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To achieve this, Sony AI is working across six Flagship Projects that are aimed at the evolution and application of AI technology in the areas of AI for Creators, Gaming and Interactive Agents, Ethics, Scientific Discovery, Imaging and Sensing, and Robotics and Sensing. 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Its purpose is to operate for educational, scientific and technical purposes for the benefit of the international electronics design and design automation community. The Association, in the field of design and design automation of electronic circuits and systems, promotes a series of high quality technical international conferences and workshops across Europe and cooperates actively to maintain harmonious relationships with other national and international technical societies and groups promoting the purpose of the Association. EDAA is the main sponsor of DATE, the premier Design, Automation and Test Conference and Exhibition in Europe.\u003C/p>","2025-09-22T13:12:43.375Z","2025-09-22T13:12:45.344Z","2025-09-22T13:12:45.337Z","167",{"id":444,"name":1342,"alternativeText":13,"caption":13,"width":1343,"height":1344,"formats":1345,"hash":1364,"ext":954,"mime":957,"size":1365,"url":1366,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1367,"updatedAt":1367},"EDAA.jpg",992,742,{"small":1346,"medium":1352,"thumbnail":1358},{"ext":954,"url":1347,"hash":1348,"mime":957,"name":1349,"path":13,"size":1350,"width":35,"height":1351},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_EDAA_81b5e0d994.jpg","small_EDAA_81b5e0d994","small_EDAA.jpg",18.3,374,{"ext":954,"url":1353,"hash":1354,"mime":957,"name":1355,"path":13,"size":1356,"width":42,"height":1357},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_EDAA_81b5e0d994.jpg","medium_EDAA_81b5e0d994","medium_EDAA.jpg",30.46,561,{"ext":954,"url":1359,"hash":1360,"mime":957,"name":1361,"path":13,"size":1362,"width":1363,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_EDAA_81b5e0d994.jpg","thumbnail_EDAA_81b5e0d994","thumbnail_EDAA.jpg",6.19,209,"EDAA_81b5e0d994",42.3,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/EDAA_81b5e0d994.jpg","2025-09-22T13:12:27.165Z",{"id":1154,"variation":58,"button":1369},[1370],{"id":1371,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1372,"newWindow":8,"downloadable":13,"shape":13},75,"https://www.edaa.com","-121",{"id":181,"name":1045,"description":76,"createdAt":1375,"updatedAt":1376,"publishedAt":1377,"url_path_id":1378,"logo":1379,"website":1382,"url_path":1386},"2025-10-14T15:00:30.165Z","2025-10-14T15:00:49.087Z","2025-10-14T15:00:49.081Z","177",{"id":849,"name":1052,"alternativeText":13,"caption":13,"width":35,"height":1053,"formats":1380,"hash":1061,"ext":22,"mime":25,"size":1062,"url":1063,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1064,"updatedAt":1064},{"thumbnail":1381},{"ext":22,"url":1056,"hash":1057,"mime":25,"name":1058,"path":13,"size":1059,"width":105,"height":1060},{"id":1079,"variation":58,"button":1383},[1384],{"id":1385,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1069,"newWindow":8,"downloadable":13,"shape":13},76,"-129",{"id":397,"name":1243,"description":1388,"createdAt":1389,"updatedAt":1390,"publishedAt":1391,"url_path_id":1392,"logo":1393,"website":1399,"url_path":1403},"\u003Cp>Current Listing: https://ai.sony/joinus/job-roles/Research_Scientist%E2%80%93AI_for_Digital_Circuit_Design/\u003C/p>","2025-10-14T15:01:04.378Z","2025-10-27T14:05:40.570Z","2025-10-14T15:01:15.683Z","178",{"id":384,"name":1250,"alternativeText":13,"caption":13,"width":1251,"height":1252,"formats":1394,"hash":1277,"ext":22,"mime":25,"size":1278,"url":1279,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1280,"updatedAt":1280},{"large":1395,"small":1396,"medium":1397,"thumbnail":1398},{"ext":22,"url":1255,"hash":1256,"mime":25,"name":1257,"path":13,"size":1258,"width":28,"height":1259},{"ext":22,"url":1261,"hash":1262,"mime":25,"name":1263,"path":13,"size":1264,"width":35,"height":1265},{"ext":22,"url":1267,"hash":1268,"mime":25,"name":1269,"path":13,"size":1270,"width":42,"height":1271},{"ext":22,"url":1273,"hash":1274,"mime":25,"name":1275,"path":13,"size":1276,"width":105,"height":849},{"id":1239,"variation":58,"button":1400},[1401],{"id":1402,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1285,"newWindow":8,"downloadable":13,"shape":13},77,"-130",{"id":418,"name":1405,"description":76,"createdAt":1406,"updatedAt":1407,"publishedAt":1408,"url_path_id":1409,"logo":1410,"website":1441,"url_path":1445},"NVIDIA","2025-10-14T15:02:48.706Z","2025-10-14T15:03:03.820Z","2025-10-14T15:02:50.262Z","179",{"id":1265,"name":1411,"alternativeText":13,"caption":13,"width":1412,"height":1413,"formats":1414,"hash":1437,"ext":22,"mime":25,"size":1438,"url":1439,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1440,"updatedAt":1440},"NVIDIA_logo.svg.png",2560,469,{"large":1415,"small":1421,"medium":1426,"thumbnail":1432},{"ext":22,"url":1416,"hash":1417,"mime":25,"name":1418,"path":13,"size":1419,"width":28,"height":1420},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_NVIDIA_logo_svg_1ae5067cd9.png","large_NVIDIA_logo_svg_1ae5067cd9","large_NVIDIA_logo.svg.png",32.11,183,{"ext":22,"url":1422,"hash":1423,"mime":25,"name":1424,"path":13,"size":1425,"width":35,"height":346},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_NVIDIA_logo_svg_1ae5067cd9.png","small_NVIDIA_logo_svg_1ae5067cd9","small_NVIDIA_logo.svg.png",14.26,{"ext":22,"url":1427,"hash":1428,"mime":25,"name":1429,"path":13,"size":1430,"width":42,"height":1431},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_NVIDIA_logo_svg_1ae5067cd9.png","medium_NVIDIA_logo_svg_1ae5067cd9","medium_NVIDIA_logo.svg.png",21.56,137,{"ext":22,"url":1433,"hash":1434,"mime":25,"name":1435,"path":13,"size":1436,"width":105,"height":452},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_NVIDIA_logo_svg_1ae5067cd9.png","thumbnail_NVIDIA_logo_svg_1ae5067cd9","thumbnail_NVIDIA_logo.svg.png",6.37,"NVIDIA_logo_svg_1ae5067cd9",18.15,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/NVIDIA_logo_svg_1ae5067cd9.png","2025-10-14T15:02:18.862Z",{"id":1284,"variation":58,"button":1442},[1443],{"id":1117,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1444,"newWindow":8,"downloadable":13,"shape":13},"https://www.nvidia.com/en-us/","-131",{"id":288,"name":1447,"description":1448,"createdAt":1449,"updatedAt":1450,"publishedAt":1451,"url_path_id":1452,"logo":1453,"website":1486,"url_path":1490},"IBM","\u003Cp style=\"text-align:justify;\">Our dynamic global team is looking to enlist enthusiastic professionals to join world-class hardware design teams responsible for developing the most challenging and complex systems in the world. We are seeking energetic, highly-motivated individuals willing to go the extra mile with the aim of helping the overall IBM development team. Strong interpersonal skills are needed to coordinate deliverables and requirements from several areas within and outside of the organization. &nbsp;There are many opportunities to gain and utilize a deep understanding of future issues and provide input towards decisions affecting system development, logical and physical design as well as sophisticated methodology directions.\u003C/p>\u003Cp style=\"text-align:justify;\">&nbsp;\u003C/p>\u003Cp style=\"text-align:justify;\">Individuals who are chosen to become a part of our world class development teams will be helping advance IBM’s leadership in developing the highest performing computers and changing hardware solutions. Do you want to be an IBMer? \u003Cstrong>Come THINK with us!&nbsp;\u003C/strong>\u003C/p>\u003Cp style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:black;\">\u003Cstrong>All interested students can apply at:  \u003C/strong>\u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://www.ibm.com/careers__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuiv13ExN$\">\u003Cspan style=\"color:black;\">\u003Cstrong>https://www.ibm.com/careers\u003C/strong>\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 55016:&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=55106__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYut81G66h$\">\u003Cspan style=\"color:black;\">Hardware Developer Intern: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 54841:  &nbsp;&nbsp;&nbsp;&nbsp; \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=54841__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYum4MKv3W$\">\u003Cspan style=\"color:black;\">Entry Level Hardware Developer: 2026&nbsp;&nbsp;\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 57950:&nbsp;&nbsp; &nbsp;&nbsp;&nbsp; \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=57950__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuiwa32YB$\">\u003Cspan style=\"color:black;\">Software Engineer Intern: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 57952:&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">USA \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=57952__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYup28ftX9$\">\u003Cspan style=\"color:black;\">Entry Level Software Engineer: 2026&nbsp;&nbsp;&nbsp;\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">&nbsp;\u003C/span>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 49799:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=49799__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYupH2q6oL$\">\u003Cspan style=\"color:black;\">System and Board Design Engineer: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 64045:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=64045__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYupGbBg3j$\">\u003Cspan style=\"color:black;\">Chip &amp; Hardware Test Technician: 2026\u003C/span>\u003C/a>\u003C/p>\u003Cp style=\"margin-left:0px;\">\u003Cspan style=\"color:black;\">Job # 54047:    \u003C/span>\u003Cspan style=\"color:rgb(200,38,19);\">Germany \u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://ibmglobal.avature.net/en_US/careers/JobDetail?jobId=54047__;!!IKRxdwAv5BmarQ!cDgYJIULzBRjz6bEV4WJ2tneCNE8KCO8PNlhAU55Es7H-s7F8WTBy8mohtRrCxdpP6ND3lX6BRjYuqt8MU7J$\">\u003Cspan style=\"color:black;\">Linux System Performance Architect: 2026\u003C/span>\u003C/a>\u003C/p>","2025-10-21T13:17:29.423Z","2025-10-25T08:26:00.917Z","2025-10-21T13:17:31.401Z","186",{"id":1454,"name":1455,"alternativeText":13,"caption":13,"width":1456,"height":1457,"formats":1458,"hash":1482,"ext":954,"mime":957,"size":1483,"url":1484,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1485,"updatedAt":1485},136,"IBM_logo_in.jpg",1783,1265,{"large":1459,"small":1465,"medium":1470,"thumbnail":1476},{"ext":954,"url":1460,"hash":1461,"mime":957,"name":1462,"path":13,"size":1463,"width":28,"height":1464},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_IBM_logo_in_e1412f8354.jpg","large_IBM_logo_in_e1412f8354","large_IBM_logo_in.jpg",32.82,709,{"ext":954,"url":1466,"hash":1467,"mime":957,"name":1468,"path":13,"size":986,"width":35,"height":1469},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_IBM_logo_in_e1412f8354.jpg","small_IBM_logo_in_e1412f8354","small_IBM_logo_in.jpg",355,{"ext":954,"url":1471,"hash":1472,"mime":957,"name":1473,"path":13,"size":1474,"width":42,"height":1475},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_IBM_logo_in_e1412f8354.jpg","medium_IBM_logo_in_e1412f8354","medium_IBM_logo_in.jpg",23.57,532,{"ext":954,"url":1477,"hash":1478,"mime":957,"name":1479,"path":13,"size":1480,"width":1481,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_IBM_logo_in_e1412f8354.jpg","thumbnail_IBM_logo_in_e1412f8354","thumbnail_IBM_logo_in.jpg",5.62,220,"IBM_logo_in_e1412f8354",56.55,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/IBM_logo_in_e1412f8354.jpg","2025-10-21T13:17:23.428Z",{"id":106,"variation":58,"button":1487},[1488],{"id":1165,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1489,"newWindow":8,"downloadable":13,"shape":13},"https://www.ibm.com/us-en","-138",{"id":578,"name":1492,"description":1493,"createdAt":1494,"updatedAt":1495,"publishedAt":1496,"url_path_id":1497,"logo":1498,"website":1529,"url_path":1534},"imec","\u003Cul>\u003Cli>Pathfinding Co-Optimization for Technology and Systems (PACTS):\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/physical-design-researcher\">Physical Design Researcher\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/team-lead-and-test-chip-architect\">ASIC Test Chip Physical Design Architect\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/power-and-thermal-integrity-researcher\">Power and Thermal Integrity Researcher\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/dtco-layout-rd-engineer\">DTCO Layout R&amp;D Engineer\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/digital-systems-researcher-emerging-memory-technologies\">Digital Systems Researcher in Emerging Memory Technologies\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/researcher-3d-emerging-memories-dramferroigzo-2t0c\">Researcher in 3D Emerging Memories (DRAM/Ferro/IGZO 2T0C)\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/compact-modelling-engineer\">Compact Modelling Engineer\u003C/a>\u003C/li>\u003C/ul>\u003C/li>\u003Cli>Compute Systems Architectures (CSA):\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/soc-designer-architect\">SoC Designer/ Architect\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities/principal-ai-high-performance-computing-architect\">AI + HPC hardware performance researcher\u003C/a>\u003C/li>\u003C/ul>\u003C/li>\u003C/ul>\u003Cp style=\"margin-left:15px;\">\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.imec-int.com/en/work-at-imec/job-opportunities?type=academic&amp;filters%5B0%5D=%2Fjob_employment_type%2Fphd\">Interested in a PhD at imec? Please check out the PhD opportunities here!\u003C/a>\u003C/p>","2025-10-21T13:18:36.674Z","2025-10-21T15:25:14.744Z","2025-10-21T13:18:39.994Z","187",{"id":1431,"name":1499,"alternativeText":13,"caption":13,"width":1412,"height":1500,"formats":1501,"hash":1525,"ext":22,"mime":25,"size":1526,"url":1527,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1528,"updatedAt":1528},"LOGO-IMEC_black.svg.png",1281,{"large":1502,"small":1507,"medium":1513,"thumbnail":1519},{"ext":22,"url":1503,"hash":1504,"mime":25,"name":1505,"path":13,"size":1506,"width":28,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_LOGO_IMEC_black_svg_04c5c3f74a.png","large_LOGO_IMEC_black_svg_04c5c3f74a","large_LOGO-IMEC_black.svg.png",19.55,{"ext":22,"url":1508,"hash":1509,"mime":25,"name":1510,"path":13,"size":1511,"width":35,"height":1512},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_LOGO_IMEC_black_svg_04c5c3f74a.png","small_LOGO_IMEC_black_svg_04c5c3f74a","small_LOGO-IMEC_black.svg.png",8.83,250,{"ext":22,"url":1514,"hash":1515,"mime":25,"name":1516,"path":13,"size":1517,"width":42,"height":1518},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_LOGO_IMEC_black_svg_04c5c3f74a.png","medium_LOGO_IMEC_black_svg_04c5c3f74a","medium_LOGO-IMEC_black.svg.png",13.43,375,{"ext":22,"url":1520,"hash":1521,"mime":25,"name":1522,"path":13,"size":1523,"width":105,"height":1524},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_LOGO_IMEC_black_svg_04c5c3f74a.png","thumbnail_LOGO_IMEC_black_svg_04c5c3f74a","thumbnail_LOGO-IMEC_black.svg.png",4.32,123,"LOGO_IMEC_black_svg_04c5c3f74a",12.04,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/LOGO_IMEC_black_svg_04c5c3f74a.png","2025-10-21T13:18:30.374Z",{"id":1530,"variation":58,"button":1531},73,[1532],{"id":1203,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1533,"newWindow":8,"downloadable":13,"shape":13},"https://www.imec-int.com/en/work-at-imec/job-opportunities?type=career&filters%5B0%5D=%2Fjob_region%2Fbelgium&filters%5B1%5D=%2Fjob_region%2Fcambridge-uk&filters%5B2%5D=%2Fjob_region%2Fgermany&filters%5B3%5D=%2Fjob_employment_type%2Fpermanent-contract","-139",{"id":236,"name":1536,"description":76,"createdAt":1537,"updatedAt":1538,"publishedAt":1539,"url_path_id":1540,"logo":1541,"website":1556,"url_path":1561},"Peking University","2025-10-27T12:31:39.034Z","2025-10-27T12:31:40.885Z","2025-10-27T12:31:40.874Z","196",{"id":1542,"name":1543,"alternativeText":13,"caption":13,"width":1544,"height":1545,"formats":1546,"hash":1552,"ext":954,"mime":957,"size":1553,"url":1554,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1555,"updatedAt":1555},143,"images.jpg",300,168,{"thumbnail":1547},{"ext":954,"url":1548,"hash":1549,"mime":957,"name":1550,"path":13,"size":1551,"width":105,"height":1431},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_images_1d87fa6eb4.jpg","thumbnail_images_1d87fa6eb4","thumbnail_images.jpg",6.48,"images_1d87fa6eb4",8.42,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/images_1d87fa6eb4.jpg","2025-10-27T12:31:24.079Z",{"id":1331,"variation":58,"button":1557},[1558],{"id":1559,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1560,"newWindow":8,"downloadable":13,"shape":13},81,"https://english.pku.edu.cn/","-147",{"id":256,"name":1288,"description":1563,"createdAt":1564,"updatedAt":1565,"publishedAt":1566,"url_path_id":1567,"logo":1568,"website":1574,"url_path":1577},"\u003Cp>Current Listings:&nbsp;\u003C/p>\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://confcats-event-sessions.s3.us-east-1.amazonaws.com/iccad25/uploads/EDA-Router.pdf\">EDA-Router\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://confcats-event-sessions.s3.us-east-1.amazonaws.com/iccad25/uploads/EDA-Timing.pdf\">EDA-Timing\u003C/a>\u003C/li>\u003C/ul>","2025-10-27T12:37:12.998Z","2025-10-27T12:41:59.179Z","2025-10-27T12:41:59.171Z","197",{"id":565,"name":1295,"alternativeText":13,"caption":13,"width":1296,"height":1297,"formats":1569,"hash":1323,"ext":954,"mime":957,"size":1324,"url":1325,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1326,"updatedAt":1326},{"large":1570,"small":1571,"medium":1572,"thumbnail":1573},{"ext":954,"url":1300,"hash":1301,"mime":957,"name":1302,"path":13,"size":1303,"width":28,"height":1304},{"ext":954,"url":1306,"hash":1307,"mime":957,"name":1308,"path":13,"size":1309,"width":35,"height":1310},{"ext":954,"url":1312,"hash":1313,"mime":957,"name":1314,"path":13,"size":1315,"width":42,"height":1316},{"ext":954,"url":1318,"hash":1319,"mime":957,"name":1320,"path":13,"size":1321,"width":105,"height":1322},{"id":1371,"variation":58,"button":1575},[1576],{"id":384,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1332,"newWindow":8,"downloadable":13,"shape":13},"-148",{"id":373,"name":1158,"description":1579,"createdAt":1580,"updatedAt":1581,"publishedAt":1582,"url_path_id":1583,"logo":1584,"website":1589,"url_path":1592},"\u003Col>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/PhD-Candidate-in-Functional-Safety-for-AI-Accelerators---Contract-Duration-3-Years--f-m-d-_R50111__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbzvEYM8EA$\">Ph.D. Candidate in Functional Safety for AI Accelerators - Contract Duration 3 Years (f/m/d), Munich - Germany\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/Lead-Application-Engineer_R50649-1__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbyfv2PFvw$\">Lead Application Engineer, Munich - Germany\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/Sr-Application-Engineer--f-m-d-_R51515__;!!IKRxdwAv5BmarQ!fQT9-IhPrQEiaF-bRh8kzm7ZUYiupEAP8lk9hFjLH8gH9DutbG6d_Im9CNd-75rBdJnCUB9XMbwEgEx6AQ$\">Sr. Application Engineer (f/m/d), Munich - Germany\u003C/a>\u003C/li>\u003C/ol>","2025-10-28T09:19:43.567Z","2025-10-29T07:09:08.732Z","2025-10-28T09:19:58.006Z","198",{"id":1165,"name":1166,"alternativeText":13,"caption":13,"width":1167,"height":1168,"formats":1585,"hash":1186,"ext":22,"mime":25,"size":1187,"url":1188,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1189,"updatedAt":1189},{"small":1586,"medium":1587,"thumbnail":1588},{"ext":22,"url":1171,"hash":1172,"mime":25,"name":1173,"path":13,"size":1174,"width":35,"height":584},{"ext":22,"url":1176,"hash":1177,"mime":25,"name":1178,"path":13,"size":1179,"width":42,"height":1180},{"ext":22,"url":1182,"hash":1183,"mime":25,"name":1184,"path":13,"size":1185,"width":105,"height":143},{"id":1385,"variation":58,"button":1590},[1591],{"id":404,"label":116,"size":62,"color":63,"style":13,"icon":117,"iconPosition":65,"url":1193,"newWindow":8,"downloadable":13,"shape":13},"-149",{"pagination":1594},{"page":5,"pageSize":373,"pageCount":69,"total":320},{"id":250,"heading":355,"pageHeader":1596,"sections":1598},{"id":250,"description":1597,"showPageHeader":8,"backgroundColor":81,"image":13}," ",[1599],{"id":170,"__component":1600,"componentVariation":1601,"contactsVariation":1602,"styles":13,"header":13,"sessionsGroup":1603},"content.sessions","Sessions Base","Card Contact Full",[1604],{"id":170,"groupTitle":13,"sessions":1605},[1606,1696,1880,1891,1961,2074],{"id":418,"session":1607},{"id":418,"title":1608,"teaser":1609,"body":76,"createdAt":1610,"updatedAt":1611,"publishedAt":1612,"url_path_id":1613,"contacts":1614,"url_path":1695},"Top Picks in Hardware and Embedded Security","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:#1079A8;\">\u003Cstrong>Thursday | October 30, 2025 |&nbsp;8:00 - 16:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"text-align:justify;\">Top Picks Workshop creates a venue to showcase the best and high impact recently published works in the area of hardware and embedded security. These works will be selected from conference papers that have appeared in leading hardware security conferences including but not limited to DAC, ICCAD, DATE, ASPDAC, HOST, Asian HOST, GLSVLSI, VLSI Design, CHES, ETS, VTS, ITC, S&amp;P, Usenix Security, CCS, NDSS, ISCA, MICRO, ASPLOS, HPCA, HASP, ACSAC, Euro S&amp;P, and Asia CCS. The 8th Top Picks workshop will be collocated with ICCAD 2025. The authors of a short list of papers picked from the submissions are required to present their work at the workshop on October 30, 2025 and are invited to attend ICCAD’s networking in–person on October 30, 2025. The presentation including a discussion (Q&amp;A) session, is mandatory.\u003C/p>\u003Cdiv class=\"raw-html-embed\">\u003Cdiv class=\"not-prose pt-6 flex justify-center\">\n    \u003Ca href=\"https://sites.google.com/view/toppickshardwaresec\" rel=\"noopener\" target=\"_blank\" class=\"btn-primary text-white btn-sm btn last:!mr-0 gap-3\">\n        \u003Cspan>Learn More\u003C/span>\n        \u003Csvg xmlns=\"http://www.w3.org/2000/svg\" viewBox=\"0 0 24 24\" fill=\"currentColor\" aria-hidden=\"true\" class=\"h-5 w-5\">\n            \u003Cpath fill-rule=\"evenodd\" d=\"M16.28 11.47a.75.75 0 010 1.06l-7.5 7.5a.75.75 0 01-1.06-1.06L14.69 12 7.72 5.03a.75.75 0 011.06-1.06l7.5 7.5z\" clip-rule=\"evenodd\">\u003C/path>\n        \u003C/svg>\n    \u003C/a>\n\u003C/div>\u003C/div>","2025-08-14T14:37:00.154Z","2025-10-02T14:16:03.105Z","2025-08-14T14:37:02.365Z","126",[1615,1636,1674],{"id":300,"name":1616,"committee":13,"position":13,"affiliation":1617,"email":13,"biography":76,"createdAt":1618,"updatedAt":1618,"url_path_id":1619,"contactPhoto":1620,"socialLinks":1634,"url_path":1635},"Ahmad-Reza Sadeghi","Technical University of Darmstadt  Darmstadt, Hesse, Germany","2025-08-14T18:48:36.229Z","128",{"id":1385,"name":1621,"alternativeText":13,"caption":13,"width":1622,"height":1623,"formats":1624,"hash":1630,"ext":954,"mime":957,"size":1631,"url":1632,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1633,"updatedAt":1633},"Sadeghi_560x720_150dpi_415x0_415x0.jpg",415,426,{"thumbnail":1625},{"ext":954,"url":1626,"hash":1627,"mime":957,"name":1628,"path":13,"size":1144,"width":1629,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Sadeghi_560x720_150dpi_415x0_415x0_9af5a8d77e.jpg","thumbnail_Sadeghi_560x720_150dpi_415x0_415x0_9af5a8d77e","thumbnail_Sadeghi_560x720_150dpi_415x0_415x0.jpg",152,"Sadeghi_560x720_150dpi_415x0_415x0_9af5a8d77e",23.7,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Sadeghi_560x720_150dpi_415x0_415x0_9af5a8d77e.jpg","2025-08-14T18:48:29.109Z",[],"-83",{"id":314,"name":1637,"committee":13,"position":13,"affiliation":1638,"email":13,"biography":76,"createdAt":1639,"updatedAt":1639,"url_path_id":1640,"contactPhoto":1641,"socialLinks":1672,"url_path":1673},"Xiaolin Xu","Northeastern University, USA","2025-08-14T18:48:55.747Z","129",{"id":1402,"name":1642,"alternativeText":13,"caption":13,"width":1643,"height":1644,"formats":1645,"hash":1668,"ext":954,"mime":957,"size":1669,"url":1670,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1671,"updatedAt":1671},"xu-x.jpg",1280,1313,{"large":1646,"small":1652,"medium":1658,"thumbnail":1663},{"ext":954,"url":1647,"hash":1648,"mime":957,"name":1649,"path":13,"size":1650,"width":1651,"height":28},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/large_xu_x_7c5e22cc97.jpg","large_xu_x_7c5e22cc97","large_xu-x.jpg",124.28,975,{"ext":954,"url":1653,"hash":1654,"mime":957,"name":1655,"path":13,"size":1656,"width":1657,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_xu_x_7c5e22cc97.jpg","small_xu_x_7c5e22cc97","small_xu-x.jpg",32.43,487,{"ext":954,"url":1659,"hash":1660,"mime":957,"name":1661,"path":13,"size":1662,"width":1213,"height":42},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/medium_xu_x_7c5e22cc97.jpg","medium_xu_x_7c5e22cc97","medium_xu-x.jpg",71.24,{"ext":954,"url":1664,"hash":1665,"mime":957,"name":1666,"path":13,"size":1667,"width":1629,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_xu_x_7c5e22cc97.jpg","thumbnail_xu_x_7c5e22cc97","thumbnail_xu-x.jpg",4.33,"xu_x_7c5e22cc97",204.94,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/xu_x_7c5e22cc97.jpg","2025-08-14T18:48:53.500Z",[],"-84",{"id":1151,"name":1675,"committee":13,"position":13,"affiliation":1676,"email":13,"biography":76,"createdAt":1677,"updatedAt":1678,"url_path_id":1679,"contactPhoto":1680,"socialLinks":1693,"url_path":1694},"Lichao Wu"," Technical University of Darmstadt, Germany","2025-10-02T14:15:15.057Z","2025-10-02T14:17:26.109Z","168",{"id":1681,"name":1682,"alternativeText":13,"caption":13,"width":1622,"height":1623,"formats":1683,"hash":1689,"ext":22,"mime":25,"size":1690,"url":1691,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1692,"updatedAt":1692},114,"lichao_image.png",{"thumbnail":1684},{"ext":22,"url":1685,"hash":1686,"mime":25,"name":1687,"path":13,"size":1688,"width":1629,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_lichao_image_6f0f011363.png","thumbnail_lichao_image_6f0f011363","thumbnail_lichao_image.png",29.9,"lichao_image_6f0f011363",40.9,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/lichao_image_6f0f011363.png","2025-10-02T14:14:59.475Z",[],"-105","-82",{"id":288,"session":1697},{"id":288,"title":1698,"teaser":1699,"body":1700,"createdAt":1701,"updatedAt":1702,"publishedAt":1703,"url_path_id":1704,"contacts":1705,"url_path":1879},"Workshop on Post-Quantum Cryptography Resilience, Verification, and Secure Design Automation (WPQC)","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:#1079A8;\">\u003Cstrong>Thursday | October 30, 2025 |&nbsp;8:00 - 16:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"text-align:justify;\">The rapid transition toward Post-Quantum Cryptography (PQC) has prompted a global effort to redefine digital security in anticipation of quantum-capable adversaries. While PQC algorithms are mathematically robust, their secure and efficient integration into hardware systems introduces new vulnerabilities and engineering challenges—especially in areas such as side-channel resistance, hardware/software co-design, and formal verification.\u000bThe Workshop on Post-Quantum Cryptography and Secure Hardware (WPQC) aims to address these challenges by serving as a dedicated forum for researchers and practitioners in hardware security, EDA/CAD, computer architecture, and cryptography.&nbsp;\u003C/p>\u003Cp style=\"text-align:justify;\">The workshop provides a platform to explore the intersection of PQC and hardware/system design, highlighting recent advancements in secure accelerator development, design automation, system integration, and emerging threat models.\u000bBy bringing together experts from academia, industry, and standardization bodies, WPQC seeks to accelerate collaborative research efforts and foster a shared vision for building resilient, verifiable, and efficient post-quantum systems.\u003C/p>\u003Cdiv class=\"raw-html-embed\">\u003Cdiv class=\"not-prose pt-6 flex justify-center\">\n    \u003Ca href=\"https://easychair.org/cfp/wpqc25\" rel=\"noopener\" target=\"_blank\" class=\"btn-primary text-white btn-sm btn last:!mr-0 gap-3\">\n        \u003Cspan>Learn More\u003C/span>\n        \u003Csvg xmlns=\"https://easychair.org/cfp/wpqc25\" viewBox=\"0 0 24 24\" fill=\"currentColor\" aria-hidden=\"true\" class=\"h-5 w-5\">\n            \u003Cpath fill-rule=\"evenodd\" d=\"M16.28 11.47a.75.75 0 010 1.06l-7.5 7.5a.75.75 0 01-1.06-1.06L14.69 12 7.72 5.03a.75.75 0 011.06-1.06l7.5 7.5z\" clip-rule=\"evenodd\">\u003C/path>\n        \u003C/svg>\n    \u003C/a>\n\u003C/div>\u003C/div>\u003Cp style=\"text-align:justify;\">\u003Cbr>&nbsp;\u003C/p>","\u003Cp>Organizers:&nbsp;\u003C/p>\u003Cul>\u003Cli>Reza Azarderakhsh: Florida Atlantic University and Founder of PQSecure, USA\u003C/li>\u003Cli>Mojtaba Bisheh-niasar: Microsoft, USA\u003C/li>\u003Cli>Michael Hutter: University of the Bundeswehr Munich and PQShield, Germany\u003C/li>\u003Cli>Debdeep Mukhopadhyay: Indian Institute of Technology Kharagpur (IIT KGP), India\u003C/li>\u003Cli>Praveen Vadnala: PQShield, Germany\u003C/li>\u003Cli>Shivam Bhasin: Nanyang Technological University (NTU), Singapore\u003C/li>\u003Cli>Trevor E. Carlson: National University of Singapore (NUS), Singapore\u003C/li>\u003Cli>Mona Hashemi: National University of Singapore (NUS), Singapore\u003Cbr>&nbsp;\u003C/li>\u003C/ul>","2025-08-28T12:37:29.316Z","2025-10-17T14:06:43.974Z","2025-08-28T12:37:50.121Z","149",[1706,1727,1748,1767,1789,1816,1836,1855],{"id":432,"name":1707,"committee":13,"position":13,"affiliation":1708,"email":13,"biography":76,"createdAt":1709,"updatedAt":1709,"url_path_id":1710,"contactPhoto":1711,"socialLinks":1725,"url_path":1726},"Reza Azarderakhsh","FL Atlantic U, and PQSecure (USA)","2025-08-28T12:20:12.530Z","138",{"id":346,"name":1712,"alternativeText":13,"caption":13,"width":1544,"height":1713,"formats":1714,"hash":1721,"ext":954,"mime":957,"size":1722,"url":1723,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1724,"updatedAt":1724},"Reza Azarderakhsh.jpg",297,{"thumbnail":1715},{"ext":954,"url":1716,"hash":1717,"mime":957,"name":1718,"path":13,"size":1719,"width":1720,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Reza_Azarderakhsh_a9c68fa46b.jpg","thumbnail_Reza_Azarderakhsh_a9c68fa46b","thumbnail_Reza Azarderakhsh.jpg",5.92,158,"Reza_Azarderakhsh_a9c68fa46b",16.61,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Reza_Azarderakhsh_a9c68fa46b.jpg","2025-08-28T12:20:10.353Z",[],"-93",{"id":535,"name":1728,"committee":13,"position":13,"affiliation":1729,"email":13,"biography":76,"createdAt":1730,"updatedAt":1730,"url_path_id":1731,"contactPhoto":1732,"socialLinks":1746,"url_path":1747},"Mojtaba Bisheh-niasar","Microsoft (USA)","2025-08-28T12:20:52.170Z","139",{"id":1733,"name":1734,"alternativeText":13,"caption":13,"width":1735,"height":1735,"formats":1736,"hash":1742,"ext":954,"mime":957,"size":1743,"url":1744,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1745,"updatedAt":1745},93,"Mojtaba Bisheh-niasar.jpg",200,{"thumbnail":1737},{"ext":954,"url":1738,"hash":1739,"mime":957,"name":1740,"path":13,"size":1741,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Mojtaba_Bisheh_niasar_8231d90af6.jpg","thumbnail_Mojtaba_Bisheh_niasar_8231d90af6","thumbnail_Mojtaba Bisheh-niasar.jpg",4.84,"Mojtaba_Bisheh_niasar_8231d90af6",6.9,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Mojtaba_Bisheh_niasar_8231d90af6.jpg","2025-08-28T12:20:50.147Z",[],"-94",{"id":1079,"name":1749,"committee":13,"position":13,"affiliation":1750,"email":13,"biography":76,"createdAt":1751,"updatedAt":1751,"url_path_id":1752,"contactPhoto":1753,"socialLinks":1765,"url_path":1766},"Michael Hutter","University of the Bundeswehr Munich and PQShield, Germany","2025-10-14T15:54:31.809Z","180",{"id":843,"name":1754,"alternativeText":13,"caption":13,"width":1735,"height":1735,"formats":1755,"hash":1761,"ext":954,"mime":957,"size":1762,"url":1763,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1764,"updatedAt":1764},"1672823589378.jpg",{"thumbnail":1756},{"ext":954,"url":1757,"hash":1758,"mime":957,"name":1759,"path":13,"size":1760,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_1672823589378_bcabac9403.jpg","thumbnail_1672823589378_bcabac9403","thumbnail_1672823589378.jpg",4.25,"1672823589378_bcabac9403",6.04,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/1672823589378_bcabac9403.jpg","2025-10-14T15:54:29.730Z",[],"-132",{"id":1239,"name":1768,"committee":13,"position":13,"affiliation":1769,"email":13,"biography":76,"createdAt":1770,"updatedAt":1770,"url_path_id":1771,"contactPhoto":1772,"socialLinks":1787,"url_path":1788},"Debdeep Mukhopadhyay","Indian Institute of Technology Kharagpur (IIT KGP), India","2025-10-14T15:55:22.374Z","181",{"id":1773,"name":1774,"alternativeText":13,"caption":13,"width":1775,"height":1776,"formats":1777,"hash":1783,"ext":22,"mime":25,"size":1784,"url":1785,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1786,"updatedAt":1786},132,"download (10).png",120,160,{"thumbnail":1778},{"ext":22,"url":1779,"hash":1780,"mime":25,"name":1781,"path":13,"size":1782,"width":1060,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_download_10_264f9f5a3b.png","thumbnail_download_10_264f9f5a3b","thumbnail_download (10).png",5.12,"download_10_264f9f5a3b",4.93,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/download_10_264f9f5a3b.png","2025-10-14T15:55:20.037Z",[],"-133",{"id":106,"name":1790,"committee":13,"position":13,"affiliation":1791,"email":13,"biography":76,"createdAt":1792,"updatedAt":1792,"url_path_id":1793,"contactPhoto":1794,"socialLinks":1814,"url_path":1815},"Praveen Vadnala","PQShield, Germany","2025-10-14T16:15:31.120Z","183",{"id":1795,"name":1796,"alternativeText":13,"caption":13,"width":35,"height":1797,"formats":1798,"hash":1810,"ext":954,"mime":957,"size":1811,"url":1812,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1813,"updatedAt":1813},134,"Praveen-Vadnala-Product_Website.jpg",600,{"small":1799,"thumbnail":1805},{"ext":954,"url":1800,"hash":1801,"mime":957,"name":1802,"path":13,"size":1803,"width":1804,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Praveen_Vadnala_Product_Website_61e16ed54e.jpg","small_Praveen_Vadnala_Product_Website_61e16ed54e","small_Praveen-Vadnala-Product_Website.jpg",27.73,417,{"ext":954,"url":1806,"hash":1807,"mime":957,"name":1808,"path":13,"size":1809,"width":1265,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Praveen_Vadnala_Product_Website_61e16ed54e.jpg","thumbnail_Praveen_Vadnala_Product_Website_61e16ed54e","thumbnail_Praveen-Vadnala-Product_Website.jpg",4.22,"Praveen_Vadnala_Product_Website_61e16ed54e",37.85,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Praveen_Vadnala_Product_Website_61e16ed54e.jpg","2025-10-14T16:15:27.884Z",[],"-135",{"id":617,"name":1817,"committee":13,"position":13,"affiliation":1818,"email":13,"biography":76,"createdAt":1819,"updatedAt":1819,"url_path_id":1820,"contactPhoto":1821,"socialLinks":1834,"url_path":1835},"Shivam Bhasin","NTU (Singapore)","2025-08-27T22:34:29.311Z","135",{"id":424,"name":1822,"alternativeText":13,"caption":13,"width":1145,"height":1823,"formats":1824,"hash":1830,"ext":954,"mime":957,"size":1831,"url":1832,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1833,"updatedAt":1833},"Shivam Bhasin.jpg",312,{"thumbnail":1825},{"ext":954,"url":1826,"hash":1827,"mime":957,"name":1828,"path":13,"size":1829,"width":1775,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Shivam_Bhasin_1a00ac4b5b.jpg","thumbnail_Shivam_Bhasin_1a00ac4b5b","thumbnail_Shivam Bhasin.jpg",4.36,"Shivam_Bhasin_1a00ac4b5b",12.83,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Shivam_Bhasin_1a00ac4b5b.jpg","2025-08-27T22:34:26.956Z",[],"-90",{"id":497,"name":1837,"committee":13,"position":13,"affiliation":1838,"email":13,"biography":76,"createdAt":1839,"updatedAt":1839,"url_path_id":1840,"contactPhoto":1841,"socialLinks":1853,"url_path":1854},"Trevor E. Carlson","NUS (Singapore)","2025-08-28T12:17:44.482Z","136",{"id":1842,"name":1843,"alternativeText":13,"caption":13,"width":49,"height":49,"formats":1844,"hash":1849,"ext":954,"mime":957,"size":1850,"url":1851,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1852,"updatedAt":1852},90,"Trevor E. Carlson.jpg",{"thumbnail":1845},{"ext":954,"url":1846,"hash":1847,"mime":957,"name":1848,"path":13,"size":988,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Trevor_E_Carlson_be7b0b77db.jpg","thumbnail_Trevor_E_Carlson_be7b0b77db","thumbnail_Trevor E. Carlson.jpg","Trevor_E_Carlson_be7b0b77db",5.54,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Trevor_E_Carlson_be7b0b77db.jpg","2025-08-28T12:17:32.150Z",[],"-91",{"id":554,"name":1856,"committee":13,"position":13,"affiliation":1838,"email":13,"biography":76,"createdAt":1857,"updatedAt":1857,"url_path_id":1858,"contactPhoto":1859,"socialLinks":1877,"url_path":1878},"Mona Hashemi","2025-08-28T12:19:17.581Z","137",{"id":1860,"name":1861,"alternativeText":13,"caption":13,"width":1797,"height":1797,"formats":1862,"hash":1873,"ext":22,"mime":25,"size":1874,"url":1875,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1876,"updatedAt":1876},91,"Portrait_Placeholder.png",{"small":1863,"thumbnail":1868},{"ext":22,"url":1864,"hash":1865,"mime":25,"name":1866,"path":13,"size":1867,"width":35,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Portrait_Placeholder_55e0c7dd05.png","small_Portrait_Placeholder_55e0c7dd05","small_Portrait_Placeholder.png",126.06,{"ext":22,"url":1869,"hash":1870,"mime":25,"name":1871,"path":13,"size":1872,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Portrait_Placeholder_55e0c7dd05.png","thumbnail_Portrait_Placeholder_55e0c7dd05","thumbnail_Portrait_Placeholder.png",11.73,"Portrait_Placeholder_55e0c7dd05",52.54,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Portrait_Placeholder_55e0c7dd05.png","2025-08-28T12:19:14.305Z",[],"-92","-104",{"id":236,"session":1881},{"id":236,"title":1882,"teaser":1883,"body":1884,"createdAt":1885,"updatedAt":1886,"publishedAt":1887,"url_path_id":1888,"contacts":1889,"url_path":1890},"2nd Quantum Computing Applications and Systems (QCAS)","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:rgb(16,121,168);\">\u003Cstrong>Thursday | October 30, 2025 |&nbsp;8:00 - 16:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"text-align:justify;\">Our proposed workshop aims to address emerging challenges and explore innovative solutions in the field of quantum technologies, particularly focusing on quantum computing applications for real-world problems. Quantum technologies are becoming crucial in a variety of scientific domains including chemistry, finance, power systems, etc. Our workshop will bring together researchers, practitioners, and industry experts to exchange ideas, share applications, and discuss the latest advancements in quantum algorithms, error correction, control techniques, and their applications across diverse fields. This event will serve as a platform to showcase cutting-edge research, foster collaboration, and drive innovation in the intersection of CAD, optimization, machine learning, and quantum computing.\u003C/p>\u003Cdiv class=\"raw-html-embed\">\u003Cdiv class=\"not-prose pt-6 flex justify-center\">\n    \u003Ca href=\"https://sites.google.com/view/qcas-2025/home\" rel=\"noopener\" target=\"_blank\" class=\"btn-primary text-white btn-sm btn last:!mr-0 gap-3\">\n        \u003Cspan>Learn More\u003C/span>\n        \u003Csvg xmlns=\"https://sites.google.com/view/qcas-2025/home\" viewBox=\"0 0 24 24\" fill=\"currentColor\" aria-hidden=\"true\" class=\"h-5 w-5\">\n            \u003Cpath fill-rule=\"evenodd\" d=\"M16.28 11.47a.75.75 0 010 1.06l-7.5 7.5a.75.75 0 01-1.06-1.06L14.69 12 7.72 5.03a.75.75 0 011.06-1.06l7.5 7.5z\" clip-rule=\"evenodd\">\u003C/path>\n        \u003C/svg>\n    \u003C/a>\n\u003C/div>\u003C/div>\u003Cp style=\"text-align:justify;\">\u003Cbr>&nbsp;\u003C/p>","\u003Cp>Organizers:&nbsp;\u003C/p>\u003Cul>\u003Cli>General Chair: Xiangyu Ren (The University of Edinburgh)\u003C/li>\u003Cli>Co-Chair: Zhiding Liang (The Chinese University of Hong Kong)\u003C/li>\u003Cli>Co-Chair: Yufei Ding (University of California, San Diego)\u003C/li>\u003Cli>Co-Chair: Zichang He (JPMorganChase)\u003C/li>\u003Cli>Yao Ma (Rensselaer Polytechnic Institute)\u003C/li>\u003Cli>Zhemin 'Hisen' Zhang (Rensselaer Polytechnic Institute)\u003C/li>\u003Cli>Xiaorang Guo (Technical University of Munich)\u003C/li>\u003C/ul>","2025-08-28T12:41:56.484Z","2025-10-26T09:38:10.652Z","2025-08-28T12:41:58.061Z","151",[],"-106",{"id":256,"session":1892},{"id":256,"title":1893,"teaser":1894,"body":1895,"createdAt":1896,"updatedAt":1897,"publishedAt":1898,"url_path_id":1899,"contacts":1900,"url_path":1960},"System-Level Interconnect Pathfinding (SLIP)","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:rgb(16,121,168);\">\u003Cstrong>Thursday | October 30, 2025 |&nbsp;8:00 - 16:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"text-align:justify;\">SLIP, co-located with ICCAD, brings together researchers and practitioners who have a shared interest in the challenges and futures of system-level interconnect, coming from wide-ranging backgrounds that span system, application, design and technology. &nbsp;\u003C/p>\u003Cp style=\"text-align:justify;\">The technical goal of the workshop is to\u003C/p>\u003Cul>\u003Cli style=\"text-align:justify;\">identify fundamental problems, and,\u003C/li>\u003Cli style=\"text-align:justify;\">foster new pathfinding of design, analysis, and optimization of system-level interconnects with emphasis on system-level interconnect modeling and pathfinding, DTCO-enhanced interconnect fabrics, memory and processor communication links, novel dataflow mapping for machine learning, 2.5/3D architectures, and new fabrics for the beyond-Moore era. &nbsp;\u003C/li>\u003C/ul>\u003Cp style=\"text-align:justify;\">Original submissions in the form of regular technical papers, invited sessions (tutorials, panels, special-topic sessions), workshop discussion topics, and posters are welcome. Program content is accepted based on novelty and contributions to the advancement of the field. Authors will keep the copyright of their work and there will be no published proceedings.\u003C/p>","\u003Cfigure class=\"table\" style=\"width:997.15pt;\">\u003Ctable style=\"background-color:rgb(255, 255, 255);\">\u003Ctbody>\u003Ctr>\u003Ctd style=\"background-color:yellow;border:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">\u003Cstrong>Time\u003C/strong>\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:yellow;border-bottom-style:solid;border-color:windowtext;border-left-style:none;border-right-style:solid;border-top-style:solid;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">\u003Cstrong>Title\u003C/strong>\u003C/span>\u003C/td>\u003Ctd style=\"background-color:yellow;border-bottom-style:solid;border-color:windowtext;border-left-style:none;border-right-style:solid;border-top-style:solid;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">\u003Cstrong>Speaker\u003C/strong>\u003C/span>\u003C/td>\u003Ctd style=\"background-color:yellow;border-bottom-style:solid;border-color:windowtext;border-left-style:none;border-right-style:solid;border-top-style:solid;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">\u003Cstrong>Affiliation\u003C/strong>\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;width:70pt;\">\u003Cp style=\"margin-left:0px;text-align:center;\">\u003Cspan style=\"color:black;\">08:30-08:35\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">Welcome\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">Dirk Stroobandt\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">Ghent University, Belgium\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">08:35-09:25\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">GPU-accelerated and AI-enabled Global and Detailed Routing\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">Evangeline Young\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">Chinese Univ of Hong Kong, China\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">09:30-10:00\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">BREAK\u003C/span>\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">&nbsp;\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">&nbsp;\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">10:00-10:40\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">3D integration technology addressing memory and power walls\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">Geert Van der Plas\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">imec, Belgium\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">10:40-11:30\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">Interconnect-aware SRAM design in advanced nodes\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">Mehdi B. Tahoori\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">Karlsruhe Institute of Technology, Germany\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">11:30-13:00\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">LUNCH\u003C/span>\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">&nbsp;\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">&nbsp;\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">13:00-13:40\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">Datacenter GPU infrastructure scaling with emerging interconnects\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">Aakash Patel\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">imec, Belgium\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">13:40-14:30\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">The impact of high-level synthesis on interconnect complexity\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">Kate Thurner\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">Univ of Toronto, Canada\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">14:30-15:00\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">BREAK\u003C/span>\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">&nbsp;\u003C/td>\u003Ctd style=\"background-color:rgb(191, 191, 191);border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">&nbsp;\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">15:00:15:40\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">Advanced Standard Cell Design Balancing FEOL and BEOL Resource Usage\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">Jasung Ku\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">Seoul National University, South Korea\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">15:40-16:10\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">Interconnect-aware netlist generation: Trading compactness for routability\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;width:99.15pt;\">\u003Cspan style=\"color:black;\">Taewhan KIm\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:209pt;\">\u003Cspan style=\"color:black;\">Seoul National University, South Korea\u003C/span>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom-style:solid;border-color:windowtext;border-left-style:solid;border-right-style:solid;border-top-style:none;border-width:1pt;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:70pt;\">\u003Cp style=\"text-align:center;\">\u003Cspan style=\"color:black;\">16:10-16:15\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:619pt;\">\u003Cspan style=\"color:black;\">Closing remarks\u003C/span>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid windowtext;border-right:1pt solid windowtext;height:15pt;padding-left:5.4pt;padding-right:5.4pt;vertical-align:bottom;width:99.15pt;\">\u003Cspan style=\"color:black;\">Dirk Stroobandt\u003C/span>\u003C/td>\u003Ctd>&nbsp;\u003C/td>\u003C/tr>\u003C/tbody>\u003C/table>\u003C/figure>\u003Cp>&nbsp;\u003C/p>\u003Cp>Organizers:&nbsp;\u003C/p>\u003Cul>\u003Cli>Dirk Stroobandt, Ghent University, Belgium\u003C/li>\u003Cli>Mustafa Badaroglu, QUalcomm\u003Cbr>&nbsp;\u003C/li>\u003C/ul>","2025-08-28T12:44:08.136Z","2025-10-30T07:28:38.914Z","2025-08-28T12:44:17.605Z","153",[1901,1921,1941],{"id":1041,"name":1902,"committee":13,"position":13,"affiliation":1903,"email":13,"biography":76,"createdAt":1904,"updatedAt":1904,"url_path_id":1905,"contactPhoto":1906,"socialLinks":1919,"url_path":1920},"Dirk Stroobandt","Univ of Gent, Belgium","2025-10-07T13:06:12.628Z","170",{"id":1524,"name":1907,"alternativeText":13,"caption":13,"width":49,"height":49,"formats":1908,"hash":1915,"ext":1910,"mime":957,"size":1916,"url":1917,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1918,"updatedAt":1918},"Dirk Stroobandt.jpeg",{"thumbnail":1909},{"ext":1910,"url":1911,"hash":1912,"mime":957,"name":1913,"path":13,"size":1914,"width":50,"height":50},".jpeg","https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Dirk_Stroobandt_9ba934581a.jpeg","thumbnail_Dirk_Stroobandt_9ba934581a","thumbnail_Dirk Stroobandt.jpeg",3.74,"Dirk_Stroobandt_9ba934581a",4.12,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Dirk_Stroobandt_9ba934581a.jpeg","2025-10-07T13:06:09.896Z",[],"-122",{"id":1005,"name":1922,"committee":13,"position":13,"affiliation":1923,"email":13,"biography":76,"createdAt":1924,"updatedAt":1924,"url_path_id":1925,"contactPhoto":1926,"socialLinks":1939,"url_path":1940},"Mustafa Badaroglu","Qualcomm, USA","2025-10-07T13:08:02.141Z","171",{"id":1927,"name":1928,"alternativeText":13,"caption":13,"width":1735,"height":1735,"formats":1929,"hash":1935,"ext":954,"mime":957,"size":1936,"url":1937,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1938,"updatedAt":1938},124,"Mustafa Badaroglu.jpg",{"thumbnail":1930},{"ext":954,"url":1931,"hash":1932,"mime":957,"name":1933,"path":13,"size":1934,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Mustafa_Badaroglu_8fdb35273d.jpg","thumbnail_Mustafa_Badaroglu_8fdb35273d","thumbnail_Mustafa Badaroglu.jpg",6.06,"Mustafa_Badaroglu_8fdb35273d",9.34,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Mustafa_Badaroglu_8fdb35273d.jpg","2025-10-07T13:07:58.865Z",[],"-123",{"id":849,"name":1942,"committee":13,"position":13,"affiliation":1943,"email":13,"biography":76,"createdAt":1944,"updatedAt":1944,"url_path_id":1945,"contactPhoto":1946,"socialLinks":1958,"url_path":1959},"Seungwon Kim","Cadence, USA","2025-10-07T13:08:58.357Z","172",{"id":546,"name":1947,"alternativeText":13,"caption":13,"width":1735,"height":1735,"formats":1948,"hash":1954,"ext":954,"mime":957,"size":1955,"url":1956,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1957,"updatedAt":1957},"Seungwon Kim.jpg",{"thumbnail":1949},{"ext":954,"url":1950,"hash":1951,"mime":957,"name":1952,"path":13,"size":1953,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Seungwon_Kim_536f125373.jpg","thumbnail_Seungwon_Kim_536f125373","thumbnail_Seungwon Kim.jpg",3.54,"Seungwon_Kim_536f125373",5.08,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Seungwon_Kim_536f125373.jpg","2025-10-07T13:08:55.703Z",[],"-124","-108",{"id":373,"session":1962},{"id":373,"title":1963,"teaser":1964,"body":1965,"createdAt":1966,"updatedAt":1967,"publishedAt":1968,"url_path_id":1969,"contacts":1970,"url_path":2073},"Foundation Models and EDA","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:rgb(16,121,168);\">\u003Cstrong>Thursday | October 30, 2025 |&nbsp;8:00 - 11:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"text-align:justify;\">The rapid advancement of foundation models has brought powerful new capabilities to Electronic Design Automation (EDA). Unlike traditional task-specific Artificial Intelligence (AI) approaches, foundation models leverage self-supervised learning and large-scale data pre-training to acquire strong generalization abilities. These models can then be efficiently fine-tuned on EDA-specific datasets, enabling a wide range of downstream applications such as hardware code generation, debug and optimization, EDA agents, circuit representation learning and understanding, etc.\u003C/p>\u003Cp style=\"text-align:justify;\">This workshop aims to foster collaboration among researchers, engineers, and industry experts to explore the evolving intersection of foundation models and EDA methodologies. By identifying key challenges and exchanging ideas, we seek to inspire comparative analysis between the unique demands of EDA and those of other application domains, and to promote novel solutions that leverage the strengths of foundation models for more accurate, efficient, and scalable design automation. Through talks, paper presentations, and interactive discussions, the workshop will showcase recent progress and explore new ways to apply foundation models in EDA—helping to drive innovation and advance the future of intelligent circuit design.\u003C/p>\u003Cdiv class=\"raw-html-embed\">\u003Cdiv class=\"not-prose pt-6 flex justify-center\">\n    \u003Ca href=\"https://sites.google.com/view/iccad-workshop-2025/home\" rel=\"noopener\" target=\"_blank\" class=\"btn-primary text-white btn-sm btn last:!mr-0 gap-3\">\n        \u003Cspan>Learn More\u003C/span>\n        \u003Csvg xmlns=\"https://sites.google.com/view/iccad-workshop-2025/home\" viewBox=\"0 0 24 24\" fill=\"currentColor\" aria-hidden=\"true\" class=\"h-5 w-5\">\n            \u003Cpath fill-rule=\"evenodd\" d=\"M16.28 11.47a.75.75 0 010 1.06l-7.5 7.5a.75.75 0 01-1.06-1.06L14.69 12 7.72 5.03a.75.75 0 011.06-1.06l7.5 7.5z\" clip-rule=\"evenodd\">\u003C/path>\n        \u003C/svg>\n    \u003C/a>\n\u003C/div>\u003C/div>","\u003Cp>Schedule:\u003C/p>\u003Cp>8:30 am – 8:40 am\u003Cbr>Welcome and Introduction (Qiang Xu / Guohao Dai)\u003C/p>\u003Cp>\u003Cbr>8:40 am – 9:10 am\u003Cbr>Deming Chen, University of Illinois at Urbana-Champaign\u003Cbr>Title: Proof2Silicon: Prompt Repair for Verified Code and Hardware Generation via LLMs\u003C/p>\u003Cp>\u003Cbr>9:10 am – 9:40 am\u003Cbr>Igor L. Markov, Synopsys\u003Cbr>Title: Navigating Current Limitations to AI Technologies when Designing EDA Products\u003C/p>\u003Cp>\u003Cbr>9:40 am – 10:00 am\u003Cbr>Coffee Break\u003C/p>\u003Cp>\u003Cbr>10:00 am – 10:30 am\u003Cbr>Bing Li, University of Siegen\u003Cbr>Title: LLM-Assisted Testbench and Circuit Generation\u003C/p>\u003Cp>\u003Cbr>10:30 am – 11:00 am\u003Cbr>Qi Sun, Zhejiang University\u003Cbr>Title: FabGPT for Smart IC Manufacturing: Overcoming Challenges in Data,\u003Cbr>Multimodality, and Deployment\u003C/p>\u003Cp>\u003Cbr>11:00 am – 11:30 am\u003Cbr>Zhengyuan Shi, The Chinese University of Hong Kong\u003Cbr>Title: Beyond LLMs: Making Foundation Model Understand Circuit\u003C/p>\u003Cp>Organizers:&nbsp;\u003C/p>\u003Cul>\u003Cli>Guohao Dai, Shanghai Jiao Tong University\u003C/li>\u003Cli>Qiang Xu, Chinese University of Hong Kong\u003Cbr>&nbsp;\u003C/li>\u003C/ul>","2025-08-28T12:45:48.790Z","2025-10-26T12:03:59.853Z","2025-08-28T12:45:50.561Z","154",[1971,1995,2015,2036,2062],{"id":69,"name":1972,"committee":1973,"position":13,"affiliation":1974,"email":13,"biography":1975,"createdAt":1976,"updatedAt":1977,"url_path_id":1978,"contactPhoto":1979,"socialLinks":1993,"url_path":1994},"Deming Chen","Program Chair","University of Illinois","\u003Cp style=\"text-align:justify;\">Dr. Deming Chen obtained his BS in computer science from University of Pittsburgh, Pennsylvania in 1995, and his MS and PhD in computer science from University of California at Los Angeles in 2001 and 2005 respectively. He worked as a software engineer between 1995-1999 and 2001-2002. He joined the ECE department of University of Illinois at Urbana-Champaign in 2005 and has been a full professor in the same department since 2015. He is a research professor in the Coordinated Science Laboratory and an affiliate professor in the CS department. His current research interests include reconfigurable computing, cloud computing, system-level and high-level synthesis, machine learning and IoT, and hardware security. He has given more than 150 invited talks sharing these research results worldwide.\u003C/p>\u003Cp style=\"text-align:justify;\">Dr. Chen has been a technical committee member for a series of top conferences and symposia on EDA, FPGA, low-power design, and embedded systems design. He has also served as General or TPC Chair, Track Chair, Session Chair, Panelist, Panel Organizer, or Moderator for many of these conferences. He has been an associated editor for IEEE TCAD, ACM TODAES, IEEE TVLSI, ACM TRETS, IEEE TCAS-I and TCAS-II, IEEE Design &amp; Test, IET Cyber-Physical Systems, JCSC, and JOLPE. He obtained the Achievement Award for Excellent Teamwork from Aplus Design Technologies in 2001, the Arnold O. Beckman Research Award from UIUC in 2007, the NSF CAREER Award in 2008, ten Best Paper Awards, a TCFPGA Hall-of-Fame paper award, and a few Best Poster Awards. He also received the ACM SIGDA Outstanding New Faculty Award in 2010, IBM Faculty Award in 2014 and 2015, and Google Faculty Award in 2020. In 2017 and 2019 respectively, he led a team to win the First Place Winner Award of DAC International System Design Contest. He is the Donald Willett Faculty Scholar and the Abel Bliss Professor of the Grainger College of Engineering, an IEEE Fellow, an ACM Distinguished Speaker, and the Editor-in-Chief of ACM Transactions on Reconfigurable Technology and Systems (TRETS). He is the Director of the AMD-Xilinx Center of Excellence and the Hybrid Cloud Thrust Co-lead in the IBM-Illinois Discovery Accelerator Institute. He has given a series of Keynote or Plenary speeches at various conferences. He is also included in the List of Teachers Ranked as Excellent in 2008 and 2017 from UIUC.\u003C/p>\u003Cp style=\"text-align:justify;\">Dr. Chen was involved in several startup companies. He implemented his published algorithm on CPLD technology mapping when he was a software engineer in Aplus Design Technologies, Inc. in 2001, and the software was exclusively licensed by Altera (now part of Intel) and distributed to many customers of Altera worldwide. He is one of the inventors of the xPilot High Level Synthesis package developed at UCLA, which was licensed to AutoESL Design Technologies, Inc. Aplus was acquired by Magma in 2003, and AutoESL was acquired by Xilinx in 2011. In 2016, he co-founded a new startup, Inspirit IoT, Inc.\u003C/p>","2025-01-03T07:42:52.051Z","2025-01-03T13:36:17.908Z","45",{"id":603,"name":1980,"alternativeText":13,"caption":13,"width":1981,"height":1982,"formats":1983,"hash":1989,"ext":22,"mime":25,"size":1990,"url":1991,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1992,"updatedAt":1992},"DemingChen.png",256,251,{"thumbnail":1984},{"ext":22,"url":1985,"hash":1986,"mime":25,"name":1987,"path":13,"size":1988,"width":1168,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Deming_Chen_7b240cc0a0.png","thumbnail_Deming_Chen_7b240cc0a0","thumbnail_DemingChen.png",55.02,"Deming_Chen_7b240cc0a0",25.3,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Deming_Chen_7b240cc0a0.png","2025-01-03T07:46:48.798Z",[],"-22",{"id":143,"name":1996,"committee":13,"position":13,"affiliation":1997,"email":13,"biography":76,"createdAt":1998,"updatedAt":1998,"url_path_id":1999,"contactPhoto":2000,"socialLinks":2013,"url_path":2014},"Igor Markov","Synopsys ","2025-08-28T12:28:57.207Z","144",{"id":2001,"name":2002,"alternativeText":13,"caption":13,"width":1735,"height":1735,"formats":2003,"hash":2009,"ext":954,"mime":957,"size":2010,"url":2011,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":2012,"updatedAt":2012},97,"Igor Markov.jpg",{"thumbnail":2004},{"ext":954,"url":2005,"hash":2006,"mime":957,"name":2007,"path":13,"size":2008,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Igor_Markov_22e19ad692.jpg","thumbnail_Igor_Markov_22e19ad692","thumbnail_Igor Markov.jpg",8.04,"Igor_Markov_22e19ad692",12.6,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Igor_Markov_22e19ad692.jpg","2025-08-28T12:28:55.087Z",[],"-99",{"id":2016,"name":2017,"committee":13,"position":13,"affiliation":2018,"email":13,"biography":76,"createdAt":2019,"updatedAt":2019,"url_path_id":2020,"contactPhoto":2021,"socialLinks":2034,"url_path":2035},47,"Guohao Dai","Shanghai Jiao Tong University","2025-08-28T12:32:37.615Z","145",{"id":2022,"name":2023,"alternativeText":13,"caption":13,"width":49,"height":49,"formats":2024,"hash":2030,"ext":954,"mime":957,"size":2031,"url":2032,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":2033,"updatedAt":2033},98,"guohao Dai.jpg",{"thumbnail":2025},{"ext":954,"url":2026,"hash":2027,"mime":957,"name":2028,"path":13,"size":2029,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_guohao_Dai_0bb07da55a.jpg","thumbnail_guohao_Dai_0bb07da55a","thumbnail_guohao Dai.jpg",4.64,"guohao_Dai_0bb07da55a",5.88,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/guohao_Dai_0bb07da55a.jpg","2025-08-28T12:32:35.130Z",[],"-100",{"id":2037,"name":2038,"committee":13,"position":13,"affiliation":2039,"email":13,"biography":76,"createdAt":2040,"updatedAt":2040,"url_path_id":2041,"contactPhoto":2042,"socialLinks":2060,"url_path":2061},48,"Siddharth Garg","NY University","2025-08-28T12:33:10.943Z","146",{"id":242,"name":2043,"alternativeText":13,"caption":13,"width":2044,"height":2044,"formats":2045,"hash":2056,"ext":954,"mime":957,"size":2057,"url":2058,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":2059,"updatedAt":2059},"Siddharth Garg.jpg",543,{"small":2046,"thumbnail":2051},{"ext":954,"url":2047,"hash":2048,"mime":957,"name":2049,"path":13,"size":2050,"width":35,"height":35},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/small_Siddharth_Garg_0cf7a4420d.jpg","small_Siddharth_Garg_0cf7a4420d","small_Siddharth Garg.jpg",25.1,{"ext":954,"url":2052,"hash":2053,"mime":957,"name":2054,"path":13,"size":2055,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Siddharth_Garg_0cf7a4420d.jpg","thumbnail_Siddharth_Garg_0cf7a4420d","thumbnail_Siddharth Garg.jpg",4.17,"Siddharth_Garg_0cf7a4420d",26.16,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Siddharth_Garg_0cf7a4420d.jpg","2025-08-28T12:33:08.558Z",[],"-101",{"id":992,"name":2063,"committee":13,"position":13,"affiliation":2064,"email":13,"biography":76,"createdAt":2065,"updatedAt":2065,"url_path_id":2066,"contactPhoto":2067,"socialLinks":2071,"url_path":2072},"Zhengyuan Shi","Chinese University of Hong Kong","2025-08-28T12:34:23.745Z","148",{"id":1860,"name":1861,"alternativeText":13,"caption":13,"width":1797,"height":1797,"formats":2068,"hash":1873,"ext":22,"mime":25,"size":1874,"url":1875,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":1876,"updatedAt":1876},{"small":2069,"thumbnail":2070},{"ext":22,"url":1864,"hash":1865,"mime":25,"name":1866,"path":13,"size":1867,"width":35,"height":35},{"ext":22,"url":1869,"hash":1870,"mime":25,"name":1871,"path":13,"size":1872,"width":50,"height":50},[],"-103","-109",{"id":320,"session":2075},{"id":320,"title":2076,"teaser":2077,"body":2078,"createdAt":2079,"updatedAt":2080,"publishedAt":2081,"url_path_id":2082,"contacts":2083,"url_path":2198},"Automotive Chiplet Platform: Solutions Enabled by Industry and Academic Collaboration","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:rgb(16,121,168);\">\u003Cstrong>Thursday | October 30, 2025 |&nbsp;13:00 - 16:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"margin-left:0in;text-align:justify;\">\u003Cspan style=\"color:black;\">Chiplet-based platform is a pragmatic solution to meet the automotive industry's growing demands for performance, longevity, and cost-efficiency. Such platforms enable modular, scalable integration of diverse processing units (like CPUs, GPUs, and AI accelerators) across different process nodes, improving design flexibility, yield, and reliability, which is critical in safety-driven environments. They also support thermal and power optimization, simplify long-term maintenance and supply chain challenges, and align well with emerging zonal E/E architectures. The purpose of the workshop is to outline the challenges and novel solutions to enable chiplet-based computing platform for automotive domain.\u003C/span>\u003C/p>","\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Organizers:\u003C/span>\u003C/p>\u003Cul>\u003Cli>\u003Cspan style=\"color:black;\">imec (\u003C/span>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https:/www.imec-int.com/csa__;!!A4F2R9G_pg!eBQVXci_NQ9FSzBXGcRnkp86RPa66-2J6wf7ykK2Tm0yIf4wiYQVEQtyIllMYqDlD4dDwlFD_iVN-IYJFi-Jx4BV5UXkyw$\">\u003Cspan style=\"color:rgb(0,120,215);\">https://www.imec-int.com/csa\u003C/span>\u003C/a>\u003Cspan style=\"color:black;\">)\u003C/span>\u003Cul>\u003Cli>\u003Cspan style=\"color:black;\">Vinay Kumar B. Y.\u003C/span>\u003C/li>\u003Cli>\u003Cspan style=\"color:black;\">Diksha Moolchandani\u003C/span>\u003C/li>\u003Cli>\u003Cspan style=\"color:black;\">Arindam Mallik\u003C/span>\u003C/li>\u003C/ul>\u003C/li>\u003C/ul>\u003Cp style=\"margin-left:0px;\">&nbsp;\u003Cspan style=\"color:black;\">Agenda:\u003C/span>\u003C/p>\u003Cfigure class=\"table\" style=\"width:495.9pt;\">\u003Ctable style=\"border-color:currentcolor;\">\u003Ctbody>\u003Ctr>\u003Ctd style=\"border:1pt solid rgb(191, 191, 191);padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">\u003Cstrong>Time\u003C/strong>\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom-style:solid;border-bottom-width:1pt;border-color:currentcolor;border-left-style:none;border-right-style:solid;border-right-width:1pt;border-top-style:solid;border-top-width:1pt;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">\u003Cstrong>Title\u003C/strong>\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom-style:solid;border-bottom-width:1pt;border-color:currentcolor;border-left-style:none;border-right-style:solid;border-right-width:1pt;border-top-style:solid;border-top-width:1pt;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">\u003Cstrong>Speaker\u003C/strong>\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left:1pt solid rgb(191, 191, 191);border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">13:00&nbsp;- 13:05\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Welcome\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Vinay Kumar B. Y. (imec)\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left:1pt solid rgb(191, 191, 191);border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">30mins\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">A Chiplet-Based Approach&nbsp;for the Automotive Sector\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Kurt Herremans&nbsp;(imec)\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left:1pt solid rgb(191, 191, 191);border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">30mins\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Chiplets for the Software-Defined Vehicle Era\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Éricles Sousa (Cadence)\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left:1pt solid rgb(191, 191, 191);border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">30mins\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Test and Reliability Challenges of Automotive Chiplets\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Mehdi B. Tahoori (KIT and imec)\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left:1pt solid rgb(191, 191, 191);border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">14:35-15:00\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">BREAK\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">&nbsp;\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left:1pt solid rgb(191, 191, 191);border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">30mins\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Tenstorrent Chiplet Strategy Automotive, Robotics, Data Center\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Frank Hansen (Tenstorrent)\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left:1pt solid rgb(191, 191, 191);border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">30mins\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">&nbsp;\u003C/td>\u003Ctd style=\"background-color:rgb(242, 242, 242);border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Todd Austin (University of Michigan)\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left:1pt solid rgb(191, 191, 191);border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:84.8pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">16:00-16:30\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:215.7pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Panel Discussion\u003C/span>\u003C/p>\u003C/td>\u003Ctd style=\"border-bottom:1pt solid rgb(191, 191, 191);border-left-color:currentcolor;border-left-style:none;border-right:1pt solid rgb(191, 191, 191);border-top-color:currentcolor;border-top-style:none;padding:0in 5.4pt;vertical-align:top;width:195.4pt;\">\u003Cp style=\"margin-left:0in;\">\u003Cspan style=\"color:black;\">Speakers\u003C/span>\u003C/p>\u003C/td>\u003C/tr>\u003C/tbody>\u003C/table>\u003C/figure>","2025-08-28T12:46:53.792Z","2025-10-30T07:46:34.944Z","2025-08-28T12:46:58.299Z","155",[2084,2107,2130,2153,2175],{"id":1402,"name":2085,"committee":13,"position":13,"affiliation":1492,"email":13,"biography":2086,"createdAt":2087,"updatedAt":2088,"url_path_id":2089,"contactPhoto":2090,"socialLinks":2105,"url_path":2106},"Kurt Herremans","\u003Cp style=\"text-align:justify;\">Kurt Herremans is program director automotive at imec. Kurt is a key driver behind the imec industry call out for Automotive Chiplets and initialization of a pre-competitive research program on them. Prior to joining imec Kurt was principal engineer at Intel working on multiple generations of automotive SoCs and segment specific AI accelerators. For his work on Automotive SoC designs &nbsp;Kurt received the Intel Achievement Award in 2019.\u003C/p>\u003Cp style=\"text-align:justify;\">Kurt Herremans holds a Master of Science degree from the University UCLL Leuven.\u003C/p>","2025-10-26T09:44:00.692Z","2025-10-26T09:44:06.918Z","193",{"id":913,"name":2091,"alternativeText":13,"caption":13,"width":2092,"height":2093,"formats":2094,"hash":2101,"ext":22,"mime":25,"size":2102,"url":2103,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":2104,"updatedAt":2104},"Screenshot 2025-10-26 104226.png",482,486,{"thumbnail":2095},{"ext":22,"url":2096,"hash":2097,"mime":25,"name":2098,"path":13,"size":2099,"width":2100,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Screenshot_2025_10_26_104226_38260d0271.png","thumbnail_Screenshot_2025_10_26_104226_38260d0271","thumbnail_Screenshot 2025-10-26 104226.png",50.44,155,"Screenshot_2025_10_26_104226_38260d0271",120.1,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Screenshot_2025_10_26_104226_38260d0271.png","2025-10-26T09:43:50.490Z",[],"-144",{"id":1117,"name":2108,"committee":13,"position":13,"affiliation":2109,"email":13,"biography":2110,"createdAt":2111,"updatedAt":2111,"url_path_id":2112,"contactPhoto":2113,"socialLinks":2128,"url_path":2129},"Mehdi B. Tahoori","Karlsruhe Institute of Technology (KIT)","\u003Cp style=\"text-align:justify;\">Mehdi B. Tahoori is Professor and Chair of Dependable Nano-Computing at Karlsruhe Institute of Technology (KIT), Germany, and a program director at imec, where he focuses on CMOS 2.0 and the future of chip design and manufacturing technologies. Previously, he worked at Xilinx Inc. and Fujitsu Laboratories in Silicon Valley and served as a junior professor at Northeastern University in Boston, MA. In 2015, he was a visiting professor at the VLSI Design and Education Center (VDEC) at the University of Tokyo, Japan. He received his B.S. in Computer Engineering from Sharif University of Technology, Tehran, Iran, in 2000, and his M.S. and Ph.D. in Electrical Engineering from Stanford University in 2002 and 2003, respectively. Currently, he is the deputy editor-in-chief of IEEE Design and Test Magazine and was the former editor-in-chief of Elsevier Microelectronic Reliability. He has served as the program and general chair of the IEEE VLSI Test Symposium (VTS) and the General Chair of the IEEE European Test Symposium (ETS). Prof. Tahoori is a recipient of the US National Science Foundation Early Faculty Development (CAREER) Award in 2008 and the European Research Council (ERC) Advanced Grant in 2022, along with multiple best paper nominations and awards at various conferences and journals. He is also the chair of the IEEE European Test Technologies Technical Council (eTTTC) and is a Fellow of the IEEE.\u003C/p>","2025-10-26T09:45:11.355Z","194",{"id":2114,"name":2115,"alternativeText":13,"caption":13,"width":1015,"height":2116,"formats":2117,"hash":2124,"ext":22,"mime":25,"size":2125,"url":2126,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":2127,"updatedAt":2127},141,"Screenshot 2025-10-26 104441.png",421,{"thumbnail":2118},{"ext":22,"url":2119,"hash":2120,"mime":25,"name":2121,"path":13,"size":2122,"width":2123,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Screenshot_2025_10_26_104441_8d4369648f.png","thumbnail_Screenshot_2025_10_26_104441_8d4369648f","thumbnail_Screenshot 2025-10-26 104441.png",43.07,162,"Screenshot_2025_10_26_104441_8d4369648f",58.01,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Screenshot_2025_10_26_104441_8d4369648f.png","2025-10-26T09:44:59.514Z",[],"-145",{"id":1165,"name":2131,"committee":13,"position":13,"affiliation":2132,"email":13,"biography":2133,"createdAt":2134,"updatedAt":2134,"url_path_id":2135,"contactPhoto":2136,"socialLinks":2151,"url_path":2152},"ÉRICLES SOUSA","Cadence Design Systems","\u003Cp style=\"text-align:justify;\">Ericles Sousa holds a PhD in Electrical Engineering from FAU Erlangen-Nürnberg, Germany. He is an expert in SoC architecture, chiplet technology, and automotive computing. He is currently serving as Co-Chair of the UCIe Automotive Working Group. At Cadence, he specializes in automotive SoC architectures, focusing on real-time computing, safety, low-power systems, and scalable solutions based on chiplets. Dr. Sousa will share insights into UCIe integration and its impact on next-generation automotive computing.\u003C/p>","2025-10-26T09:46:11.482Z","195",{"id":1180,"name":2137,"alternativeText":13,"caption":13,"width":2138,"height":2139,"formats":2140,"hash":2147,"ext":22,"mime":25,"size":2148,"url":2149,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":2150,"updatedAt":2150},"Screenshot 2025-10-26 104538.png",493,447,{"thumbnail":2141},{"ext":22,"url":2142,"hash":2143,"mime":25,"name":2144,"path":13,"size":2145,"width":2146,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Screenshot_2025_10_26_104538_1111fa05b6.png","thumbnail_Screenshot_2025_10_26_104538_1111fa05b6","thumbnail_Screenshot 2025-10-26 104538.png",46.46,172,"Screenshot_2025_10_26_104538_1111fa05b6",69.23,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Screenshot_2025_10_26_104538_1111fa05b6.png","2025-10-26T09:45:58.009Z",[],"-146",{"id":1203,"name":2154,"committee":13,"position":13,"affiliation":2155,"email":13,"biography":2156,"createdAt":2157,"updatedAt":2157,"url_path_id":2158,"contactPhoto":2159,"socialLinks":2173,"url_path":2174},"Todd Austin","University of Michigan in Ann Arbor","\u003Cp style=\"text-align:justify;\">Todd Austin is a Professor of Electrical Engineering and Computer Science at the University of Michigan in Ann Arbor. His research interests include computer architecture, robust and secure system design, hardware and software verification, and performance analysis tools and techniques. From 2012-2017, Todd was the director of C-FAR, the Center for Future Architectures Research, a multi-university SRC/DARPA funded center that was seeking technologies to scale the performance and efficiency of future computing systems. Prior to joining academia, Todd was a Senior Computer Architect in Intel's Microcomputer Research Labs, a product-oriented research laboratory in Hillsboro, Oregon. Todd is the first to take credit (but the last to accept blame) for creating the SimpleScalar Tool Set, a popular collection of computer architecture performance analysis tools. Todd is co-author (with Andrew Tanenbaum of Vrije Universiteit) of the undergraduate computer architecture textbook, \"Structured Computer Architecture, 6th Ed.\" In addition to his work in academia, Todd is founder of SimpleScalar LLC, and co-founder of Agita Labs Inc. and InTempo Design LLC. In 2002, Todd was a Sloan Research Fellow, and in 2007 he received the ACM Maurice Wilkes Award for \"innovative contributions in Computer Architecture including the SimpleScalar Toolkit and the DIVA and Razor architectures.\" Todd is an IEEE Fellow, and he received his PhD in Computer Science from the University of Wisconsin in 1996.\u003C/p>","2025-10-30T07:39:50.720Z","200",{"id":2160,"name":2161,"alternativeText":13,"caption":13,"width":2162,"height":2162,"formats":2163,"hash":2169,"ext":22,"mime":25,"size":2170,"url":2171,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":2172,"updatedAt":2172},145,"Screenshot 2025-10-30 083904.png",392,{"thumbnail":2164},{"ext":22,"url":2165,"hash":2166,"mime":25,"name":2167,"path":13,"size":2168,"width":50,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Screenshot_2025_10_30_083904_7f67ea6fa8.png","thumbnail_Screenshot_2025_10_30_083904_7f67ea6fa8","thumbnail_Screenshot 2025-10-30 083904.png",58.19,"Screenshot_2025_10_30_083904_7f67ea6fa8",69.92,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Screenshot_2025_10_30_083904_7f67ea6fa8.png","2025-10-30T07:39:33.168Z",[],"-151",{"id":1559,"name":2176,"committee":13,"position":13,"affiliation":2177,"email":13,"biography":2178,"createdAt":2179,"updatedAt":2179,"url_path_id":2180,"contactPhoto":2181,"socialLinks":2196,"url_path":2197},"Frank Hansen","EMEA","\u003Cp>Frank is a Semiconductor Veteran. In Electronics since 1992 with Key Assignments in Altera, Avnet and Untether AI. With Tenstorrent since May 2024 with a strong focus on Robotics and Automotive Business Development for EMEA\u003C/p>","2025-10-30T07:42:15.722Z","201",{"id":2182,"name":2183,"alternativeText":13,"caption":13,"width":2184,"height":2185,"formats":2186,"hash":2192,"ext":22,"mime":25,"size":2193,"url":2194,"previewUrl":13,"provider":54,"provider_metadata":13,"createdAt":2195,"updatedAt":2195},146,"Screenshot 2025-10-30 084127.png",402,398,{"thumbnail":2187},{"ext":22,"url":2188,"hash":2189,"mime":25,"name":2190,"path":13,"size":2191,"width":1720,"height":50},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/thumbnail_Screenshot_2025_10_30_084127_496f9da7e9.png","thumbnail_Screenshot_2025_10_30_084127_496f9da7e9","thumbnail_Screenshot 2025-10-30 084127.png",41.16,"Screenshot_2025_10_30_084127_496f9da7e9",55.15,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad25/Screenshot_2025_10_30_084127_496f9da7e9.png","2025-10-30T07:42:12.451Z",[],"-152","-110",{"data":2200,"meta":2201},{"id":250,"heading":355,"createdAt":360,"updatedAt":361,"publishedAt":362,"url_path_id":363,"url_path":366,"contentType":141},{},1778852556750]