bff6e.jpg","large_Visionary_Always_Logo_e9339bff6e","large_VisionaryAlwaysLogo.jpg",32.32,650,{"ext":954,"url":1129,"hash":1130,"mime":957,"name":1131,"path":13,"size":1132,"width":35,"height":1133},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Visionary_Always_Logo_e9339bff6e.jpg","small_Visionary_Always_Logo_e9339bff6e","small_VisionaryAlwaysLogo.jpg",13.37,325,{"ext":954,"url":1135,"hash":1136,"mime":957,"name":1137,"path":13,"size":1138,"width":42,"height":1139},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_Visionary_Always_Logo_e9339bff6e.jpg","medium_Visionary_Always_Logo_e9339bff6e","medium_VisionaryAlwaysLogo.jpg",22.62,488,{"ext":954,"url":1141,"hash":1142,"mime":957,"name":1143,"path":13,"size":1144,"width":1145,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Visionary_Always_Logo_e9339bff6e.jpg","thumbnail_Visionary_Always_Logo_e9339bff6e","thumbnail_VisionaryAlwaysLogo.jpg",4.68,240,"Visionary_Always_Logo_e9339bff6e",845.78,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Visionary_Always_Logo_e9339bff6e.jpg","2025-08-19T18:00:22.975Z",{"id":1151,"variation":58,"button":1152},61,[1153],{"id":1154,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1155,"newWindow":8,"downloadable":13,"shape":13},68,"https://mp.weixin.qq.com/s/hASyDhZu7WjM4rNwdQ405Q","-85",{"id":193,"name":1158,"description":1159,"createdAt":1160,"updatedAt":1161,"publishedAt":1162,"url_path_id":1163,"logo":1164,"website":1190,"url_path":1194},"Cadence","\u003Cp style=\"text-align:justify;\">Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world’s top 100 best-managed companies. Cadence solutions offer limitless opportunities—learn more at www.cadence.com.\u003C/p>","2025-08-20T12:33:44.333Z","2025-08-27T13:27:27.990Z","2025-08-20T12:33:46.101Z","131",{"id":1165,"name":1166,"alternativeText":13,"caption":13,"width":1167,"height":1168,"formats":1169,"hash":1186,"ext":22,"mime":25,"size":1187,"url":1188,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1189,"updatedAt":1189},79,"CadenceLogoRed185Reg.png",840,159,{"small":1170,"medium":1175,"thumbnail":1181},{"ext":22,"url":1171,"hash":1172,"mime":25,"name":1173,"path":13,"size":1174,"width":35,"height":584},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Cadence_Logo_Red185_Reg_e7d73a34ea.png","small_Cadence_Logo_Red185_Reg_e7d73a34ea","small_CadenceLogoRed185Reg.png",11.98,{"ext":22,"url":1176,"hash":1177,"mime":25,"name":1178,"path":13,"size":1179,"width":42,"height":1180},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_Cadence_Logo_Red185_Reg_e7d73a34ea.png","medium_Cadence_Logo_Red185_Reg_e7d73a34ea","medium_CadenceLogoRed185Reg.png",19.15,142,{"ext":22,"url":1182,"hash":1183,"mime":25,"name":1184,"path":13,"size":1185,"width":105,"height":143},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Cadence_Logo_Red185_Reg_e7d73a34ea.png","thumbnail_Cadence_Logo_Red185_Reg_e7d73a34ea","thumbnail_CadenceLogoRed185Reg.png",5.5,"Cadence_Logo_Red185_Reg_e7d73a34ea",4.95,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Cadence_Logo_Red185_Reg_e7d73a34ea.png","2025-08-20T12:33:30.412Z",{"id":1041,"variation":58,"button":1191},[1192],{"id":1079,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1193,"newWindow":8,"downloadable":13,"shape":13},"https://www.cadence.com","-86",{"id":641,"name":1196,"description":1197,"createdAt":1198,"updatedAt":1199,"publishedAt":1200,"url_path_id":1201,"logo":1202,"website":1236,"url_path":1241},"TSMC","\u003Cp>Established in 1987, TSMC is the world's first dedicated semiconductor foundry.\u003C/p>","2025-08-25T12:32:50.626Z","2025-08-25T12:32:52.144Z","2025-08-25T12:32:52.136Z","132",{"id":1203,"name":1204,"alternativeText":13,"caption":13,"width":1205,"height":1206,"formats":1207,"hash":1232,"ext":22,"mime":25,"size":1233,"url":1234,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1235,"updatedAt":1235},80,"ScreenShot20220316at2.35.19PM.png",2108,1540,{"large":1208,"small":1214,"medium":1220,"thumbnail":1226},{"ext":22,"url":1209,"hash":1210,"mime":25,"name":1211,"path":13,"size":1212,"width":28,"height":1213},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_Screen_Shot20220316at2_35_19_PM_6816a8c5b8.png","large_Screen_Shot20220316at2_35_19_PM_6816a8c5b8","large_ScreenShot20220316at2.35.19PM.png",128.68,731,{"ext":22,"url":1215,"hash":1216,"mime":25,"name":1217,"path":13,"size":1218,"width":35,"height":1219},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Screen_Shot20220316at2_35_19_PM_6816a8c5b8.png","small_Screen_Shot20220316at2_35_19_PM_6816a8c5b8","small_ScreenShot20220316at2.35.19PM.png",49.94,365,{"ext":22,"url":1221,"hash":1222,"mime":25,"name":1223,"path":13,"size":1224,"width":42,"height":1225},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_Screen_Shot20220316at2_35_19_PM_6816a8c5b8.png","medium_Screen_Shot20220316at2_35_19_PM_6816a8c5b8","medium_ScreenShot20220316at2.35.19PM.png",88.21,548,{"ext":22,"url":1227,"hash":1228,"mime":25,"name":1229,"path":13,"size":1230,"width":1231,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Screen_Shot20220316at2_35_19_PM_6816a8c5b8.png","thumbnail_Screen_Shot20220316at2_35_19_PM_6816a8c5b8","thumbnail_ScreenShot20220316at2.35.19PM.png",18.07,214,"Screen_Shot20220316at2_35_19_PM_6816a8c5b8",122.74,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Screen_Shot20220316at2_35_19_PM_6816a8c5b8.png","2025-08-25T12:32:45.461Z",{"id":1005,"variation":58,"button":1237},[1238],{"id":1239,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1240,"newWindow":8,"downloadable":13,"shape":13},70,"www.tsmc.com","-87",{"id":689,"name":1243,"description":1244,"createdAt":1245,"updatedAt":1246,"publishedAt":1247,"url_path_id":1248,"logo":1249,"website":1281,"url_path":1286},"Sony AI","\u003Cp style=\"text-align:justify;\">Sony AI is a division of Sony Research Inc., which was founded as a subsidiary of Sony Group Corporation on April 1, 2020, with the mission to \"unleash human imagination and creativity with AI.\" Sony AI aims to combine cutting-edge research and development of artificial intelligence with Sony Group's imaging and sensing technology, robotics technology, and entertainment assets such as movies, music, and games to accelerate Sony’s transformation into an AI-powered company and to create new business opportunities. To achieve this, Sony AI is working across six Flagship Projects that are aimed at the evolution and application of AI technology in the areas of AI for Creators, Gaming and Interactive Agents, Ethics, Scientific Discovery, Imaging and Sensing, and Robotics and Sensing. For more information visit https://ai.sony.com.\u003C/p>","2025-08-26T16:17:08.030Z","2025-08-26T16:17:09.610Z","2025-08-26T16:17:09.603Z","134",{"id":384,"name":1250,"alternativeText":13,"caption":13,"width":1251,"height":1252,"formats":1253,"hash":1277,"ext":22,"mime":25,"size":1278,"url":1279,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1280,"updatedAt":1280},"SonyAIPNGPINK3.png",3804,988,{"large":1254,"small":1260,"medium":1266,"thumbnail":1272},{"ext":22,"url":1255,"hash":1256,"mime":25,"name":1257,"path":13,"size":1258,"width":28,"height":1259},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_Sony_AIPNGPINK_3_63cb29afa1.png","large_Sony_AIPNGPINK_3_63cb29afa1","large_SonyAIPNGPINK3.png",34.63,260,{"ext":22,"url":1261,"hash":1262,"mime":25,"name":1263,"path":13,"size":1264,"width":35,"height":1265},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Sony_AIPNGPINK_3_63cb29afa1.png","small_Sony_AIPNGPINK_3_63cb29afa1","small_SonyAIPNGPINK3.png",16.39,130,{"ext":22,"url":1267,"hash":1268,"mime":25,"name":1269,"path":13,"size":1270,"width":42,"height":1271},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_Sony_AIPNGPINK_3_63cb29afa1.png","medium_Sony_AIPNGPINK_3_63cb29afa1","medium_SonyAIPNGPINK3.png",25.83,195,{"ext":22,"url":1273,"hash":1274,"mime":25,"name":1275,"path":13,"size":1276,"width":105,"height":849},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Sony_AIPNGPINK_3_63cb29afa1.png","thumbnail_Sony_AIPNGPINK_3_63cb29afa1","thumbnail_SonyAIPNGPINK3.png",7.88,"Sony_AIPNGPINK_3_63cb29afa1",34.32,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Sony_AIPNGPINK_3_63cb29afa1.png","2025-08-26T16:16:55.462Z",{"id":849,"variation":58,"button":1282},[1283],{"id":1284,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1285,"newWindow":8,"downloadable":13,"shape":13},71,"https://ai.sony/","-89",{"id":281,"name":1288,"description":1289,"createdAt":1290,"updatedAt":1291,"publishedAt":1292,"url_path_id":1293,"logo":1294,"website":1327,"url_path":1333},"AMD","\u003Cp>AMD\u003C/p>","2025-09-12T12:17:33.492Z","2025-09-12T12:17:35.944Z","2025-09-12T12:17:35.937Z","166",{"id":565,"name":1295,"alternativeText":13,"caption":13,"width":1296,"height":1297,"formats":1298,"hash":1323,"ext":954,"mime":957,"size":1324,"url":1325,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1326,"updatedAt":1326},"AMDLogo.jpg",1015,391,{"large":1299,"small":1305,"medium":1311,"thumbnail":1317},{"ext":954,"url":1300,"hash":1301,"mime":957,"name":1302,"path":13,"size":1303,"width":28,"height":1304},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_AMD_Logo_a7cfeb6311.jpg","large_AMD_Logo_a7cfeb6311","large_AMDLogo.jpg",15.51,385,{"ext":954,"url":1306,"hash":1307,"mime":957,"name":1308,"path":13,"size":1309,"width":35,"height":1310},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_AMD_Logo_a7cfeb6311.jpg","small_AMD_Logo_a7cfeb6311","small_AMDLogo.jpg",6.97,193,{"ext":954,"url":1312,"hash":1313,"mime":957,"name":1314,"path":13,"size":1315,"width":42,"height":1316},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_AMD_Logo_a7cfeb6311.jpg","medium_AMD_Logo_a7cfeb6311","medium_AMDLogo.jpg",10.75,289,{"ext":954,"url":1318,"hash":1319,"mime":957,"name":1320,"path":13,"size":1321,"width":105,"height":1322},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_AMD_Logo_a7cfeb6311.jpg","thumbnail_AMD_Logo_a7cfeb6311","thumbnail_AMDLogo.jpg",3.31,94,"AMD_Logo_a7cfeb6311",14.71,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/AMD_Logo_a7cfeb6311.jpg","2025-09-12T12:17:14.924Z",{"id":1328,"variation":58,"button":1329},67,[1330],{"id":1331,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1332,"newWindow":8,"downloadable":13,"shape":13},74,"http://amd.com","-120",{"id":603,"name":1335,"description":1336,"createdAt":1337,"updatedAt":1338,"publishedAt":1339,"url_path_id":1340,"logo":1341,"website":1368,"url_path":1373},"EDAA","\u003Cp style=\"text-align:justify;\">EDAA is a non-profit association. Its purpose is to operate for educational, scientific and technical purposes for the benefit of the international electronics design and design automation community. The Association, in the field of design and design automation of electronic circuits and systems, promotes a series of high quality technical international conferences and workshops across Europe and cooperates actively to maintain harmonious relationships with other national and international technical societies and groups promoting the purpose of the Association. EDAA is the main sponsor of DATE, the premier Design, Automation and Test Conference and Exhibition in Europe.\u003C/p>","2025-09-22T13:12:43.375Z","2025-09-22T13:12:45.344Z","2025-09-22T13:12:45.337Z","167",{"id":444,"name":1342,"alternativeText":13,"caption":13,"width":1343,"height":1344,"formats":1345,"hash":1364,"ext":954,"mime":957,"size":1365,"url":1366,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1367,"updatedAt":1367},"EDAA.jpg",992,742,{"small":1346,"medium":1352,"thumbnail":1358},{"ext":954,"url":1347,"hash":1348,"mime":957,"name":1349,"path":13,"size":1350,"width":35,"height":1351},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_EDAA_81b5e0d994.jpg","small_EDAA_81b5e0d994","small_EDAA.jpg",18.3,374,{"ext":954,"url":1353,"hash":1354,"mime":957,"name":1355,"path":13,"size":1356,"width":42,"height":1357},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_EDAA_81b5e0d994.jpg","medium_EDAA_81b5e0d994","medium_EDAA.jpg",30.46,561,{"ext":954,"url":1359,"hash":1360,"mime":957,"name":1361,"path":13,"size":1362,"width":1363,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_EDAA_81b5e0d994.jpg","thumbnail_EDAA_81b5e0d994","thumbnail_EDAA.jpg",6.19,209,"EDAA_81b5e0d994",42.3,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/EDAA_81b5e0d994.jpg","2025-09-22T13:12:27.165Z",{"id":1154,"variation":58,"button":1369},[1370],{"id":1371,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1372,"newWindow":8,"downloadable":13,"shape":13},75,"https://www.edaa.com","-121",{"id":181,"name":1045,"description":76,"createdAt":1375,"updatedAt":1376,"publishedAt":1377,"url_path_id":1378,"logo":1379,"website":1382,"url_path":1386},"2025-10-14T15:00:30.165Z","2025-10-14T15:00:49.087Z","2025-10-14T15:00:49.081Z","177",{"id":849,"name":1052,"alternativeText":13,"caption":13,"width":35,"height":1053,"formats":1380,"hash":1061,"ext":22,"mime":25,"size":1062,"url":1063,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1064,"updatedAt":1064},{"thumbnail":1381},{"ext":22,"url":1056,"hash":1057,"mime":25,"name":1058,"path":13,"size":1059,"width":105,"height":1060},{"id":1079,"variation":58,"button":1383},[1384],{"id":1385,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1069,"newWindow":8,"downloadable":13,"shape":13},76,"-129",{"id":397,"name":1243,"description":1388,"createdAt":1389,"updatedAt":1390,"publishedAt":1391,"url_path_id":1392,"logo":1393,"website":1399,"url_path":1403},"\u003Cp>Current Listing: https://ai.sony/joinus/job-roles/Research_Scientist%E2%80%93AI_for_Digital_Circuit_Design/\u003C/p>","2025-10-14T15:01:04.378Z","2025-10-27T14:05:40.570Z","2025-10-14T15:01:15.683Z","178",{"id":384,"name":1250,"alternativeText":13,"caption":13,"width":1251,"height":1252,"formats":1394,"hash":1277,"ext":22,"mime":25,"size":1278,"url":1279,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1280,"updatedAt":1280},{"large":1395,"small":1396,"medium":1397,"thumbnail":1398},{"ext":22,"url":1255,"hash":1256,"mime":25,"name":1257,"path":13,"size":1258,"width":28,"height":1259},{"ext":22,"url":1261,"hash":1262,"mime":25,"name":1263,"path":13,"size":1264,"width":35,"height":1265},{"ext":22,"url":1267,"hash":1268,"mime":25,"name":1269,"path":13,"size":1270,"width":42,"height":1271},{"ext":22,"url":1273,"hash":1274,"mime":25,"name":1275,"path":13,"size":1276,"width":105,"height":849},{"id":1239,"variation":58,"button":1400},[1401],{"id":1402,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1285,"newWindow":8,"downloadable":13,"shape":13},77,"-130",{"id":418,"name":1405,"description":76,"createdAt":1406,"updatedAt":1407,"publishedAt":1408,"url_path_id":1409,"logo":1410,"website":1441,"url_path":1445},"NVIDIA","2025-10-14T15:02:48.706Z","2025-10-14T15:03:03.820Z","2025-10-14T15:02:50.262Z","179",{"id":1265,"name":1411,"alternativeText":13,"caption":13,"width":1412,"height":1413,"formats":1414,"hash":1437,"ext":22,"mime":25,"size":1438,"url":1439,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1440,"updatedAt":1440},"NVIDIA_logo.svg.png",2560,469,{"large":1415,"small":1421,"medium":1426,"thumbnail":1432},{"ext":22,"url":1416,"hash":1417,"mime":25,"name":1418,"path":13,"size":1419,"width":28,"height":1420},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_NVIDIA_logo_svg_1ae5067cd9.png","large_NVIDIA_logo_svg_1ae5067cd9","large_NVIDIA_logo.svg.png",32.11,183,{"ext":22,"url":1422,"hash":1423,"mime":25,"name":1424,"path":13,"size":1425,"width":35,"height":346},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_NVIDIA_logo_svg_1ae5067cd9.png","small_NVIDIA_logo_svg_1ae5067cd9","small_NVIDIA_logo.svg.png",14.26,{"ext":22,"url":1427,"hash":1428,"mime":25,"name":1429,"path":13,"size":1430,"width":42,"height":1431},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_NVIDIA_logo_svg_1ae5067cd9.png","medium_NVIDIA_logo_svg_1ae5067cd9","medium_NVIDIA_logo.svg.png",21.56,137,{"ext":22,"url":1433,"hash":1434,"mime":25,"name":1435,"path":13,"size":1436,"width":105,"height":452},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_NVIDIA_logo_svg_1ae5067cd9.png","thumbnail_NVIDIA_logo_svg_1ae5067cd9","thumbnail_NVIDIA_logo.svg.png",6.37,"NVIDIA_logo_svg_1ae5067cd9",18.15,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/NVIDIA_logo_svg_1ae5067cd9.png","2025-10-14T15:02:18.862Z",{"id":1284,"variation":58,"button":1442},[1443],{"id":1117,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1444,"newWindow":8,"downloadable":13,"shape":13},"https://www.nvidia.com/en-us/","-131",{"id":288,"name":1447,"description":1448,"createdAt":1449,"updatedAt":1450,"publishedAt":1451,"url_path_id":1452,"logo":1453,"website":1486,"url_path":1490},"IBM","\u003Cp style=\"text-align:justify;\">Our dynamic global team is looking to enlist enthusiastic professionals to join world-class hardware design teams responsible for developing the most challenging and complex systems in the world. We are seeking energetic, highly-motivated individuals willing to go the extra mile with the aim of helping the overall IBM development team. Strong interpersonal skills are needed to coordinate deliverables and requirements from several areas within and outside of the organization.  There are many opportunities to gain and utilize a deep understanding of future issues and provide input towards decisions affecting system development, logical and physical design as well as sophisticated methodology directions.\u003C/p>\u003Cp style=\"text-align:justify;\"> \u003C/p>\u003Cp style=\"text-align:justify;\">Individuals who are chosen to become a part of our world class development teams will be helping advance IBM’s leadership in developing the highest performing computers and changing hardware solutions. Do you want to be an IBMer? \u003Cstrong>Come THINK with us! \u003C/strong>\u003C/p>\u003Cp style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:black;\">\u003Cstrong>All interested students can apply at:  \u003C/strong>\u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://www.ibm.com/careers__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuiv13ExN$\">\u003Cspan style=\"color:black;\">\u003Cstrong>https://www.ibm.com/careers\u003C/strong>\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 55016:       \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=55106__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYut81G66h$\">\u003Cspan style=\"color:black;\">Hardware Developer Intern: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 54841:       \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=54841__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYum4MKv3W$\">\u003Cspan style=\"color:black;\">Entry Level Hardware Developer: 2026  \u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 57950:       \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=57950__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuiwa32YB$\">\u003Cspan style=\"color:black;\">Software Engineer Intern: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 57952:       \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=57952__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYup28ftX9$\">\u003Cspan style=\"color:black;\">Entry Level Software Engineer: 2026   \u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\"> \u003C/span>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 49799:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=49799__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYupH2q6oL$\">\u003Cspan style=\"color:black;\">System and Board Design Engineer: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 64045:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=64045__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYupGbBg3j$\">\u003Cspan style=\"color:black;\">Chip & Hardware Test Technician: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 54047:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=54047__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuqt8MU7J$\">\u003Cspan style=\"color:black;\">Linux System Performance Architect: 2026\u003C/span>\u003C/a>\u003C/p>","2025-10-21T13:17:29.423Z","2025-10-25T08:26:00.917Z","2025-10-21T13:17:31.401Z","186",{"id":1454,"name":1455,"alternativeText":13,"caption":13,"width":1456,"height":1457,"formats":1458,"hash":1482,"ext":954,"mime":957,"size":1483,"url":1484,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1485,"updatedAt":1485},136,"IBM_logo_in.jpg",1783,1265,{"large":1459,"small":1465,"medium":1470,"thumbnail":1476},{"ext":954,"url":1460,"hash":1461,"mime":957,"name":1462,"path":13,"size":1463,"width":28,"height":1464},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_IBM_logo_in_e1412f8354.jpg","large_IBM_logo_in_e1412f8354","large_IBM_logo_in.jpg",32.82,709,{"ext":954,"url":1466,"hash":1467,"mime":957,"name":1468,"path":13,"size":986,"width":35,"height":1469},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_IBM_logo_in_e1412f8354.jpg","small_IBM_logo_in_e1412f8354","small_IBM_logo_in.jpg",355,{"ext":954,"url":1471,"hash":1472,"mime":957,"name":1473,"path":13,"size":1474,"width":42,"height":1475},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_IBM_logo_in_e1412f8354.jpg","medium_IBM_logo_in_e1412f8354","medium_IBM_logo_in.jpg",23.57,532,{"ext":954,"url":1477,"hash":1478,"mime":957,"name":1479,"path":13,"size":1480,"width":1481,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_IBM_logo_in_e1412f8354.jpg","thumbnail_IBM_logo_in_e1412f8354","thumbnail_IBM_logo_in.jpg",5.62,220,"IBM_logo_in_e1412f8354",56.55,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/IBM_logo_in_e1412f8354.jpg","2025-10-21T13:17:23.428Z",{"id":106,"variation":58,"button":1487},[1488],{"id":1165,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1489,"newWindow":8,"downloadable":13,"shape":13},"https://www.ibm.com/us-en","-138",{"id":578,"name":1492,"description":1493,"createdAt":1494,"updatedAt":1495,"publishedAt":1496,"url_path_id":1497,"logo":1498,"website":1529,"url_path":1534},"imec","\u003Cul>\u003Cli>Pathfinding Co-Optimization for Technology and Systems (PACTS):\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/physical-design-researcher\">Physical Design Researcher\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/team-lead-and-test-chip-architect\">ASIC Test Chip Physical Design Architect\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/power-and-thermal-integrity-researcher\">Power and Thermal Integrity Researcher\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/dtco-layout-rd-engineer\">DTCO Layout R&D Engineer\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/digital-systems-researcher-emerging-memory-technologies\">Digital Systems Researcher in Emerging Memory Technologies\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/researcher-3d-emerging-memories-dramferroigzo-2t0c\">Researcher in 3D Emerging Memories (DRAM/Ferro/IGZO 2T0C)\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/compact-modelling-engineer\">Compact Modelling Engineer\u003C/a>\u003C/li>\u003C/ul>\u003C/li>\u003Cli>Compute Systems Architectures (CSA):\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/soc-designer-architect\">SoC Designer/ Architect\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/principal-ai-high-performance-computing-architect\">AI + HPC hardware performance researcher\u003C/a>\u003C/li>\u003C/ul>\u003C/li>\u003C/ul>\u003Cp style=\"margin-left:15px;\">\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities?type=academic&filters%5B0%5D=%2Fjob_employment_type%2Fphd\">Interested in a PhD at imec? Please check out the PhD opportunities here!\u003C/a>\u003C/p>","2025-10-21T13:18:36.674Z","2025-10-21T15:25:14.744Z","2025-10-21T13:18:39.994Z","187",{"id":1431,"name":1499,"alternativeText":13,"caption":13,"width":1412,"height":1500,"formats":1501,"hash":1525,"ext":22,"mime":25,"size":1526,"url":1527,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1528,"updatedAt":1528},"LOGO-IMEC_black.svg.png",1281,{"large":1502,"small":1507,"medium":1513,"thumbnail":1519},{"ext":22,"url":1503,"hash":1504,"mime":25,"name":1505,"path":13,"size":1506,"width":28,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_LOGO_IMEC_black_svg_04c5c3f74a.png","large_LOGO_IMEC_black_svg_04c5c3f74a","large_LOGO-IMEC_black.svg.png",19.55,{"ext":22,"url":1508,"hash":1509,"mime":25,"name":1510,"path":13,"size":1511,"width":35,"height":1512},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_LOGO_IMEC_black_svg_04c5c3f74a.png","small_LOGO_IMEC_black_svg_04c5c3f74a","small_LOGO-IMEC_black.svg.png",8.83,250,{"ext":22,"url":1514,"hash":1515,"mime":25,"name":1516,"path":13,"size":1517,"width":42,"height":1518},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_LOGO_IMEC_black_svg_04c5c3f74a.png","medium_LOGO_IMEC_black_svg_04c5c3f74a","medium_LOGO-IMEC_black.svg.png",13.43,375,{"ext":22,"url":1520,"hash":1521,"mime":25,"name":1522,"path":13,"size":1523,"width":105,"height":1524},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_LOGO_IMEC_black_svg_04c5c3f74a.png","thumbnail_LOGO_IMEC_black_svg_04c5c3f74a","thumbnail_LOGO-IMEC_black.svg.png",4.32,123,"LOGO_IMEC_black_svg_04c5c3f74a",12.04,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/LOGO_IMEC_black_svg_04c5c3f74a.png","2025-10-21T13:18:30.374Z",{"id":1530,"variation":58,"button":1531},73,[1532],{"id":1203,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1533,"newWindow":8,"downloadable":13,"shape":13},"https://www.imec-int.com/en/work-at-imec/job-opportunities?type=career&filters%5B0%5D=%2Fjob_region%2Fbelgium&filters%5B1%5D=%2Fjob_region%2Fcambridge-uk&filters%5B2%5D=%2Fjob_region%2Fgermany&filters%5B3%5D=%2Fjob_employment_type%2Fpermanent-contract","-139",{"id":236,"name":1536,"description":76,"createdAt":1537,"updatedAt":1538,"publishedAt":1539,"url_path_id":1540,"logo":1541,"website":1556,"url_path":1561},"Peking University","2025-10-27T12:31:39.034Z","2025-10-27T12:31:40.885Z","2025-10-27T12:31:40.874Z","196",{"id":1542,"name":1543,"alternativeText":13,"caption":13,"width":1544,"height":1545,"formats":1546,"hash":1552,"ext":954,"mime":957,"size":1553,"url":1554,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1555,"updatedAt":1555},143,"images.jpg",300,168,{"thumbnail":1547},{"ext":954,"url":1548,"hash":1549,"mime":957,"name":1550,"path":13,"size":1551,"width":105,"height":1431},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_images_1d87fa6eb4.jpg","thumbnail_images_1d87fa6eb4","thumbnail_images.jpg",6.48,"images_1d87fa6eb4",8.42,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/images_1d87fa6eb4.jpg","2025-10-27T12:31:24.079Z",{"id":1331,"variation":58,"button":1557},[1558],{"id":1559,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1560,"newWindow":8,"downloadable":13,"shape":13},81,"https://english.pku.edu.cn/","-147",{"id":256,"name":1288,"description":1563,"createdAt":1564,"updatedAt":1565,"publishedAt":1566,"url_path_id":1567,"logo":1568,"website":1574,"url_path":1577},"\u003Cp>Current Listings: \u003C/p>\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://confcats-event-sessions.s3.us-east-1.amazonaws.com/iccad25/uploads/EDA-Router.pdf\">EDA-Router\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://confcats-event-sessions.s3.us-east-1.amazonaws.com/iccad25/uploads/EDA-Timing.pdf\">EDA-Timing\u003C/a>\u003C/li>\u003C/ul>","2025-10-27T12:37:12.998Z","2025-10-27T12:41:59.179Z","2025-10-27T12:41:59.171Z","197",{"id":565,"name":1295,"alternativeText":13,"caption":13,"width":1296,"height":1297,"formats":1569,"hash":1323,"ext":954,"mime":957,"size":1324,"url":1325,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1326,"updatedAt":1326},{"large":1570,"small":1571,"medium":1572,"thumbnail":1573},{"ext":954,"url":1300,"hash":1301,"mime":957,"name":1302,"path":13,"size":1303,"width":28,"height":1304},{"ext":954,"url":1306,"hash":1307,"mime":957,"name":1308,"path":13,"size":1309,"width":35,"height":1310},{"ext":954,"url":1312,"hash":1313,"mime":957,"name":1314,"path":13,"size":1315,"width":42,"height":1316},{"ext":954,"url":1318,"hash":1319,"mime":957,"name":1320,"path":13,"size":1321,"width":105,"height":1322},{"id":1371,"variation":58,"button":1575},[1576],{"id":384,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1332,"newWindow":8,"downloadable":13,"shape":13},"-148",{"id":373,"name":1158,"description":1579,"createdAt":1580,"updatedAt":1581,"publishedAt":1582,"url_path_id":1583,"logo":1584,"website":1589,"url_path":1592},"\u003Col>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/PhD-Candidate-in-Functional-Safety-for-AI-Accelerators---Contract-Duration-3-Years--f-m-d-_R50111__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbzvEYM8EA$\">Ph.D. Candidate in Functional Safety for AI Accelerators - Contract Duration 3 Years (f/m/d), Munich - Germany\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/Lead-Application-Engineer_R50649-1__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbyfv2PFvw$\">Lead Application Engineer, Munich - Germany\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/Sr-Application-Engineer--f-m-d-_R51515__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbwEgEx6AQ$\">Sr. Application Engineer (f/m/d), Munich - Germany\u003C/a>\u003C/li>\u003C/ol>","2025-10-28T09:19:43.567Z","2025-10-29T07:09:08.732Z","2025-10-28T09:19:58.006Z","198",{"id":1165,"name":1166,"alternativeText":13,"caption":13,"width":1167,"height":1168,"formats":1585,"hash":1186,"ext":22,"mime":25,"size":1187,"url":1188,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1189,"updatedAt":1189},{"small":1586,"medium":1587,"thumbnail":1588},{"ext":22,"url":1171,"hash":1172,"mime":25,"name":1173,"path":13,"size":1174,"width":35,"height":584},{"ext":22,"url":1176,"hash":1177,"mime":25,"name":1178,"path":13,"size":1179,"width":42,"height":1180},{"ext":22,"url":1182,"hash":1183,"mime":25,"name":1184,"path":13,"size":1185,"width":105,"height":143},{"id":1385,"variation":58,"button":1590},[1591],{"id":404,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1193,"newWindow":8,"downloadable":13,"shape":13},"-149",{"pagination":1594},{"page":5,"pageSize":373,"pageCount":69,"total":320},{"id":418,"heading":413,"pageHeader":1596,"sections":1598},{"id":418,"description":1597,"showPageHeader":8,"backgroundColor":81,"image":13}," ",[1599],{"id":69,"__component":1600,"componentVariation":1601,"contactsVariation":1602,"styles":13,"header":13,"sessionsGroup":1603},"content.sessions","Sessions Base","Card Contact Base",[1604],{"id":69,"groupTitle":13,"sessions":1605},[1606,1616,1627,1638,1648,1658,1669,1679,1689,1700,1711,1721,1731,1741],{"id":57,"session":1607},{"id":112,"title":1608,"teaser":1609,"body":76,"createdAt":1610,"updatedAt":1611,"publishedAt":1612,"url_path_id":1613,"contacts":1614,"url_path":1615},"2025 CAD Contest at ICCAD","\u003Cp style=\"text-align:justify;\">The CAD Contest at ICCAD (https://iccad-contest.org/) is a challenging, multi-month, research & development competition, focusing on advanced, real-world problems in the field of Electronic Design Automation (EDA). Contestants can participate in one or more problems provided by the EDA/IC industry. The winners will be awarded at an ICCAD special session dedicated to this contest. Since 2012, the CAD Contest at ICCAD has been attracting more than a hundred teams per year, fostering productive industry-academia collaborations, and leading to hundreds of publications in top-tier conferences and journals. The contest keeps enhancing its impact and boosts EDA research.\u003C/p>","2025-06-10T18:54:47.242Z","2025-06-10T18:54:49.038Z","2025-06-10T18:54:49.027Z","71",[],"-42",{"id":170,"session":1617},{"id":69,"title":1618,"teaser":1619,"body":1620,"createdAt":1621,"updatedAt":1622,"publishedAt":1623,"url_path_id":1624,"contacts":1625,"url_path":1626},"Bridging the Gap: Design Automation Meets Microfluidics","\u003Cp style=\"text-align:justify;\">Microfluidic devices, also known as Labs-on-a-Chip (LOCs), offer a convenient and cost-effective solution for high-throughput biochemical and medical experiments on miniaturized platforms. Recent advancements in the field have reached a new level of sophistication, including innovative diagnostic assays driven by the COVID-19 pandemic, organ-on-chip systems that mimic the physiological functions of human bodies, new manufacturing possibilities, and the emergence of ISO standards. These developments have led to more powerful microfluidic devices but, at the same time, present significant challenges for designers: precise dimensioning, placing, and routing of components and channels, accurate injection of samples and chemicals, as well as timely initiation of processes such as mixing, heating, or incubation. \u003C/p>","\u003Cp style=\"text-align:justify;\">Overall, designing microfluidic devices today involves complexities akin to those in conventional circuit and system design. Yet, designers of these devices lack access to the advanced design tools that are standard in conventional circuit and system design, often resorting to manual, intricate, and time-consuming methods. Obviously, the design automation community has the perfect background and expertise to address these needs. In fact, over the past 1-2 decades, significant contributions have been made in developing methods and tools for the automatic design of microfluidic systems. Yet, despite these efforts and the potential they hold, the influence of design automation in the design of microfluidic devices remains underutilized. A major reason for this unfortunate situation is that many of these tools have addressed the wrong problems, ignored underlying physical and practical needs, or lacked user-friendly interfaces, making them either not useful or too complicated for non-design-automation experts. This is also due to a lack of communication and collaboration between the design automation and microfluidic fields, resulting in tools and methods that have not been established in the microfluidics community. This special session aims to overcome the current disconnect by bringing together experts from both fields and bridging advanced design automation with practical microfluidic applications. To this end, we have secured speakers covering the full spectrum: a microfluidics expert who will provide insights into the tasks and challenges of designing microfluidic devices (using organ-on-chip systems as an example), developers behind a publicly available software framework that introduces design automation for microfluidic devices while considering the actual demands and design guidelines from microfluidics experts, and a design automation expert who has successfully realized a general-purpose Lab-on-Chip by properly adapting design automation tools. Together, they will offer a comprehensive introduction and review of the full spectrum of needs and currently available solutions – from the initial specification of a microfluidic device, through tool development, to fabrication and testing. The talks will be followed by an extensive Q&A/panel session with the speakers and the audience to initiate a discussion on how design automation and microfluidics can collaborate to establish effective design automation for microfluidics. Overall, this session will generate further momentum towards achieving the goal of establishing Design Automation for Microfluidics.\u003C/p>","2025-06-10T18:52:07.944Z","2025-06-10T18:52:09.897Z","2025-06-10T18:52:09.885Z","67",[],"-38",{"id":151,"session":1628},{"id":157,"title":1629,"teaser":1630,"body":1631,"createdAt":1632,"updatedAt":1633,"publishedAt":1634,"url_path_id":1635,"contacts":1636,"url_path":1637},"Hardware-Software Co-Design for highly Optimized, Customized, and Reliable AI Systems","\u003Cp style=\"text-align:justify;\">Traditional hardware-software (HW-SW) co-design methods, well established through languages like C/C++, SystemC, and tools for performance analysis and co-simulation, face significant challenges in meeting the demands of AI systems, where hardware and software are more tightly intertwined than ever. To fully leverage the potential of AI, a unified AI co-design loop is needed that integrates both hardware and software perspectives, optimizing for performance, power, and reliability. AI-focused co-design holds the promise of significant advancements, especially in the context of embedded AI systems in resource-limited devices. By tailoring hardware for specific AI tasks and refining AI algorithms to fit hardware constraints, co-design can drive energy efficiency far beyond what is achievable with conventional GPUs, potentially leading to orders of magnitude higher efficiency compared to current AI systems. \u003C/p>","\u003Cp style=\"text-align:justify;\">However, challenges remain, such as integrating AI and hardware tools, managing discrete hardware choices within continuous AI optimization, improving HW-SW co-simulation for complex AI-driven systems, and ensuring system reliability. Reliability is particularly critical in AI systems, as both hardware and software need to work seamlessly under demanding conditions. A key challenge is mitigating silent data corruption (SDC), where undetected errors in computation can lead to unpredictable behavior. These errors can be introduced at the hardware level, such as through memory faults, or arise from the software side, including issues with algorithmic correctness. Ensuring that AI systems are resilient will be the central focus of this session. This session will address these challenges while also highlighting opportunities for significantly more efficient and reliable AI systems. It will explore the potential for customized AI solutions that push the boundaries of energy efficiency, dynamic reconfiguration, and IP protection, offering valuable insights for ICCAD attendees. By exploring this modernized HW-SW co-design paradigm, attendees from both academia and industry will gain actionable strategies to bridge the current separation between AI hardware and software design, fostering breakthroughs in efficiency, reliability, and scalability.\u003C/p>","2025-06-10T18:57:46.328Z","2025-06-10T18:57:48.361Z","2025-06-10T18:57:48.356Z","76",[],"-47",{"id":112,"session":1639},{"id":5,"title":1640,"teaser":1641,"body":76,"createdAt":1642,"updatedAt":1643,"publishedAt":1644,"url_path_id":1645,"contacts":1646,"url_path":1647},"EDA from GPU Acceleration to GPU Exploration","\u003Cp style=\"text-align:justify;\">In recent years, many GPU-accelerated EDA algorithms have been introduced, demonstrating runtime speedups of hundreds to thousands of times for specific stages in the EDA flow. Beyond runtime improvements, this special session will explore various GPU adoption models in the EDA flow that also enhance design quality, particularly in terms of power and area reduction. The session will feature a total of five talks. Three of these are invited presentations from industry leaders—Cadence, Synopsys, and Siemens—who will showcase their production-ready, GPU-based EDA solutions. The remaining two talks are from academic research groups, offering insights into emerging GPU adoption models with the potential to further improve EDA design quality.\u003C/p>","2025-06-10T18:51:29.951Z","2025-06-10T18:51:31.490Z","2025-06-10T18:51:31.483Z","66",[],"-37",{"id":115,"session":1649},{"id":115,"title":1650,"teaser":1651,"body":76,"createdAt":1652,"updatedAt":1653,"publishedAt":1654,"url_path_id":1655,"contacts":1656,"url_path":1657},"Unlocking the benefits of heterogeneous 3D scaling: a major EDA challenge","\u003Cp style=\"text-align:justify;\">Chip technology is a foundational enabler across diverse sectors such as automotive, telecommunications, finance, and healthcare. Continued progress in computing performance, efficiency, and functionality has been driven by advances in technology scaling and architecture. However, five major challenges—scaling, memory, power, sustainability, and cost—are now limiting the effectiveness of traditional CMOS design methods at advanced nodes. These limitations demand a fundamental shift in design and technology approaches to meet the increasing performance and efficiency requirements of future applications. This session introduces CMOS 2.0, a new paradigm driven by system technology co-optimization (STCO), where technology and system design are developed in tandem. CMOS 2.0 breaks with the legacy of monolithic scaling by enabling heterogeneous integration through 2.5D and 3D technologies, including chiplet architectures, wafer backside processing, hybrid bonding, and sequential 3D integration. These innovations allow system designers to assign different chip functions—logic, memory, power delivery—into specialized stacked layers, optimizing for performance, energy, and area across a wide variety of workloads. To fully realize the benefits of CMOS 2.0, a corresponding revolution in Electronic Design Automation (EDA) is required. This session will explore the emerging methodologies and tools needed to exploit the expanded design space offered by advanced heterogeneous integration and STCO. It will bring together leading experts to discuss challenges and opportunities in reshaping EDA for CMOS 2.0, offering ICCAD attendees deep insights and practical strategies to drive innovation in the next era of semiconductor design.\u003C/p>","2025-06-10T18:55:11.225Z","2025-06-10T18:55:13.083Z","2025-06-10T18:55:13.078Z","72",[],"-43",{"id":79,"session":1659},{"id":270,"title":1660,"teaser":1661,"body":1662,"createdAt":1663,"updatedAt":1664,"publishedAt":1665,"url_path_id":1666,"contacts":1667,"url_path":1668},"Security Challenges and Opportunities in In-Sensor Computing Systems","\u003Cp>Traditionally, massive sensor data are continuously collected to support external processing like Artificial Intelligence (AI)-based analysis and prediction, which consumes significant power and introduces delays. To address this limitation, we need a sensing system that is power-efficient, compact, and capable of processing large amounts of data in real time without sacrificing accuracy. One promising direction is to enable sensing units to offer additional computing capability than a simple sensor. In-Sensor Computing (ISC) emerges as a new computation paradigm to address the increasing concern on latency and energy consumption in sensory data transmission, analog-to-digital conversion (ADC), and data pre-processing. Existing literature for ISC mainly investigates the materials and device structure to implement desired functions, pursue better performance, and examine the feasible integration technologies. While offering significant benefits in performance improvement and power saving, in-sensor computing could also bring new security challenges. Unfortunately, limited work is available to study new threats and unique attack surfaces for ISC systems. This special session fills this gap.\u003C/p>","\u003Cp>The goal of this special session is to (1) discuss the security challenges and unexplored opportunities in analog computing systems, with special emphasis on in-sensor computing, and their applications, (2) present the start-of-the-art attack cases and countermeasures to resist the envisioned security threats, (3) brainstorm the future research directions that aim to strengthen the security attack resistance in analog computing applications, and (4) foster interests and collaboration among the ICCAD community to develop EDA tools and design guidelines for the emerging in-sensor computing systems.\u003C/p>","2025-06-10T18:57:12.008Z","2025-06-10T18:57:13.652Z","2025-06-10T18:57:13.646Z","75",[],"-46",{"id":206,"session":1670},{"id":641,"title":1671,"teaser":1672,"body":76,"createdAt":1673,"updatedAt":1674,"publishedAt":1675,"url_path_id":1676,"contacts":1677,"url_path":1678},"Agile and Open Hardware Design and Verification","\u003Cp style=\"text-align:justify;\">Compared to software design, hardware design is more expensive and time-consuming. The software development flow is agile partly because software engineers can leverage a rich set of open source tools such as runtime, middleware, etc., to get projects started and iterated easily and quickly. On the hardware side, the agile and open hardware ecosystem is rising thanks to the open ISA RISC-V and other emerging open EDA and IP tools. This not only saves costs, widens the design scope of hardware, but also provides a great opportunity for hardware innovation and creativity by designing and verifying custom hardware for different needs. This special session is formulated to be as broadly interesting and useful as possible to students, researchers and faculty, and to practice engineering in both EDA and hardware design area. This session is 2 hours, consisting of five talks. The first talk presents a machine learning accelerator design as RISC-V extension using an open source flow. The second talk develops an open CGRA framework. The third talk presents an FPGA-based open source RISC-V emulation platform. The fourth talk presents an agile hardware testing framework based on reinforcement learning. The last talk introduces an open-Source ASIP design framework.\u003C/p>","2025-06-10T18:59:29.207Z","2025-06-10T18:59:31.193Z","2025-06-10T18:59:31.185Z","79",[],"-50",{"id":270,"session":1680},{"id":57,"title":1681,"teaser":1682,"body":76,"createdAt":1683,"updatedAt":1684,"publishedAt":1685,"url_path_id":1686,"contacts":1687,"url_path":1688},"Fueling the Future: Achieving Reliable and Generalizable Data Foundations for LLMs in EDA","\u003Cp style=\"text-align:justify;\">Large language models (LLMs) have demonstrated significant potential for enhancing electronic design automation (EDA), particularly in design interpretation and automation workflows. However, practical deployment remains hindered by fundamental data-related obstacles, notably the scarcity of high-quality and standardized datasets. Unlike other domains benefiting from widely available datasets, EDA data are typically fragmented across diverse tools and abstraction layers. Furthermore, synthetic datasets, while widely used, frequently fail to represent the complexities in realistic hardware design, limiting model reliability and generalization. This session brings together leading experts from both academia and industry to address pressing data challenges across the EDA workflow—from RTL to layout, and from design to manufacturing. The goal is to develop robust data generation methods, establish reliable data infrastructures, and curate representative datasets that reflect the complexity of real-world hardware designs. These efforts are critical to building scalable and trustworthy LLM applications that can support next-generation intelligent EDA tools and tackle the growing complexity of modern hardware systems.\u003C/p>","2025-06-10T18:52:34.441Z","2025-06-10T18:52:36.368Z","2025-06-10T18:52:36.363Z","68",[],"-39",{"id":157,"session":1690},{"id":136,"title":1691,"teaser":1692,"body":1693,"createdAt":1694,"updatedAt":1695,"publishedAt":1696,"url_path_id":1697,"contacts":1698,"url_path":1699},"Circuit and Architecture Design with Emerging Computing Paradigms","\u003Cp style=\"text-align:justify;\">As emerging computing paradigms push beyond the limitations of traditional CMOS-based computing using Von Neumann architectures, there is a growing need to rethink and extend Electronic Design Automation (EDA) methodologies to support their unique characteristics. These paradigms—including application-specific approximate computing, reconfigurable and secure logic using Reconfigurable Field-Effect Transistors (RFETs), in-memory computing with non-volatile memory technologies, and photonic analog wavefront computing—represent diverse and promising directions beyond conventional digital design. Collectively, they offer transformative potential for achieving significant improvements in energy efficiency, computational speed, and architectural scalability. For example, application-specific approximate computing enables the design of custom arithmetic circuits that exploit application-level error resilience, allowing for optimized accuracy–power–performance–area (PPA) trade-offs in error-tolerant applications. \u003C/p>","\u003Cp style=\"text-align:justify;\">Similarly, the intrinsic polymorphism of RFETs supports compact, multifunctional logic gates and introduces new opportunities for circuit-level obfuscation and security-aware design. Processing in non-volatile memories, such as those based on ferroelectric field-effect transistors (FeFETs), enhances energy efficiency by enabling analog computation—particularly for operations like matrix multiplication—directly within the memory arrays. Likewise, photonic analog wavefront computing offers substantial gains in latency and energy efficiency by encoding and processing information in the analog optical domain, leveraging phenomena such as diffraction and interference to perform computation at the speed of light. However, they also introduce a host of new challenges in circuit and architecture design, such as vast and irregular design spaces, analog and non-Boolean behavior, and new device-level constraints that existing EDA tools are not capable of handling. To this end, this special session focuses on developing efficient and robust EDA frameworks that can enable the practical realization of circuits and architectures in these emerging domains.\u003C/p>","2025-06-10T18:58:24.726Z","2025-06-10T18:58:26.756Z","2025-06-10T18:58:26.751Z","77",[],"-48",{"id":136,"session":1701},{"id":281,"title":1702,"teaser":1703,"body":1704,"createdAt":1705,"updatedAt":1706,"publishedAt":1707,"url_path_id":1708,"contacts":1709,"url_path":1710},"System-Level Design for Chiplets: Architecture Exploration and Resource Management","\u003Cp style=\"text-align:justify;\">As the chip manufacturing node approaches the diameter of silicon atoms, reduction in transistor size becomes unsustainable, faced with severe challenges in yield, power consumption, performance, and cost. Integrating chiplets into one package has emerged as a promising solution to further increase the computing capabilities of chips by a few orders of magnitude. It relies on mature manufacturing processes, hence gaining significant advantages in yield protection and agile design without tape-out, exploits heterogeneity of chiplets to support customized design for different application requirements, and possesses ease of use and power savings through advanced packaging.\u003C/p>\u003Cp style=\"text-align:justify;\">With the interconnection and packaging technologies being heavily invested to build the physical foundation, the focus is moving upwards to the system level, which determines whether the heterogeneous chiplets can cooperate efficiently without any bottlenecks in resource access. It involves architecture exploration and resource management at the chiplet level, which are both new research directions interacting with each other, while the design of individual chiplets will have converged.\u003C/p>","\u003Cp style=\"text-align:justify;\">This session is comprised of four technical talks from four leading companies of its kind: Intel for chip design and manufacturing, Synopsys developing design automation tools, Visionary Always as a start-up providing systems that manage all types of resources on heterogeneous chiplets, and Bosch representing end users. The first talk from Tanay Karnik, Senior Principal Engineer and Director of Heterogeneous Platforms Lab at Intel, will present an architectural and design space exploration methodology tailored for passive interposer-based 2.5D disaggregated systems. The second talk from Tim Kogel, Senior Director for Technical Product Management at Synopsys, will describe AI-driven design space exploration and analysis for the multi-die architecture, involving both methodology and tools. The third talk from Wanli Chang, Founder of Visionary Always, will discuss how to manage access to various kinds of resources on heterogeneous chiplets and resolve contention, under different types of workloads that are often dynamic and sometimes have discrepant requirements. The fourth talk from Falk Rehm, Senior Manager and Senior Expert in the field of embedded AI and HW/SW Co-Design at the Bosch Center of Artificial Intelligence, will report the rise of chiplet-based systems in the automotive sector, emphasizing on rapid performance evaluation in the early design stage.\u003C/p>\u003Cp style=\"text-align:justify;\">The targeted audience include academics and practitioners working in chiplets, especially with a focus on system architecture, design automation tools, advanced packaging, heterogeneous resource management, and simulation, as well as end users.\u003C/p>","2025-06-10T19:00:43.332Z","2025-06-10T19:00:45.681Z","2025-06-10T19:00:45.677Z","81",[],"-52",{"id":193,"session":1712},{"id":170,"title":1713,"teaser":1714,"body":76,"createdAt":1715,"updatedAt":1716,"publishedAt":1717,"url_path_id":1718,"contacts":1719,"url_path":1720},"Cross-Layer Design for Health-Centric AI Systems: Models, Platforms, and Emerging Hardware","\u003Cp style=\"text-align:justify;\">This special session presents a full-stack perspective on AI-driven technologies for healthcare and wellbeing, spanning from hardware innovation and AI model optimization to intelligent orchestration across edge–fog–cloud systems. It opens with the development of Edge Language Models (ELMs), a new class of compressed LLMs designed for real-time interpretation of radiology findings on edge devices, addressing the pressing need for intelligent, low-latency clinical support at the point of care. Enabling such models to function reliably in dynamic, resource-constrained environments requires system-level intelligence—addressed in the second talk through the Mindful AI framework, which dynamically balances accuracy, energy, and latency to ensure robust and personalized operation in pervasive health applications. However, deploying these intelligent systems in real-world, body-integrated scenarios also demands hardware that goes beyond conventional silicon. The third talk addresses this by presenting an end-to-end design framework for flexible healthcare wearables, offering biocompatible, sustainable, and conformable solutions suited for extreme-edge applications such as smart patches and implantables. Bringing the stack full circle, the final talk introduces a multi-agent, LLM-driven EDA flow that automates the design of flexible and printed electronics—empowering non-experts to design custom hardware. Together, these talks illustrate how emerging technologies such as large language models and flexible electronics can be cohesively integrated to create intelligent, sustainable, and human-centered healthcare solutions—perfectly aligned with ICCAD's mission to advance cross-disciplinary design automation.\u003C/p>","2025-06-10T18:52:58.808Z","2025-06-10T18:53:00.644Z","2025-06-10T18:53:00.638Z","69",[],"-40",{"id":641,"session":1722},{"id":151,"title":1723,"teaser":1724,"body":76,"createdAt":1725,"updatedAt":1726,"publishedAt":1727,"url_path_id":1728,"contacts":1729,"url_path":1730},"Privacy-Preserving Deep Learning in the LLM Era: Algorithm, Protocol, and Hardware","\u003Cp style=\"text-align:justify;\">The last two years have witnessed the rapid evolution of large language models (LLMs). While data serves as the foundation for such evolution, it also faces ever-increasing privacy risks, including data breaches, leakage, misuse, etc, as existing LLM services on the cloud heavily rely on the availability of plaintext prompts. Privacy-preserving deep learning (PPDL) has thus been proposed and has recently attracted increasing attention from both industry and academia. By leveraging cryptographic primitives like homomorphic encryption (HE), multi-party computation (MPC), zero-knowledge proof (ZKP), etc, PPDL achieves a formal privacy guarantee during DL computation. However, PPDL usually suffers from orders of magnitude latency overhead due to high computation and communication costs, hindering its practical usage in real-world applications. This special session presents a full stack of techniques across the algorithm, protocol, and hardware levels to narrow the efficiency gap of PPDL. For this purpose, we have invited esteemed experts from the University of California San Diego (USCD), New York University (NYU), North Carolina State University (NCSU), Peking University (PKU), and Tsinghua University (THU) to join the special session. The session will present four in-depth talks on efficient PPDL: UCSD and THU will focus on the hardware/algorithm co-design, while NYU and NCSU will focus on the co-optimization of the LLM algorithms and PPDL protocols. By fostering an interdisciplinary dialogue, this session not only presents to the audience the recent progress of PPDL but also encourages discussion on the challenges and opportunities of PPDL.\u003C/p>","2025-06-10T18:53:22.490Z","2025-06-10T18:53:24.426Z","2025-06-10T18:53:24.418Z","70",[],"-41",{"id":689,"session":1732},{"id":79,"title":1733,"teaser":1734,"body":76,"createdAt":1735,"updatedAt":1736,"publishedAt":1737,"url_path_id":1738,"contacts":1739,"url_path":1740},"Generative AI for At-Scale and Unconventional Analog/RFIC Design and Automation","\u003Cp style=\"text-align:justify;\">Analog/radio-frequency (RF) integrated circuit (IC) design automation has been a longstanding challenge. Recent breakthroughs in generative artificial intelligence (AI) offer transformative opportunities to tackle complex, large-scale analog/RF IC design tasks beyond traditional methods. This special session gathers leading researchers to showcase cutting-edge advancements, from highly efficient inverse design methods to innovative discoveries of unconventional RF passive devices and active analog topologies. These timely developments will set the stage for scalable and extensive use of generative AI in analog/RF IC design, broadly benefiting researchers and engineers in analog/RF IC design, electronic design automation (EDA), and AI/ML communities.\u003C/p>","2025-06-10T18:55:59.744Z","2025-06-10T18:56:01.425Z","2025-06-10T18:56:01.418Z","73",[],"-44",{"id":281,"session":1742},{"id":689,"title":1743,"teaser":1744,"body":76,"createdAt":1745,"updatedAt":1746,"publishedAt":1747,"url_path_id":1748,"contacts":1749,"url_path":1750},"Reimagining Scientific Computing with Neuromorphic and Analog Systems","\u003Cp style=\"text-align:justify;\">Neuromorphic computing, by mimicking the brain behavior, promises to provide highly energy efficient processing of large amounts of data. These systems can have profound impact in Scientific Computing applications, being them sensing applications that require low latency processing or modeling and simulation. In this special session, we plan to discuss the challenges, needs, and opportunities to realize the necessary co-design stack that will make neuromorphic computing effective for scientific problems. We will discuss exemplar scientific computing applications, promising neuromorphic primitives that could enable mapping such broad set of applications, the analog computing aspects underpinning the realization of such neuromorphic primitives, and highlight the necessity of testbed to drive the development of such systems.\u003C/p>","2025-06-10T18:59:56.851Z","2025-06-10T18:59:58.678Z","2025-06-10T18:59:58.674Z","80",[],"-51",{"data":1752,"meta":1753},{"id":418,"heading":413,"createdAt":419,"updatedAt":420,"publishedAt":421,"url_path_id":422,"url_path":425,"contentType":141},{},1778852556750]